Abstract: Light emitting diodes mounted on a tri-layer laminate with an electrically insulating middle layer sandwiched between two metallic aluminum layers. The upper aluminum layer serves as a heat sink by facilitating dissipation of heat from the light emitting diodes quicker than traditional printed circuit boards. Furthermore, fins and thermal interface material may be mounted on the backside of the laminate for added cooling.

Abstract: The present invention provides an improved method of resistance welding comprising the steps of contacting a metal sheet with an electrode having an initial contact surface area at a force to provide a pressure to the metal sheet; applying a current through the electrode to the metal sheet; measuring dimensional changes of the electrode; correlating dimensional changes in the electrode to changes in the initial contact surface area; and adjusting the force to compensate for the changes in the initial contact surface area of the electrode to maintain pressure to the metal sheet. The force may be adjusted by stepping the force to maintain pressure to the faying surface of the metal sheet to be welded. By maintaining the pressure at the faying surface the life cycle of the electrodes may be increased without forming discrepant welds. The current may also be stepped to further extend electrode life.

Abstract: The present invention provides an electronics case including a housing having at least one sidewall having an air passage, wherein the air passage includes an intake and an exhaust; a heat producing structure contained by the housing; and at least one heat pipe in conductive communication with the heat producing structure and the sidewalls having the air passage. The air passage within the sidewall produces a chimney effect that vents heated air from the housing. The chimney effect may be produced by a sidewall having a fluted sidewall.