Abstract: A method includes conveying a cryptocurrency transaction to a peer-to-peer network, wherein said cryptocurrency transaction having encoded therein an email address and to convey goods or services embodied in an electronic form to the email address in response to receipt of said cryptocurrency transaction on said peer-to-peer network. The conveying of goods or services includes transmitting over the Internet in conformance with an email protocol. The goods or services includes event admission tickets, music recordings, video, text, game content, live event broadcast, software, encryption keys or passwords.

Abstract: A method includes conveying a cryptocurrency transaction to a peer-to-peer network, wherein said cryptocurrency transaction having encoded therein an email address and to convey goods or services embodied in an electronic form to the email address in response to receipt of said cryptocurrency transaction on said peer-to-peer network. The conveying of goods or services includes transmitting over the Internet in conformance with an email protocol. The goods or services includes event admission tickets, music recordings, video, text, game content, live event broadcast, software, encryption keys or passwords.

Abstract: Commerce systems based upon cryptocurrency based payment transactions made in a peer-to-peer network include an integrated delivery feature. Consumer users using special purpose cryptocurrency wallet modules of these systems automatically encode delivery information in a payment response conveyed to an e-commerce site along with a cryptocurrency payment and transmit these respectively to the payee and peer-to-peer network for validation. Receipt of such payment responses which include user shipping information stimulate retailer shipping administrative systems into action whereby goods and services are conveyed to a customer's address in view of the successful payment made in this fashion.

Abstract: A method includes conveying a cryptocurrency transaction to a peer-to-peer network, wherein said cryptocurrency transaction having encoded therein an email address and to convey goods or services embodied in an electronic form to the email address in response to receipt of said cryptocurrency transaction on said peer-to-peer network. The conveying of goods or services includes transmitting over the Internet in conformance with an email protocol. The goods or services includes event admission tickets, music recordings, video, text, game content, live event broadcast, software, encryption keys or passwords.

Abstract: The present invention provides an apparatus and method for providing hands-free operation of a device. A hands-free adapter is provided that communicates with a device and a headset. The hands-free adapter allows a user to use voice commands so that the user does not have to handle the device. The hands-free adapter receives voice commands from the headset and translates the voice commands to commands recognized by the device. The hands-free adapter also monitors the device to detect device events and provides notice of the events to the user via the headset.

Abstract: A method for polishing a semiconductor wafer includes providing a semiconductor wafer having topographical features and forming a dielectric layer on the semiconductor wafer to fill portions between the features. The dielectric layer is planarized across the entire semiconductor wafer for a first portion of a polishing process. The dielectric layer is polished for bulk removal of the dielectric layer for a remaining portion of the polishing process.

Abstract: A method for planarizing a dielectric layer on a semiconductor wafer while eliminating a mask and etch step, in accordance with the present invention includes providing a semiconductor wafer having trenches formed in a trench region of a substrate, and forming a dielectric layer on the semiconductor wafer to fill the trenches whereby up features form on flat surfaces of the wafer. An edge portion of the semiconductor wafer is polished to remove a portion of the dielectric layer about the edge portions of the semiconductor wafer. The dielectric layer is polished across the entire semiconductor wafer by employing a single non-stacked polishing pad and a slurry to planarize the trench regions and the up features in a single polish step such that a mask step and etch step for reducing the up features are eliminated from the polishing process.

Abstract: A chemical-mechanical-polishing (CMP) process in which a metal interconnect material (47) is polished to form a metal plug (48) includes the application of titanium to the surface of a polishing pad (14) of a polishing apparatus (10). Titanium metal is applied to the surface of the polishing pad (14) by either abrasively applying titanium by use of a titanium block (32) attached to a rotating disk (26), or by a titanium body (23, 25) integrated with a carrier ring (23). Alternatively, titanium can be applied by impregnating a felt layer (52) with titanium particles (56), or by adding titanium directly to the polishing slurry (50).