Patents by Inventor Joseph G. Clark
Joseph G. Clark has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240069161Abstract: In one embodiment, a lidar system includes a wavelength-tunable light source configured to emit pulses of light, each emitted pulse of light having a particular wavelength of multiple different wavelengths. The lidar system also includes a scanner configured to scan the emitted pulses of light across a field of regard of the lidar system. The scanner includes (i) a beam deflector configured to angularly deflect each emitted pulse of light along a first scan axis according to the particular wavelength of the emitted pulse of light and (ii) a scan mirror configured to scan the emitted pulses of light along a second scan axis different from the first scan axis. The lidar system further includes a receiver configured to detect a received pulse of light that includes a portion of one of the emitted pulses of light scattered by a target located a distance from the lidar system.Type: ApplicationFiled: January 4, 2023Publication date: February 29, 2024Inventors: Joseph G. LaChapelle, Jason M. Eichenholz, Roger S. Cannon, Stephen D. Gaalema, William R. Clark, Alex Michael Sincore
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Patent number: 11837585Abstract: An LED wafer includes LED dies on an LED substrate. The LED wafer and a carrier wafer are joined. The LED wafer that is joined to the carrier wafer is shaped. Wavelength conversion material is applied to the LED wafer that is shaped. Singulation is performed to provide LED dies that are joined to a carrier die. The singulated devices may be mounted in an LED fixture to provide high light output per unit area.Type: GrantFiled: November 24, 2020Date of Patent: December 5, 2023Assignee: CreeLED, Inc.Inventors: Michael John Bergmann, David Todd Emerson, Joseph G. Clark, Christopher P. Hussell
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Patent number: 11776938Abstract: At least one array of LEDs (e.g., in a flip chip configuration) is supported by a substrate having a light extraction surface overlaid with at least one lumiphoric material. Light segregation elements registered with gaps between LEDs are configured to reduce interaction between emissions of different LEDs and/or lumiphoric material regions to reduce scattering and/or optical crosstalk, thereby preserving pixel-like resolution of the resulting emissions. Light segregation elements may be formed by mechanical sawing or etching to define grooves or recesses in a substrate, and filling the grooves or recesses with light-reflective or light-absorptive material. Light segregation elements external to a substrate may be defined by photolithographic patterning and etching of a sacrificial material, and/or by 3D printing.Type: GrantFiled: May 10, 2022Date of Patent: October 3, 2023Assignee: CREELED, INC.Inventors: John Edmond, Matthew Donofrio, Jesse Reiherzer, Peter Scott Andrews, Joseph G. Clark, Kevin Haberern
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Patent number: 11430769Abstract: Light emitting diode (LED) devices and methods. An example apparatus can include a substrate, one or more LEDs, light-transmissive encapsulation material, and a reflective material covering a portion of the encapsulation material to form a defined opening. The opening allows light emitted from an LED to pass through in a prescribed manner. In some embodiments, the apparatus can be subsequently treated to modify the surface having the opening. In other embodiments, the reflective material can be disposed on a lateral surface of the encapsulation material to reflect light in a desired direction.Type: GrantFiled: November 9, 2020Date of Patent: August 30, 2022Assignee: CreeLED, Inc.Inventors: Troy Gould, Colin Kelly Blakely, Jesse Colin Reiherzer, Joseph G. Clark
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Publication number: 20220271017Abstract: At least one array of LEDs (e.g., in a flip chip configuration) is supported by a substrate having a light extraction surface overlaid with at least one lumiphoric material. Light segregation elements registered with gaps between LEDs are configured to reduce interaction between emissions of different LEDs and/or lumiphoric material regions to reduce scattering and/or optical crosstalk, thereby preserving pixel-like resolution of the resulting emissions. Light segregation elements may be formed by mechanical sawing or etching to define grooves or recesses in a substrate, and filling the grooves or recesses with light-reflective or light-absorptive material. Light segregation elements external to a substrate may be defined by photolithographic patterning and etching of a sacrificial material, and/or by 3D printing.Type: ApplicationFiled: May 10, 2022Publication date: August 25, 2022Inventors: John Edmond, Matthew Donofrio, Jesse Reiherzer, Peter Scott Andrews, Joseph G. Clark, Kevin Haberern
