Patents by Inventor Joseph G. Clark

Joseph G. Clark has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190355701
    Abstract: Light emitting diode (LED) devices and methods. An example apparatus can include a substrate, one or more LEDs, light-transmissive encapsulation material, and a reflective material covering a portion of the encapsulation material to form a defined opening. The opening allows light emitted from an LED to pass through in a prescribed manner. In some embodiments, the apparatus can be subsequently treated to modify the surface having the opening. In other embodiments, the reflective material can be disposed on a lateral surface of the encapsulation material to reflect light in a desired direction.
    Type: Application
    Filed: July 29, 2019
    Publication date: November 21, 2019
    Inventors: Troy Gould, Colin Kelly Blakely, Jesse Colin Reiherzer, Joseph G. Clark
  • Patent number: 10439112
    Abstract: Light emitter packages, systems, and methods having improved performance are disclosed. In one aspect, a light emitter package can include a submount that can include an anode and a cathode. A light emitter chip can be disposed over the submount such that the light emitter chip is mounted over at least a portion of the cathode and wirebonded to at least a portion of the anode.
    Type: Grant
    Filed: July 20, 2012
    Date of Patent: October 8, 2019
    Assignee: Cree, Inc.
    Inventors: Joseph G. Clark, Jeffrey Carl Britt, Amber C. Abare, Raymond Rosado, Harsh Sundani, David T. Emerson, Jeremy Scott Nevins
  • Patent number: 10410997
    Abstract: Light emitting diode (LED) devices and methods. An example apparatus can include a substrate, one or more LEDs, light-transmissive encapsulation material, and a reflective material covering a portion of the encapsulation material to form a defined opening. The opening allows light emitted from an LED to pass through in a prescribed manner. In some embodiments, the apparatus can be subsequently treated to modify the surface having the opening. In other embodiments, the reflective material can be disposed on a lateral surface of the encapsulation material to reflect light in a desired direction.
    Type: Grant
    Filed: May 11, 2017
    Date of Patent: September 10, 2019
    Assignee: Cree, Inc.
    Inventors: Troy Gould, Colin Kelly Blakely, Jesse Colin Reiherzer, Joseph G. Clark
  • Publication number: 20190273070
    Abstract: At least one array of LEDs (e.g., in a flip chip configuration) is supported by a substrate having a light extraction surface overlaid with at least one lumiphoric material. Light segregation elements registered with gaps between LEDs are configured to reduce interaction between emissions of different LEDs and/or lumiphoric material regions to reduce scattering and/or optical crosstalk, thereby preserving pixel-like resolution of the resulting emissions. Light segregation elements may be formed by mechanical sawing or etching to define grooves or recesses in a substrate, and filling the grooves or recesses with light-reflective or light-absorptive material. Light segregation elements external to a substrate may be defined by photolithographic patterning and etching of a sacrificial material, and/or by 3D printing.
    Type: Application
    Filed: May 16, 2019
    Publication date: September 5, 2019
    Inventors: John Edmond, Matthew Donofrio, Jesse Reiherzer, Peter Scott Andrews, Joseph G. Clark, Kevin Haberern
  • Patent number: 10361349
    Abstract: Light emitting diode components and devices with a wall of reflective material and having improved performance and beam angle, are provided. Reflective material provided with light emitting diode devices is configured to optimize light reflectivity by altering the composition, thickness, placement and/or angle thereof. Methods of making and assembly light emitting diode components and devices with reflective materials and improved performance, are also provided.
    Type: Grant
    Filed: September 1, 2017
    Date of Patent: July 23, 2019
    Assignee: Cree, Inc.
    Inventors: Peter Scott Andrews, Joseph G. Clark, Troy Gould, Erin R. F. Welch
  • Patent number: 10312224
    Abstract: At least one array of LEDs (e.g., in a flip chip configuration) is supported by a substrate having a light extraction surface overlaid with at least one lumiphoric material. Light segregation elements registered with gaps between LEDs are configured to reduce interaction between emissions of different LEDs and/or lumiphoric material regions to reduce scattering and/or optical crosstalk, thereby preserving pixel-like resolution of the resulting emissions. Light segregation elements may be formed by mechanical sawing or etching to define grooves or recesses in a substrate, and filling the grooves or recesses with light-reflective or light-absorptive material. Light segregation elements external to a substrate may be defined by photolithographic patterning and etching of a sacrificial material, and/or by 3D printing.
    Type: Grant
    Filed: January 9, 2017
    Date of Patent: June 4, 2019
    Assignee: Cree, Inc.
