Abstract: The embodiments include an array in intimate adjacent contact with a substrate foundation. The array has a plurality of radio frequency (RF) witness films overlain on the substrate foundation. Each RF witness film is a unit cell defined in a three-dimensional coordinate frame of reference, and is centered at an origin of the three-dimensional coordinate frame of reference. Each RF witness film in the plurality of RF witness films is equally-spaced from adjacent RF witness films.

Abstract: A support device comprises a first band secured to a second band in a cross pattern. A proximal end of the first band and a proximal end of the second band can also be configured to fasten around a waist of a user. Further, a distal end of the first band can be configured to fasten around a first leg of the user, and a distal end of the second band can be configured to fasten around a second leg of the user. The support device may prevent improper and dangerous misalignment of the back, hips and knees while squatting.

Abstract: A support device comprises a first band secured to a second band in a cross pattern. A proximal end of the first band and a proximal end of the second band can also be configured to fasten around a waist of a user. Further, a distal end of the first band can be configured to fasten around a first leg of the user, and a distal end of the second band can be configured to fasten around a second leg of the user. The support device may prevent improper and dangerous misalignment of the back, hips and knees while squatting.

Abstract: A support device comprises a first band secured to a second band in a cross pattern. A proximal end of the first band and a proximal end of the second band can also be configured to fasten around a waist of a user. Further, a distal end of the first band can be configured to fasten around a first leg of the user, and a distal end of the second band can be configured to fasten around a second leg of the user. The support device may prevent improper and dangerous misalignment of the back, hips and knees while squatting.

Abstract: Systems, manufactures, methods and/or techniques for a merged fiducial for chip packages are described. According to some embodiments, an integrated circuit package may include a package substrate having a first side and a second side, a plurality of conductive traces coupled to the first side and a plurality of balls disposed on the second side. The balls may be adapted to electrically connect the laminate package to a circuit board. The integrated circuit package may include a plurality of ball pads disposed on the second side, the ball pads being adapted to electrically connect the plurality of balls to the plurality of conductive traces. One or more of the ball pads may be uniquely shaped when compared to the rest of the plurality of ball pads, optionally, to serve as a fiducial to designate an A1 pin or ball of the laminate package.