Patents by Inventor Joseph Frederick Sommers
Joseph Frederick Sommers has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20240158944Abstract: A method includes forming a porous ceramic coating on a component of a processing chamber. The method further includes applying a colloidal suspension to the porous ceramic coating to fill pores of the porous ceramic coating. The method further includes drying the component.Type: ApplicationFiled: November 13, 2023Publication date: May 16, 2024Inventors: Joseph Frederick Behnke, Joseph Frederick Sommers, Alexander Alhajj Sulyman
-
Patent number: 11920234Abstract: Described herein is a protective coating composition that provides erosion and corrosion resistance to a coated article (such as a chamber component) upon the article's exposure to harsh chemical environment (such as hydrogen based and/or halogen based environment) and/or upon the article's exposure to high energy plasma. Also described herein is a method of coating an article with the protective coating using electronic beam ion assisted deposition, physical vapor deposition, or plasma spray. Also described herein is a method of processing wafer, which method exhibits, on average, less than about 5 yttrium based particle defects per wafer.Type: GrantFiled: December 28, 2022Date of Patent: March 5, 2024Assignee: Applied Materials, Inc.Inventors: Vahid Firouzdor, Christopher Laurent Beaudry, Hyun-Ho Doh, Joseph Frederick Behnke, Joseph Frederick Sommers
-
Patent number: 11905583Abstract: Exemplary methods of cooling a semiconductor component substrate may include heating the semiconductor component substrate to a temperature of greater than or about 500° C. in a chamber. The semiconductor component substrate may be or include aluminum. The methods may include delivering a gas into the chamber. The gas may be characterized by a temperature below or about 100° C. The methods may include cooling the semiconductor component substrate to a temperature below or about 200° C. in a first time period of less than or about 1 minute.Type: GrantFiled: June 9, 2021Date of Patent: February 20, 2024Assignee: Applied Materials, Inc.Inventors: Joseph F. Behnke, Joseph Frederick Sommers, Sumit Agarwal
-
Publication number: 20230348290Abstract: Described herein is a plasma resistant protective coating composition and bulk composition that provides enhanced erosion and corrosion resistance upon the coating composition's or the bulk composition's exposure to harsh chemical environment (such as hydrogen based and/or halogen based chemistries) and/or upon the coating composition's or the bulk composition's exposure to high energy plasma. Also described herein is a method of coating an article with a plasma resistant protective coating using electronic beam ion assisted deposition, physical vapor deposition, or plasma spray. Also described herein is a method of processing wafer, which method exhibits a reduced number of yttrium based particles.Type: ApplicationFiled: June 30, 2023Publication date: November 2, 2023Inventors: Christopher Laurent Beaudry, Vahid Firouzdor, Joseph Frederick Sommers, Trevor Edward Wilantewicz, Hyun-Ho Doh, Joseph Frederick Behnke
-
Publication number: 20230323531Abstract: A method includes affixing a supply apparatus to inlets for one or more channels of a chamber component. The channels provide one or more gas flow paths between a first side of the chamber component that comprises the inlets and a second side of the chamber component comprising outlets of the one or more channels. The method further includes affixing an exhaust apparatus to the outlets of the one or more channels. The method further includes performing a plurality of atomic layer deposition cycles to deposit a corrosion resistant coating on interior surfaces of the one or more channels of the chamber component.Type: ApplicationFiled: December 27, 2022Publication date: October 12, 2023Inventors: Joseph Frederick Behnke, Carlaton Wong, Albert Barrett Hicks, III, Steven Darrell Marcus, Joseph Frederick Sommers, Christopher Laurent Beaudry, Timothy Joseph Franklin
-
Publication number: 20230234160Abstract: A method includes applying a bond layer of a first chemical composition to a first surface of a first metal body. The metal body is of a second chemical composition. The method further includes disposing a second metal body of the second chemical composition against the first metal body such that the bond layer is between the first surface of the first metal body and a second surface of the second metal body. The metal bodies are resistant to diffusion bonding. The bond layer facilitates diffusion bonding of the metal bodies. The method further includes heating the first metal body and the second metal body. The method further includes applying pressure to press the second metal body against the first metal body. The method further includes generating a diffusion bond between the metal bodies, responsive to the heating and the applying of pressure for a duration.Type: ApplicationFiled: January 20, 2023Publication date: July 27, 2023Inventors: Joseph Frederick Behnke, Joseph Frederick Sommers
-
Publication number: 20230187182Abstract: A method includes depositing a first layer of a first material onto a surface of a chamber component of a processing chamber. The first material comprises a polymer, the polymer having a dielectric strength of at least 40 MV/m. The method further includes depositing a second layer of a second material onto the first layer. The second material comprises a first ceramic material impregnated into the first polymer or a second polymer. The method further includes depositing a third layer. The third layer is of a third material. The third material includes the first ceramic material or a second ceramic material. The third material does not adhere to the first polymer or the second polymer. The third material does adhere to the first ceramic material or the second ceramic material of the second layer.Type: ApplicationFiled: December 10, 2021Publication date: June 15, 2023Inventors: Joseph Frederick Sommers, Joseph Frederick Behnke, Xue Yang Chang, Anwar Husain, Alexander Alhajj Sulyman, Timothy Joseph Franklin, David J. Coumou
