Abstract: Non-metallic deposits are selectively removed from aluminum containing substrates such as aluminum faceplates using a selective deposition removal (SDR) solution. The SDR solution does not substantially etch the faceplate holes, thereby preserving the hole diameter integrity and increasing the number of times the faceplate may be cleaned or refurbished while remaining within processing hole diameter tolerances. In an embodiment, the SDR solution comprises, in wt % of the solution, 15.5%+/?2% HF or buffered HF acid, 3.8%+/?0.5% NH4F pH buffer, 59.7%+/?5% ethylene glycol, and the balance H2O.

Abstract: A method of fabricating a component for a substrate processing chamber involves providing a preform having internal and external surfaces, and providing a mandrel having a textured surface with a pattern of textured features comprising protrusions and depressions. The internal surface of the preform component is contacted with the textured surface of mandrel, and a pressure is applied to the external surface of the preform. The pressure is sufficiently high to plastically deform the preform over the textured surface of the mandrel to form a component having a textured internal surface comprising the pattern of textured feature that are shaped and sized to adhere process residues generated in the processing of substrates.

Abstract: Process kit shields for use in a process chamber and methods of use thereof are provided herein. In some embodiments, the process kit shield may include a body having a wall comprising a first layer and a second layer bonded to the first layer, wherein the first layer comprises a first material resistant to a cleaning chemistry utilized to remove material disposed on the first layer during processing, and wherein the second layer comprises a second material different than the first material and having a coefficient of thermal expansion substantially similar to that of the first material. In some embodiments, the process kit shield may be disposed in a process chamber having a processing volume and a non-processing volume.