Abstract: Embodiments of the invention provide hinging and latching hardware and arrangements for enclosures for electronic components. In one embodiment, first and second brackets can be secured to an enclosure frame on first and second sides, respectively, of a door opening. Both brackets can be configured to receive a hinge pin and engage a latching mechanism, such that the brackets can be hingedly secure the door to the enclosure and latch the closed with the door in at least two different orientations. In one embodiment, hinging and latching hardware for an enclosure can include a door wing configured to be secured to an enclosure door, and first and second frame wings configured to be secured to an enclosure frame on different sides of a door opening. The hardware can accordingly provide first and second hinging and latching configurations for the door, with the door in first and second orientations, respectively.

Abstract: Enclosures for electronic components and methods for manufacturing the same are shown. In one embodiment, the enclosure includes a first sidewall, a second sidewall, a third sidewall, and a fourth sidewall defining an interior space of the enclosure. A first mounting channel and a second mounting channel can be coupled to each one of the first sidewall, the second sidewall, the third sidewall, and the fourth sidewall. A side channel can be removably coupled to the first mounting channel and the second mounting channel. A mounting panel can be removably coupled to the side channel, the mounting panel providing a flat surface extending away from the side channel towards a sidewall opposite a sidewall nearest the side channel and adapted to support electronic components.

Abstract: A multi-door enclosure includes an enclosure body, a primary door having an actuator and a secondary door. An interlock member having a holding section extends between the primary door and the secondary door. As the primary door closes, the actuator contacts the interlock member to translate the interlock member towards the secondary door until the holding section engages the secondary door.

Abstract: Embodiments of the invention provide a thermal management unit including a housing, at least one fan, a plurality of thermoelectric modules, at least one heat sink assembly coupled to the plurality of thermoelectric modules, and controller providing power to the plurality of thermoelectric modules. The thermal management unit also includes a printed circuit board incorporating the plurality of thermoelectric modules and electrically connecting the plurality of thermoelectric modules to the controller. The printed circuit board separates an ambient side of the thermal management unit and an enclosure side of the thermal management unit.

Abstract: Embodiments of the invention provide enclosures for electronic components and methods for manufacturing the same. In one embodiment, the enclosure includes first and second sidewalls formed from a single elongated piece of sheet metal. The first sidewall, the second sidewall, a third sidewall, and a fourth sidewall define an interior space of the enclosure. At least one of the first and second sidewalls includes an edge region folded inwardly relative to the interior space to form a mounting channel. The enclosure further includes a backwall coupled with first edges of the sidewalls and a door hingedly coupled with a second edge of at least one of the sidewalls.

Abstract: An apparatus to interlock a multi-door enclosure includes an actuating member slidably mountable to the enclosure between a primary door and a secondary door. The actuating member includes a first end extendable through an opening in a door post between the primary door and the secondary door. The apparatus includes a latching member slidably mounted to the actuating member and extending over a second end of the actuating member to engage a portion of the secondary door.