Abstract: An in-situ current sensing apparatus for a plasma processing system has one or more sections defining a plasma channel, the plasma processing system configured to form a plasma in the plasma channel using a process gas. The in-situ current sensing apparatus includes an assembly including an electrically conductive housing coupled to a dielectric coating layer, wherein a surface of the dielectric coating layer is configured to physically contact at least one of the process gas or the plasma in the plasma channel. The in-situ current sensing apparatus also includes a current probe, inductively or electrically connected to the assembly, for sensing a capacitively-coupled current within the assembly caused by the formation of plasma in the plasma channel. The in-situ current-sensing apparatus further includes at least one dielectric break for electrically isolating the assembly from the one or more sections. The assembly may include an electrode embedded within the housing.

Abstract: A plasma apparatus of a plasma processing system is provided. The plasma apparatus defines a toroidal plasma channel and includes multiple end blocks defining respective portions of the toroidal plasma channel. Each end block includes an end-block tube constructed from a first electrically conductive material and a dielectric coating disposed on an interior surface of the end-block tube. The plasma apparatus also includes multiple mid-blocks defining respective portions of the toroidal plasma channel. Each mid-block includes at least one heat sink located adjacent to a substantially linear tube with a thermal interface disposed therebetween. The thermal interface is in physical communication with the tube and the at least one heat sink. The mid-block tube has a substantially uniform wall thickness and is constructed from a dielectric material. The at least one heat sink is constructed from a second electrically conductive material.

Abstract: A platform assembly for a trailer includes a first bracket and a platform. The first bracket is configured to be fixed to the trailer. The platform is coupled to the first bracket and rotatable about a lateral axis of the trailer when the first bracket is fixed to the trailer.

Abstract: A leadless chip carrier for RF power transistors or the like is disclosed which includes a body of insulating material having two major surfaces and side walls joining the major surfaces. In a first embodiment, a pattern of conductive pads is deposited on one major surface. A pattern of conductive contact areas is deposited on the other major surface and distributed interconnecting portions of conductive material are deposited to connect the pads to the respective contact areas. In a second embodiment, larger pads and contact areas are provided on a beryllia substrate to provide a leadless chip carrier for RF transistors capable of handling 8 watts. In a third embodiment, a single slot is made conductive to provide the distributed interconnecting portion for one terminal, while in a fourth embodiment, the slot is changed to a plurality of small, tungsten-filled through holes to provide a virtually hermetically sealed leadless chip carrier for RF power transistors.