Abstract: A method of making a printed circuit board from a laminate structure comprising an insulative laminate base, a layer of semi-cured adhesive material, a layer of electroless copper and an electroplating resist covering the surfaces in the negative of the image of the desired conductor configuration which comprises immersing said resist covered structure in an acid cleaning solution for cleaning said structure; immersing said laminate structure in an acidic copper electroplating solution and coupling an electrical source to said structure for electroplating acid copper onto the exposed portions of said electroless copper and retaining said structure in said solution for an interval sufficient to produce a plating of electroplated copper of a thickness in the range of 0.0005 to 0.