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Patent number: 11387221Abstract: At least one array of LEDs (e.g., in a flip chip configuration) is supported by a substrate having a light extraction surface overlaid with at least one lumiphoric material. Light segregation elements registered with gaps between LEDs are configured to reduce interaction between emissions of different LEDs and/or lumiphoric material regions to reduce scattering and/or optical crosstalk, thereby preserving pixel-like resolution of the resulting emissions. Light segregation elements may be formed by mechanical sawing or etching to define grooves or recesses in a substrate, and filling the grooves or recesses with light-reflective or light-absorptive material. Light segregation elements external to a substrate may be defined by photolithographic patterning and etching of a sacrificial material, and/or by 3D printing.Type: GrantFiled: November 17, 2020Date of Patent: July 12, 2022Assignee: CREELED, INC.Inventors: John Edmond, Matthew Donofrio, Jesse Reiherzer, Peter Scott Andrews, Joseph G. Clark, Kevin Haberern
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Patent number: 11342313Abstract: At least one array of LEDs (e.g., in a flip chip configuration) is supported by a substrate having a light extraction surface overlaid with at least one lumiphoric material. Light segregation elements registered with gaps between LEDs are configured to reduce interaction between emissions of different LEDs and/or lumiphoric material regions to reduce scattering and/or optical crosstalk, thereby preserving pixel-like resolution of the resulting emissions. Light segregation elements may be formed by mechanical sawing or etching to define grooves or recesses in a substrate, and filling the grooves or recesses with light-reflective or light-absorptive material. Light segregation elements external to a substrate may be defined by photolithographic patterning and etching of a sacrificial material, and/or by 3D printing.Type: GrantFiled: November 17, 2020Date of Patent: May 24, 2022Assignee: CREELED, INC.Inventors: John Edmond, Matthew Donofrio, Jesse Reiherzer, Peter Scott Andrews, Joseph G. Clark, Kevin Haberern
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Publication number: 20210104503Abstract: An LED wafer includes LED dies on an LED substrate. The LED wafer and a carrier wafer are joined. The LED wafer that is joined to the carrier wafer is shaped. Wavelength conversion material is applied to the LED wafer that is shaped. Singulation is performed to provide LED dies that are joined to a carrier die. The singulated devices may be mounted in an LED fixture to provide high light output per unit area.Type: ApplicationFiled: November 24, 2020Publication date: April 8, 2021Inventors: Michael John Bergmann, David Todd Emerson, Joseph G. Clark, Christopher P. Hussell
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Publication number: 20210074687Abstract: At least one array of LEDs (e.g., in a flip chip configuration) is supported by a substrate having a light extraction surface overlaid with at least one lumiphoric material. Light segregation elements registered with gaps between LEDs are configured to reduce interaction between emissions of different LEDs and/or lumiphoric material regions to reduce scattering and/or optical crosstalk, thereby preserving pixel-like resolution of the resulting emissions. Light segregation elements may be formed by mechanical sawing or etching to define grooves or recesses in a substrate, and filling the grooves or recesses with light-reflective or light-absorptive material. Light segregation elements external to a substrate may be defined by photolithographic patterning and etching of a sacrificial material, and/or by 3D printing.Type: ApplicationFiled: November 17, 2020Publication date: March 11, 2021Inventors: John Edmond, Matthew Donofrio, Jesse Reiherzer, Peter Scott Andrews, Joseph G. Clark, Kevin Haberern
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Publication number: 20210057390Abstract: Light emitting diode (LED) devices and methods. An example apparatus can include a substrate, one or more LEDs, light-transmissive encapsulation material, and a reflective material covering a portion of the encapsulation material to form a defined opening. The opening allows light emitted from an LED to pass through in a prescribed manner. In some embodiments, the apparatus can be subsequently treated to modify the surface having the opening. In other embodiments, the reflective material can be disposed on a lateral surface of the encapsulation material to reflect light in a desired direction.Type: ApplicationFiled: November 9, 2020Publication date: February 25, 2021Inventors: Troy Gould, Colin Kelly Blakely, Jesse Colin Reiherzer, Joseph G. Clark
