Abstract: A method and apparatus for clamping a semiconductor mask to a carrier device is taught. The apparatus is comprised of a base member to which is attached an elongated spring. Both the base and the spring have affixed to them a means for compressively contacting the mask surface when the mask is put in place. In the preferred embodiment, that contact means is made of sapphire shaped in the form of a dome. The clamp further includes an adjustment screw that can be used to adjust the height of the contact means affixed to the base member. In this manner, the surface of the mask can be adjusted so that it is planarized to the right orientation relative to an e-Beam or laser source that will be used to scribe a pattern on the mask. Finally, the clamp includes electrical contacts, and the materials out of which the clamp is made are deliberately selected, so that no electrical or magnetic forces can build up on the clamp or the wafer that might adversely affect the scribing process.

Abstract: A method and apparatus for clamping a semiconductor mask to a carrier device is taught. The apparatus is comprised of a base member to which is attached an elongated spring. Both the base and the spring have affixed to them a means for compressively contacting the mask surface when the mask is put in place. In the preferred embodiment, that contact means is made of sapphire shaped in the form of a dome. The clamp further includes an adjustment screw that can be used to adjust the height of the contact means affixed to the base member. In this manner, the surface of the mask can be adjusted so that it is planarized to the right orientation relative to an e-Beam or laser source that will be used to scribe a pattern on the mask. Finally, the clamp includes electrical contacts, and the materials out of which the clamp is made are deliberately selected, so that no electrical or magnetic forces can build up on the clamp or the wafer that might adversely affect the scribing process.