Patents by Inventor Joseph E. Geniac

Joseph E. Geniac has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ELECTRICAL CONNECTOR WITH TETHERED COVER
    Publication number: 20090163058
    Abstract: An electrical connector assembly includes a connector having a housing and a receptacle for mating with a mating connector. The assembly also includes a cover configured to attach to the housing, and a tether linking the housing to the cover. The tether includes a housing mount for installing the tether onto the housing, a cover mount for installing the tether onto the cover, and a link connecting the housing mount to the cover mount. The link is non-metallic.
    Type: Application
    Filed: December 18, 2008
    Publication date: June 25, 2009
    Inventors: Darrell Wayne Craig, Christine Anne Dooley, Joseph E. Geniac
  • Modular jack assembly with signal conditioning
    Patent number: 6872098
    Abstract: The invention discloses a modular jack assembly comprised of an outer housing and a plurality of modular jack subassemblies. The modular jack subassemblies are comprised of an elongate beam support having a plurality of modular jack contacts on both sides thereof. The contacts extend into printed circuit board contacts and extend to and beyond the side edges of the elongate beam platform, leaving the space above and below the printed circuit board contacts and the beam support free, to accommodate signal conditioning componentry. Two printed circuit board modules are mounted orthogonally to the side edges of the beam support and include signal conditioning components. The assemblies are insertable into the housing defining modular jacks in the outer housing.
    Type: Grant
    Filed: July 31, 2002
    Date of Patent: March 29, 2005
    Assignee: Tyco Electronics Corporation
    Inventors: Thomas Wojtacki, Kevin J. Peterson, Kurt T. Zarbock, Joseph E. Geniac, William J. Remaley, Michael G. Pacyga, Aurelio J. Gutierrez
  • Modular jack assembly with signal conditioning
    Publication number: 20030077941
    Abstract: The invention discloses a modular jack assembly comprised of an outer housing and a plurality of modular jack subassemblies. The modular jack subassemblies are comprised of an elongate beam support having a plurality of modular jack contacts on both sides thereof. The contacts extend into printed circuit board contacts and extend to and beyond the side edges of the elongate beam platform, leaving the space above and below the printed circuit board contacts and the beam support free, to accommodate signal conditioning componentry. Two printed circuit board modules are mounted orthogonally to the side edges of the beam support and include signal conditioning components. The assemblies are insertable into the housing defining modular jacks in the outer housing.
    Type: Application
    Filed: July 31, 2002
    Publication date: April 24, 2003
    Inventors: Thomas Wojtacki, Kevin J. Peterson, Kurt T. Zarbock, Joseph E. Geniac, William J. Remaley, Michael G. Pacyga, Aurelio J. Gutierrez
  • Modular jack assembly with signal conditioning
    Patent number: 6511348
    Abstract: The invention discloses a modular jack assembly comprised of an outer housing and a plurality of modular jack subassemblies. The modular jack subassemblies are comprised of an elongate beam support having a plurality of modular jack contacts on both sides thereof. The contacts extend into printed circuit board contacts and extend to and beyond the side edges of the elongate beam platform, leaving the space above and below the printed circuit board contacts and the beam support free, to accommodate signal conditioning componentry. Two printed circuit board modules are mounted orthogonally to the side edges of the beam support and include signal conditioning components. The assemblies are insertable into the housing defining modular jacks in the outer housing.
    Type: Grant
    Filed: October 19, 2001
    Date of Patent: January 28, 2003
    Assignee: Tyco Electronics Corporation
    Inventors: Thomas Wojtacki, Kevin J. Peterson, Kurt T. Zarbock, Joseph E. Geniac, William J. Remaley, Michael G. Pacyga