-
Patent number: 11661650Abstract: Described herein is a protective coating composition that provides erosion and corrosion resistance to a coated article (such as a chamber component) upon the article's exposure to harsh chemical environment (such as hydrogen based and/or halogen based environment) and/or upon the article's exposure to high energy plasma. Also described herein is a method of coating an article with the protective coating using electronic beam ion assisted deposition, physical vapor deposition, or plasma spray. Also described herein is a method of processing wafer, which method exhibits, on average, less than about 5 yttrium based particle defects per wafer.Type: GrantFiled: April 10, 2020Date of Patent: May 30, 2023Assignee: Applied Materials, Inc.Inventors: Vahid Firouzdor, Christopher Laurent Beaudry, Hyun-Ho Doh, Joseph Frederick Behnke, Joseph Frederick Sommers
-
Publication number: 20230160055Abstract: Described herein is a protective coating composition that provides erosion and corrosion resistance to a coated article (such as a chamber component) upon the article's exposure to harsh chemical environment (such as hydrogen based and/or halogen based environment) and/or upon the article's exposure to high energy plasma. Also described herein is a method of coating an article with the protective coating using electronic beam ion assisted deposition, physical vapor deposition, or plasma spray. Also described herein is a method of processing wafer, which method exhibits, on average, less than about 5 yttrium based particle defects per wafer.Type: ApplicationFiled: December 28, 2022Publication date: May 25, 2023Inventors: Vahid Firouzdor, Christopher Laurent Beaudry, Hyun-Ho Doh, Joseph Frederick Behnke, Joseph Frederick Sommers
-
Publication number: 20220396857Abstract: Exemplary methods of cooling a semiconductor component substrate may include heating the semiconductor component substrate to a temperature of greater than or about 500° C. in a chamber. The semiconductor component substrate may be or include aluminum. The methods may include delivering a gas into the chamber. The gas may be characterized by a temperature below or about 100° C. The methods may include cooling the semiconductor component substrate to a temperature below or about 200° C. in a first time period of less than or about 1 minute.Type: ApplicationFiled: June 9, 2021Publication date: December 15, 2022Applicant: Applied Materials, Inc.Inventors: Joseph F. Behnke, Joseph Frederick Sommers, Sumit Agarwal
-
Publication number: 20210403337Abstract: Described herein is a plasma resistant protective coating composition and bulk composition that provides enhanced erosion and corrosion resistance upon the coating composition's or the bulk composition's exposure to harsh chemical environment (such as hydrogen based and/or halogen based chemistries) and/or upon the coating composition's or the bulk composition's exposure to high energy plasma. Also described herein is a method of coating an article with a plasma resistant protective coating using electronic beam ion assisted deposition, physical vapor deposition, or plasma spray. Also described herein is a method of processing wafer, which method exhibits a reduced number of yttrium based particles.Type: ApplicationFiled: June 25, 2021Publication date: December 30, 2021Inventors: Christopher Laurent Beaudry, Vahid Firouzdor, Joseph Frederick Sommers, Trevor Edward Wilantewicz, Hyun-Ho Doh, Joseph Frederick Behnke
-
Publication number: 20210317564Abstract: Described herein is a protective coating composition that provides erosion and corrosion resistance to a coated article (such as a chamber component) upon the article's exposure to harsh chemical environment (such as hydrogen based and/or halogen based environment) and/or upon the article's exposure to high energy plasma. Also described herein is a method of coating an article with the protective coating using electronic beam ion assisted deposition, physical vapor deposition, or plasma spray. Also described herein is a method of processing wafer, which method exhibits, on average, less than about 5 yttrium based particle defects per wafer.Type: ApplicationFiled: April 10, 2020Publication date: October 14, 2021Inventors: Vahid Firouzdor, Christopher Laurent Beaudry, Hyun-Ho Doh, Joseph Frederick Behnke, Joseph Frederick Sommers
-
Patent number: 10276340Abstract: A system for implanting ions into a workpiece while minimizing the generation of particles is disclosed. The system includes an ion source having an extraction plate with an extraction aperture. The extraction plate is electrically biased and may also be coated with a dielectric material. The workpiece is disposed on a platen and surrounded by an electrically biased shield. The shield may also be coated with a dielectric material. In operation, a pulsed DC voltage is applied to the shield and the platen, and ions are attracted from the ion source during this pulse. Since a pulsed voltage is used, the impedance of the thin dielectric coating is reduced, allowing the system to function properly.Type: GrantFiled: December 20, 2017Date of Patent: April 30, 2019Assignee: Varian Semiconductor Equipment Associates, Inc.Inventors: Morgan D. Evans, Ernest E. Allen, Jr., Tyler Burton Rockwell, Richard J. Hertel, Joseph Frederick Sommers, Christopher R. Campbell