Abstract: A method for implementing at speed bit fail mapping of an embedded memory system having ABIST (Array Built In Self Testing), comprises using a high speed multiplied clock which is a multiple of an external clock of an external tester to sequence ABIST bit fail testing of the embedded memory system. Collect store fail data during ABIST testing of the embedded memory system. Perform a predetermined number of ABIST runs before issuing a bypass order substituting the external clock for the high speed multiplied clock. Use the external clock of the tester to read bit fail data out to the external tester.

Abstract: This invention involves the use of the JTAG functional test patterns and exercisors to solve the problem of diagnosing broken scan chains in either a serial or a lateral broadside insertion manner across all latch system ports and to analyze the response data efficiently for the purpose of readily identifying switching and non-switching latches with the next to last non-switching latch being the point of the break within a defective scan chain(s). This comprehensive latch perturbation, in conjunction with iterative diagnostic algorithms is used to identify and to pinpoint the defective location in such a broken scan chain(s). This JTAG Functional test function and the JTAG test patterns ultimately derived therefrom, can take on different forms and origins, some external to a product and some internal to a product.

Abstract: A method for implementing at speed bit fail mapping of an embedded memory system having ABIST (Array Built In Self Testing), comprises using a high speed multiplied clock which is a multiple of an external clock of an external tester to sequence ABIST bit fail testing of the embedded memory system. Collect store fail data during ABIST testing of the embedded memory system. Perform a predetermined number of ABIST runs before issuing a bypass order substituting the external clock for the high speed multiplied clock. Use the external clock of the tester to read bit fail data out to the external tester.

Abstract: This invention involves the use of the JTAG functional test patterns and exercisors to solve the problem of diagnosing broken scan chains in either a serial or a lateral broadside insertion manner across all latch system ports and to analyze the response data efficiently for the purpose of readily identifying switching and non-switching latches with the next to last non-switching latch being the point of the break within a defective scan chain(s). This comprehensive latch perturbation, in conjunction with iterative diagnostic algorithms is used to identify and to pinpoint the defective location in such a broken scan chain(s). This JTAG Functional test function and the JTAG test patterns ultimately derived therefrom, can take on different forms and origins, some external to a product and some internal to a product.

Abstract: A method of and system for testing multi clock domain devices at functional clock speed by aligning the Launching C2 clocks of the high speed and low speed domains, issuing a Cl->C2 clock in each domain, to at speed test all intra-domain paths and the low speed to high speed paths; aligning the capturing C1 clock edges of the high speed and low speed clocks; and issuing a C2->C1 clock in each domain, to test the high speed to low speed paths.

Abstract: The present invention relates to a test for current leakage of driver/receiver stages, and in particular for bi-directional input/output stages (10) of a semiconductor chip. Two dedicated support transistor devices (56, 58) are added into the prior art switching scheme, together with a simple control logic (48, 50, 52, 60, 62, 64) for selectively controlling the two dedicated support transistor devices according to a predetermined test scheme. An on-chip self-test feature provides valid voltage levels which are convertible by the receiver (24) to predictable logic states at the evaluation line RDATA. The test can be performed autonomously on the chip without the requirement for an external test device.

Abstract: The present invention relates to a method and system for full parametric testing of the drive and receive capability of bi-directional driver/receiver-stages, and in particular of bi-directional input/output-stages of a semiconductor chip. Electrical properties, as for example DC-resistance, AC-impedance of a driver stage are tested by at least one test load implemented on the chip itself which causes a characteristic voltage drop usable for test evaluation. Advantageously, the output stage devices of P-type (50, 52) and N-type (54, 56), respectively, are split into at least two sub-devices P1, P2 and N1, N2, and are controlled separately by a control logic (60, 62, 64, 70, 72, 74). Then, for example N2 is used for testing the P device, and P2 is used for testing the N-device. Thus, devices already present on the chip are re-used for test purposes, which makes off-chip testing unnecessary.

Abstract: The present invention relates to a test for current leakage of driver/receiver stages, and in particular for bi-directional input/output stages (10) of a semiconductor chip. Two dedicated support transistor devices (56, 58) are added into the prior art switching scheme, together with a simple control logic (48, 50, 52, 60, 62, 64) for selectively controlling the two dedicated support transistor devices according to a predetermined test scheme. An on-chip self-test feature provides valid voltage levels which are convertible by the receiver (24) to predictable logic states at the evaluation line RDATA. The test can be performed autonomously on the chip without the requirement for an external test device.

Abstract: The present invention relates to a method and system for full parametric testing of the drive and receive capability of bi-directional driver/receiver-stages, and in particular of bi-directional input/output-stages of a semiconductor chip. Electrical properties, as for example DC-resistance, AC-impedance of a driver stage are tested by at least one test load implemented on the chip itself which causes a characteristic voltage drop usable for test evaluation. Advantageously, the output stage devices of P-type(50, 52) and N-type(54,56), respectively, are split into at least two sub-devices P1, P2 and N1, N2, and are controlled separately by a control logic (60,62,64,70,72,74). Then, for example N2 is used for testing the P device, and P2 is used for testing the N-device. Thus, devices already present on the chip are re-used for test purposes, which makes off-chip testing unnecessary.