    Inventors: John Edmond, Matthew Donofrio, Jesse Reiherzer, Peter Scott Andrews, Joseph G. Clark, Kevin Haberern
  • Publication number: 20190151314
    Abstract: Methods of inhibiting the replication of influenza viruses in a biological sample or patient, of reducing the amount of influenza viruses in a biological sample or patient, and of treating influenza in a patient, comprises administering to said biological sample or patient an effective amount of a compound represented by Structural Formula (I): or a pharmaceutically acceptable salt thereof, wherein the values of Structural Formula (IA) are as described herein. A compound is represented by Structural Formula (IA) or a pharmaceutically acceptable salt thereof, wherein the values of Structural Formula (IA) are as described herein. A pharmaceutical composition comprises an effective amount of such a compound or pharmaceutically acceptable salt thereof, and a pharmaceutically acceptable carrier, adjuvant or vehicle.
    Type: Application
    Filed: June 25, 2018
    Publication date: May 23, 2019
    Inventors: Paul S. Charifson, Michael P. Clark, Upul K. Bandarage, Randy S. Bethiel, John J. Court, Hongbo Deng, loana Davies, John P. Duffy, Luc J. Farmer, Huai Gao, Wenxin Gu, Dylan H. Jacobs, Joseph M. Kennedy, Mark W. Ledeboer, Brian Ledford, Francois Maltais, Emanuele Perola, Tiansheng Wang, M. Woods Wannamaker, Randal Byrn, Yi Zhou, Chao Lin, Min Jiang, Steven Jones, Ursula A. Germann, Francesco G. Salituro, Ann Dak-Yee Kwong
  • Publication number: 20190074417
    Abstract: Light emitting diode components and devices with a wall of reflective material and having improved performance and beam angle, are provided. Reflective material provided with light emitting diode devices is configured to optimize light reflectivity by altering the composition, thickness, placement and/or angle thereof. Methods of making and assembly light emitting diode components and devices with reflective materials and improved performance, are also provided.
    Type: Application
    Filed: September 1, 2017
    Publication date: March 7, 2019
    Inventors: Peter Scott Andrews, Joseph G. Clark, Troy Gould, Erin R. F. Welch
  • Publication number: 20180331078
    Abstract: Light emitting diode (LED) devices and methods. An example apparatus can include a substrate, one or more LEDs, light-transmissive encapsulation material, and a reflective material covering a portion of the encapsulation material to form a defined opening. The opening allows light emitted from an LED to pass through in a prescribed manner. In some embodiments, the apparatus can be subsequently treated to modify the surface having the opening. In other embodiments, the reflective material can be disposed on a lateral surface of the encapsulation material to reflect light in a desired direction.
    Type: Application
    Filed: May 11, 2017
    Publication date: November 15, 2018
    Inventors: Troy Gould, Colin Kelly Blakely, Jesse Colin Reiherzer, Joseph G. Clark
  • Patent number: 9897267
    Abstract: Light emitter components, systems, and related methods having improved optical efficiency and a lower manufacturing cost are disclosed. In one aspect, a light emitter component can include a substrate having an elongated body and first and second ends. At least a first trace and a second trace can be provided on the substrate. In some aspects, the first trace can be disposed proximate the first end of the substrate and the second trace can be disposed proximate the second end of the substrate, with no other portion of the first trace or second trace being disposed between the first and second ends of the substrate. In some aspects, a string of LED chips can be provided on the substrate. The string of LED chips can be disposed between the first and second ends of the substrate. Angled traces, gaps and light emitter components can also be provided in some aspects.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: February 20, 2018
    Assignee: Cree, Inc.
    Inventors: Christopher P. Hussell, Sung Chul Joo, Erin Welch, Peter Scott Andrews, Joseph G. Clark, John A. Edmond, Jesse C. Reiherzer
  • Publication number: 20170294417
    Abstract: At least one array of LEDs (e.g., in a flip chip configuration) is supported by a substrate having a light extraction surface overlaid with at least one lumiphoric material. Light segregation elements registered with gaps between LEDs are configured to reduce interaction between emissions of different LEDs and/or lumiphoric material regions to reduce scattering and/or optical crosstalk, thereby preserving pixel-like resolution of the resulting emissions. Light segregation elements may be formed by mechanical sawing or etching to define grooves or recesses in a substrate, and filling the grooves or recesses with light-reflective or light-absorptive material. Light segregation elements external to a substrate may be defined by photolithographic patterning and etching of a sacrificial material, and/or by 3D printing.
    Type: Application
    Filed: January 5, 2017
    Publication date: October 12, 2017
    Inventors: John Edmond, Matthew Donofrio, Jesse Reiherzer, Peter Scott Andrews, Joseph G. Clark, Kevin Haberern
  • Publication number: 20170294418
    Abstract: At least one array of LEDs (e.g., in a flip chip configuration) is supported by a substrate having a light extraction surface overlaid with at least one lumiphoric material. Light segregation elements registered with gaps between LEDs are configured to reduce interaction between emissions of different LEDs and/or lumiphoric material regions to reduce scattering and/or optical crosstalk, thereby preserving pixel-like resolution of the resulting emissions. Light segregation elements may be formed by mechanical sawing or etching to define grooves or recesses in a substrate, and filling the grooves or recesses with light-reflective or light-absorptive material. Light segregation elements external to a substrate may be defined by photolithographic patterning and etching of a sacrificial material, and/or by 3D printing.