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Patent number: 10910352Abstract: At least one array of LEDs (e.g., in a flip chip configuration) is supported by a substrate having a light extraction surface overlaid with at least one lumiphoric material. Light segregation elements registered with gaps between LEDs are configured to reduce interaction between emissions of different LEDs and/or lumiphoric material regions to reduce scattering and/or optical crosstalk, thereby preserving pixel-like resolution of the resulting emissions. Light segregation elements may be formed by mechanical sawing or etching to define grooves or recesses in a substrate, and filling the grooves or recesses with light-reflective or light-absorptive material. Light segregation elements external to a substrate may be defined by photolithographic patterning and etching of a sacrificial material, and/or by 3D printing.Type: GrantFiled: May 16, 2019Date of Patent: February 2, 2021Assignee: Cree, Inc.Inventors: John Edmond, Matthew Donofrio, Jesse Reiherzer, Peter Scott Andrews, Joseph G. Clark, Kevin Haberern
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Patent number: 10854584Abstract: An LED wafer includes LED dies on an LED substrate. The LED wafer and a carrier wafer are joined. The LED wafer that is joined to the carrier wafer is shaped. Wavelength conversion material is applied to the LED wafer that is shaped. Singulation is performed to provide LED dies that are joined to a carrier die. The singulated devices may be mounted in an LED fixture to provide high light output per unit area.Type: GrantFiled: April 27, 2017Date of Patent: December 1, 2020Assignee: CREE, INC.Inventors: Michael John Bergmann, David Todd Emerson, Joseph G. Clark, Christopher P. Hussell
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Patent number: 10847501Abstract: Light emitting diode (LED) devices and methods. An example apparatus can include a substrate, one or more LEDs, light-transmissive encapsulation material, and a reflective material covering a portion of the encapsulation material to form a defined opening. The opening allows light emitted from an LED to pass through in a prescribed manner. In some embodiments, the apparatus can be subsequently treated to modify the surface having the opening. In other embodiments, the reflective material can be disposed on a lateral surface of the encapsulation material to reflect light in a desired direction.Type: GrantFiled: July 29, 2019Date of Patent: November 24, 2020Assignee: Cree, Inc.Inventors: Troy Gould, Colin Kelly Blakely, Jesse Colin Reiherzer, Joseph G. Clark
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Patent number: 10529696Abstract: At least one array of LEDs (e.g., in a flip chip configuration) is supported by a substrate having a light extraction surface overlaid with at least one lumiphoric material. Light segregation elements registered with gaps between LEDs are configured to reduce interaction between emissions of different LEDs and/or lumiphoric material regions to reduce scattering and/or optical crosstalk, thereby preserving pixel-like resolution of the resulting emissions. Light segregation elements may be formed by mechanical sawing or etching to define grooves or recesses in a substrate, and filling the grooves or recesses with light-reflective or light-absorptive material. Light segregation elements external to a substrate may be defined by photolithographic patterning and etching of a sacrificial material, and/or by 3D printing.Type: GrantFiled: January 5, 2017Date of Patent: January 7, 2020Assignee: Cree, Inc.Inventors: John Edmond, Matthew Donofrio, Jesse Reiherzer, Peter Scott Andrews, Joseph G. Clark, Kevin Haberern
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Publication number: 20190355701Abstract: Light emitting diode (LED) devices and methods. An example apparatus can include a substrate, one or more LEDs, light-transmissive encapsulation material, and a reflective material covering a portion of the encapsulation material to form a defined opening. The opening allows light emitted from an LED to pass through in a prescribed manner. In some embodiments, the apparatus can be subsequently treated to modify the surface having the opening. In other embodiments, the reflective material can be disposed on a lateral surface of the encapsulation material to reflect light in a desired direction.Type: ApplicationFiled: July 29, 2019Publication date: November 21, 2019Inventors: Troy Gould, Colin Kelly Blakely, Jesse Colin Reiherzer, Joseph G. Clark
