Abstract: Solderable leads (22) of the type which project in parallel relationship from a continuous independent support rail (30) are rapidly and efficiently assembled to substrates (26) by simultaneously feeding a pair of the independent support rails (30) and their associated leads (22) to locate successive leading sets of leads (22) on opposite sides of a lead-substrate assembling position (36). In the assembling position outer portions of the leading sets of leads (22) are engaged to move the leads (22) in opposite directions toward a substrate (26), so as to cut the support rails (30) and thus sever the leading sets of leads (22) from the remaining leads (22) on the support rails (30). Continued movement of the severed sets of leads (22) then causes the leads (22) to be assembled to respective opposite sides of the substrate (26) simultaneously.

Abstract: Each lead frame in a continuous strip of lead frames is formed with opposed pairs of integral and subsequently removable aligning tabs for locating a substrate on the lead frame such that leads of the lead frame and respective terminals on the substrate are in alignment. The aligning tabs initially are formed in the plane of the lead frame and subsequently are bent out of the plane of the lead frame so as to project from the lead frame for the reception of the substrate therebetween. The substrate is placed between the projecting tabs in an inverted position with the terminals on the substrate resting on inner free end portions of the lead frame leads. The lead frame then supports the substrate for movement through a series of processing stations, including a lead-terminal bonding station and a tab-removal station, as the continuous strip of lead frames is indexed in successive steps from a continuous lead frame supply.