    Type: Application
    Filed: January 9, 2017
    Publication date: October 12, 2017
    Inventors: John Edmond, Matthew Donofrio, Jesse Reiherzer, Peter Scott Andrews, Joseph G. Clark, Kevin Haberern
  • Publication number: 20170229431
    Abstract: An LED wafer includes LED dies on an LED substrate. The LED wafer and a carrier wafer are joined. The LED wafer that is joined to the carrier wafer is shaped. Wavelength conversion material is applied to the LED wafer that is shaped. Singulation is performed to provide LED dies that are joined to a carrier die. The singulated devices may be mounted in an LED fixture to provide high light output per unit area.
    Type: Application
    Filed: April 27, 2017
    Publication date: August 10, 2017
    Inventors: Michael John Bergmann, David Todd Emerson, Joseph G. Clark, Christopher P. Hussell
  • Patent number: 9653643
    Abstract: An LED wafer includes LED dies on an LED substrate. The LED wafer and a carrier wafer are joined. The LED wafer that is joined to the carrier wafer is shaped. Wavelength conversion material is applied to the LED wafer that is shaped. Singulation is performed to provide LED dies that are joined to a carrier die. The singulated devices may be mounted in an LED fixture to provide high light output per unit area.
    Type: Grant
    Filed: September 10, 2012
    Date of Patent: May 16, 2017
    Assignee: Cree, Inc.
    Inventors: Michael John Bergmann, David Todd Emerson, Joseph G. Clark, Christopher P. Hussell
  • Patent number: 9349929
    Abstract: Light emitter packages, systems, and methods having improved performance are disclosed. In one aspect, a light emitter package can include a submount that can include an anode and a cathode. A first light emitter chip can mounted over at least a portion of the cathode, and a second light emitter chip can be wirebonded to at least a portion of the anode. Multiple light emitter chips can be disposed between the first and second light emitter chips.
    Type: Grant
    Filed: December 13, 2012
    Date of Patent: May 24, 2016
    Assignee: Cree, Inc.
    Inventors: Joseph G. Clark, Amber C. Abare, David T. Emerson, Jeremy S. Nevins, Raymond Rosado, Michael Bergmann
  • Patent number: 8921869
    Abstract: Light emitting devices and methods are disclosed. In one embodiment a light emitting device can include a submount and a plurality of light emitting diodes (LEDs) disposed over the submount. At least a portion of the submount can include a reflective layer at least partially disposed below a solder mask. One or more layers within the submount may include one or more holes, a rough surface texture, or combinations thereof to improve adhesion within the device. The device can further include a retention material dispensed about the plurality of LEDs. Devices and methods are disclosed for improved solder mask adhesion.
    Type: Grant
    Filed: June 3, 2013
    Date of Patent: December 30, 2014
    Assignee: Cree, Inc.
    Inventors: Erin R. F. Welch, Christopher P. Hussell, Jesse Colin Reiherzer, Joseph G. Clark
  • Publication number: 20140268728
    Abstract: Light emitter components, systems, and related methods having improved optical efficiency and a lower manufacturing cost are disclosed. In one aspect, a light emitter component can include a substrate having an elongated body and first and second ends. At least a first trace and a second trace can be provided on the substrate. In some aspects, the first trace can be disposed proximate the first end of the substrate and the second trace can be disposed proximate the second end of the substrate, with no other portion of the first trace or second trace being disposed between the first and second ends of the substrate. In some aspects, a string of LED chips can be provided on the substrate. The string of LED chips can be disposed between the first and second ends of the substrate. Angled traces, gaps and light emitter components can also be provided in some aspects.
    Type: Application
    Filed: March 15, 2013
    Publication date: September 18, 2014
    Applicant: CREE, INC.
    Inventors: Christopher P. Hussell, Sung Chul Joo, Erin Welch, Peter Scott Andrews, Joseph G. Clark, John A. Edmond, Jesse C. Reiherzer
  • Patent number: D709464
    Type: Grant
    Filed: May 31, 2012
    Date of Patent: July 22, 2014
    Assignee: Cree, Inc.
    Inventors: Amber C. Abare, Jeffrey Carl Britt, Joseph G. Clark, Raymond Rosado, Harsh Sundani
  • Patent number: D746240
    Type: Grant
    Filed: December 30, 2013
    Date of Patent: December 29, 2015
    Assignee: Cree, Inc.
    Inventors: Michael Bergmann, Joseph G Clark, Jesse Colin Reiherzer, Jeremy Scott Nevins
  • Patent number: D749051
    Type: Grant
    Filed: December 13, 2012
    Date of Patent: February 9, 2016
    Assignee: Cree, Inc.
    Inventors: Joseph G Clark, Amber C Abare, David T Emerson, Jeremy S Nevins, Raymond Rosado