Patents by Inventor Joseph G. Harden

Joseph G. Harden has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of reducing wafer particles after partial saw using a superhard protective coating
    Patent number: 6063696
    Abstract: A method of fabricating a monolithic device, preferably a micromechanical device, from a wafer (20) by carefully selecting the composition of two or more layers of photoresist (52,54). The present invention uses a superhard protective layer such as DLC or TiW deposited over the partially fabricated device prior to a partial-saw. This superhard protective layer reduces the generation of defects in the underlying photoresist layers, and allows a wet chemical HF acid to etch away particles and damage of the underlying oxide edges. A 6% BHF solution can be utilized. The present invention substantially improves the yield of micromechanical devices.
    Type: Grant
    Filed: May 4, 1998
    Date of Patent: May 16, 2000
    Assignee: Texas Instruments Incorporated
    Inventors: Mike Brenner, Timothy J. Hogan, Lawrence D. Dyer, Lisa A. T. Lester, Joseph G. Harden