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Patent number: 10439112Abstract: Light emitter packages, systems, and methods having improved performance are disclosed. In one aspect, a light emitter package can include a submount that can include an anode and a cathode. A light emitter chip can be disposed over the submount such that the light emitter chip is mounted over at least a portion of the cathode and wirebonded to at least a portion of the anode.Type: GrantFiled: July 20, 2012Date of Patent: October 8, 2019Assignee: Cree, Inc.Inventors: Joseph G. Clark, Jeffrey Carl Britt, Amber C. Abare, Raymond Rosado, Harsh Sundani, David T. Emerson, Jeremy Scott Nevins
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Patent number: 10410997Abstract: Light emitting diode (LED) devices and methods. An example apparatus can include a substrate, one or more LEDs, light-transmissive encapsulation material, and a reflective material covering a portion of the encapsulation material to form a defined opening. The opening allows light emitted from an LED to pass through in a prescribed manner. In some embodiments, the apparatus can be subsequently treated to modify the surface having the opening. In other embodiments, the reflective material can be disposed on a lateral surface of the encapsulation material to reflect light in a desired direction.Type: GrantFiled: May 11, 2017Date of Patent: September 10, 2019Assignee: Cree, Inc.Inventors: Troy Gould, Colin Kelly Blakely, Jesse Colin Reiherzer, Joseph G. Clark
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Publication number: 20190273070Abstract: At least one array of LEDs (e.g., in a flip chip configuration) is supported by a substrate having a light extraction surface overlaid with at least one lumiphoric material. Light segregation elements registered with gaps between LEDs are configured to reduce interaction between emissions of different LEDs and/or lumiphoric material regions to reduce scattering and/or optical crosstalk, thereby preserving pixel-like resolution of the resulting emissions. Light segregation elements may be formed by mechanical sawing or etching to define grooves or recesses in a substrate, and filling the grooves or recesses with light-reflective or light-absorptive material. Light segregation elements external to a substrate may be defined by photolithographic patterning and etching of a sacrificial material, and/or by 3D printing.Type: ApplicationFiled: May 16, 2019Publication date: September 5, 2019Inventors: John Edmond, Matthew Donofrio, Jesse Reiherzer, Peter Scott Andrews, Joseph G. Clark, Kevin Haberern
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Patent number: 10361349Abstract: Light emitting diode components and devices with a wall of reflective material and having improved performance and beam angle, are provided. Reflective material provided with light emitting diode devices is configured to optimize light reflectivity by altering the composition, thickness, placement and/or angle thereof. Methods of making and assembly light emitting diode components and devices with reflective materials and improved performance, are also provided.Type: GrantFiled: September 1, 2017Date of Patent: July 23, 2019Assignee: Cree, Inc.Inventors: Peter Scott Andrews, Joseph G. Clark, Troy Gould, Erin R. F. Welch
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Patent number: 10312224Abstract: At least one array of LEDs (e.g., in a flip chip configuration) is supported by a substrate having a light extraction surface overlaid with at least one lumiphoric material. Light segregation elements registered with gaps between LEDs are configured to reduce interaction between emissions of different LEDs and/or lumiphoric material regions to reduce scattering and/or optical crosstalk, thereby preserving pixel-like resolution of the resulting emissions. Light segregation elements may be formed by mechanical sawing or etching to define grooves or recesses in a substrate, and filling the grooves or recesses with light-reflective or light-absorptive material. Light segregation elements external to a substrate may be defined by photolithographic patterning and etching of a sacrificial material, and/or by 3D printing.Type: GrantFiled: January 9, 2017Date of Patent: June 4, 2019Assignee: Cree, Inc.Inventors: John Edmond, Matthew Donofrio, Jesse Reiherzer, Peter Scott Andrews, Joseph G. Clark, Kevin Haberern