Patents by Inventor Joseph Francis Jacques

Joseph Francis Jacques has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Incorporating heat spreader to electronics enclosure for enhanced cooling
    Patent number: 11586259
    Abstract: A cooling system for a computing device includes an outer chassis of the computing device, a heat spreader, a heat bridge, and a heat dissipating structure. The outer chassis of the computing device is configured to support heat generating modules. The heat spreader is integrated into the outer chassis. The heat bridge couples the heat spreader to a corresponding heat generating module at a first location in the computing device. The heat dissipating structure is coupled to the heat spreader at a second location in the computing device. The second location is positioned in the computing device to experience higher airflow than the first location.
    Type: Grant
    Filed: April 20, 2021
    Date of Patent: February 21, 2023
    Assignee: CISCO TECHNOLOGY, INC.
    Inventors: Vic Hong Chia, Joseph Francis Jacques, John Scott Scheeler
  • INCORPORATING HEAT SPREADER TO ELECTRONICS ENCLOSURE FOR ENHANCED COOLING
    Publication number: 20220334624
    Abstract: A cooling system for a computing device includes an outer chassis of the computing device, a heat spreader, a heat bridge, and a heat dissipating structure. The outer chassis of the computing device is configured to support heat generating modules. The heat spreader is integrated into the outer chassis. The heat bridge couples the heat spreader to a corresponding heat generating module at a first location in the computing device. The heat dissipating structure is coupled to the heat spreader at a second location in the computing device. The second location is positioned in the computing device to experience higher airflow than the first location.
    Type: Application
    Filed: April 20, 2021
    Publication date: October 20, 2022
    Inventors: Vic Hong Chia, Joseph Francis Jacques, John Scott Scheeler