Abstract: A spin coating apparatus, system, and/or method that increase the uniformity of a coating material on a substrate. The spin coating system may be specifically directed for use with polygonal shaped substrates. The spin coating system may include a process chamber within which the substrate is located, spinning on a chuck, during operation. The spin coating system may include gas injection ports that inject a gas into the process chamber so that the gas contacts the substrate along corner portions of its front surface. This injection of the gas increases pressure and prevents excessive build-up of the coating material that may otherwise occur when spin coating polygonal shaped substrates.

Abstract: A spin coating apparatus, system, and/or method that increase the uniformity of a coating material on a substrate. The spin coating system may be specifically directed for use with polygonal shaped substrates. The spin coating system may include a process chamber within which the substrate is located, spinning on a chuck, during operation. The spin coating system may include gas injection ports that inject a gas into the process chamber so that the gas contacts the substrate along corner portions of its front surface. This injection of the gas increases pressure and prevents excessive build-up of the coating material that may otherwise occur when spin coating polygonal shaped substrates.

Abstract: A reflow soldering apparatus, system, and method. The reflow soldering system may include a housing that is alterable between an open state and a closed state, the open state being used for loading and unloading of substrates and the closed state being used during operation. The system may also include a heating assembly located within the chamber and a cooling assembly that is spaced apart from the heating assembly. A support member may be included to support a substrate within the chamber. A first actuator unit may be operably coupled to either the heating and cooling assemblies jointly, or to the support member. Additionally, the system may include a control unit coupled to the first actuator unit to cause relative movement between the substrate and the heating and cooling assemblies. Thus, the substrate can move between the heating and cooling assemblies during the various stages of the reflow soldering process.

Abstract: A reflow soldering apparatus, system, and method. The reflow soldering system may include a housing that is alterable between an open state and a closed state, the open state being used for loading and unloading of substrates and the closed state being used during operation. The system may also include a heating assembly located within the chamber and a cooling assembly that is spaced apart from the heating assembly. A support member may be included to support a substrate within the chamber. A first actuator unit may be operably coupled to either the heating and cooling assemblies jointly, or to the support member. Additionally, the system may include a control unit coupled to the first actuator unit to cause relative movement between the substrate and the heating and cooling assemblies. Thus, the substrate can move between the heating and cooling assemblies during the various stages of the reflow soldering process.