Abstract: A method is provided for the bonding of ceramics to metals for the production of semiconductor packages. The method includes forming a copper-copper oxide eutectic on a substantially planar copper shim. The shim and its copper-copper oxide eutectic are placed in contact with a ceramic layer and metal layer. The assembly, so formed, is then heated to a temperature at least equal to the melting point of the eutectic and no greater than the melting temperature of copper. Upon cooling of the eutectic, a bond forms bond the ceramic layer to the metal layer.

Abstract: A package for a backside-ground high power transistor comprises a metal base, a flat insulator layer on the base defining a window for receiving the transistor and a pair of flat metal layer bonded to the upper surface of the insulator layer, the flat metal layers serving as electrical leads for connection to the collector and drain of the transistor received therein. A method for bonding a ceramic to a metal is also provided by the present invention. The method comprises the steps of contacting eutectic-forming layers on a common shim structure with ceramics and metals, heating the eutectic-forming layers to a temperature that is greater than the melting temperature of the eutectic-forming layers, and allowing the eutectic-forming layers to solidify, thereby bonding the ceramic to the metal.

Abstract: A method of producing threaded fasteners, particularly screws characterized by a thread root which is substantially wider than the thread crest, which results in seam free threads. The method employs a rolling die with a novel double form thread profile geometry wherein the angle of divergence of the groove defining walls gradually varies between an obtuse pointing angle and an acute finish angle as the groove depth increases from a sorting depth to the finish depth. The finish form of the die is maintained for a length which is commensurate with at least two and one-half revolutions of the fastener which is being formed.

Abstract: A seamless helical thread is formed through the use of a die having a thread profile defining groove which undergoes a smooth transition from a pointed form at the starting end to a finish form. The transition occurs along the portion of the groove length where the groove depth is increasing. In the case of a typical machine screw with a 60.degree. finish form, the pointed form is approximately 98.degree..

Abstract: A cut-off style, roll thread flat die for use with a matched cut-off style, roll thread flat die to form a threaded, pointed fastener such as a gimlet point screw, the cut-off style, roll thread flat die having a top operating surface comprising body-threads, point threads, a slug traction ramp to provide controlled rotation for the cut-off slug and a slug extrusion taper to provide proper extrusion of the cut-off slug from the fastener, the slug traction ramp and the slug extrusion taper extending in side-by-side relation from a start location, past a transition location to a termination location, the slug traction ramp and the slug extrusion taper having a common edge and thereby being laterally continuous from the start location to the transition location, the slug extrusion taper forming an obtuse angle with the slug traction ramp from the start location to the transition location, the edge of the slug extrusion taper adjacent the slug traction ramp being substantially vertically spaced above the edge of

Abstract: A thin, direct bond copper ceramic substrate of high strength and good thermal conductivity and suitable for high temperature thick film processing is described. It comprises two outer layers of alumina of equal thickness and matching dimensions for bending stress equalization, and an inner copper core, itself formed of three component layers, bonded by a copper oxygen eutectic between the layers of alumina. The thickness of the copper core is held between one-tenth and one-third the thickness of the substrate. The laminated structure, which permits recycling for high temperature thick film processing, sustains stresses at working temperatures, strengthening the substrate, and provides high thermal conductivity for heat management in a high density environment.