Abstract: In accordance with the disclosure, an inductor may be formed over a semiconductor substrate of one or both dies in a face-to-face die arrangement while reducing the parasitic capacitance between the inductor and the adjacent die. In disclosed embodiments, a semiconductor device may include a void (e.g., an air gap) between the inductor and the adjacent die to reduce the parasitic capacitance between the inductor and the adjacent die. The void may be formed in the die that includes the inductor and/or the adjacent die. In some respects, the void may be etched in interface layers (e.g., comprising bump pads and dielectric material) between the semiconductor dies, and may extend along the length of the inductor.

Abstract: A TSV of a first semiconductor die may extend from a semiconductor substrate of the first semiconductor die through at least one metallization layer of the die to connect to a metallization layer to supply power to the second semiconductor die. By extending the TSV, resistance may be reduced, allowing for enhanced power delivery to the second semiconductor die. Resistance may be further reduced by allowing for the TSV to connect to a thicker metallization layer than would otherwise be possible. Also, in some embodiments, the TSV may connect to a metallization layer that is suitable for supplying power to both semiconductor dies. The first semiconductor die may be a top die or a bottom die in a face-to-face arrangement. Disclosed concepts may be extended to any number of dies included in a die stack that includes the face-to-face arrangement.

Abstract: A personal care cosmetic composition; its method of manufacture; and its method of use are disclosed.

Abstract: In accordance with the disclosure, an inductor may be formed over a semiconductor substrate of one or both dies in a face-to-face die arrangement while reducing the parasitic capacitance between the inductor and the adjacent die. In disclosed embodiments, a semiconductor device may include a void (e.g., an air gap) between the inductor and the adjacent die to reduce the parasitic capacitance between the inductor and the adjacent die. The void may be formed in the die that includes the inductor and/or the adjacent die. In some respects, the void may be etched in interface layers (e.g., comprising bump pads and dielectric material) between the semiconductor dies, and may extend along the length of the inductor.

Abstract: In accordance with the disclosure, one or both semiconductor dies in a face-to-face arrangement may include a probe pad layer formed on a face of the die to allow the die to be individually tested prior to assembly of the dies. Thus, faulty dies may be discarded individually so they are not included in a composite semiconductor device, thereby increasing device yields. The probe pad layer also allows dies to be matched so that a composite semiconductor device achieves desired performance, which may further increase device yields. In some embodiments, the probe pads of the probe pad layer formed on the face of the die may be used to individually test the die, and may remain inactive, or inert, during operation of the composite semiconductor device.

Abstract: In accordance with the disclosure, an inductor may be formed over a semiconductor substrate of one or both dies in a face-to-face die arrangement while reducing the parasitic capacitance between the inductor and the adjacent die. In disclosed embodiments, a semiconductor device may include a void (e.g., an air gap) between the inductor and the adjacent die to reduce the parasitic capacitance between the inductor and the adjacent die. The void may be formed in the die that includes the inductor and/or the adjacent die. In some respects, the void may be etched in interface layers (e.g., comprising bump pads and dielectric material) between the semiconductor dies, and may extend along the length of the inductor.

Abstract: A boat mooring system utilizing a cylinder having an internal spring-like mechanism that allows a retaining rope to lengthen or shorten automatically to adjust for rising tide or high wind to retain a boat at a safe distance from a dock or pier.

Abstract: A boat mooring system utilizing a cylinder having an internal spring-like mechanism that allows a retaining rope to lengthen or shorten automatically to adjust for rising tide or high wind to retain a boat at a safe distance from a dock or pier.

Abstract: A TSV of a first semiconductor die may extend from a semiconductor substrate of the first semiconductor die through at least one metallization layer of the die to connect to a metallization layer to supply power to the second semiconductor die. By extending the TSV, resistance may be reduced, allowing for enhanced power delivery to the second semiconductor die. Resistance may be further reduced by allowing for the TSV to connect to a thicker metallization layer than would otherwise be possible. Also, in some embodiments, the TSV may connect to a metallization layer that is suitable for supplying power to both semiconductor dies. The first semiconductor die may be a top die or a bottom die in a face-to-face arrangement. Disclosed concepts may be extended to any number of dies included in a die stack that includes the face-to-face arrangement.

Abstract: A TSV of a first semiconductor die may extend from a semiconductor substrate of the first semiconductor die through at least one metallization layer of the die to connect to a metallization layer to supply power to the second semiconductor die. By extending the TSV, resistance may be reduced, allowing for enhanced power delivery to the second semiconductor die. Resistance may be further reduced by allowing for the TSV to connect to a thicker metallization layer than would otherwise be possible. Also, in some embodiments, the TSV may connect to a metallization layer that is suitable for supplying power to both semiconductor dies. The first semiconductor die may be a top die or a bottom die in a face-to-face arrangement. Disclosed concepts may be extended to any number of dies included in a die stack that includes the face-to-face arrangement.

Abstract: A personal care cosmetic composition; its method of manufacture; and its method of use are disclosed.

Abstract: In accordance with the disclosure, an inductor may be formed over a semiconductor substrate of one or both dies in a face-to-face die arrangement while reducing the parasitic capacitance between the inductor and the adjacent die. In disclosed embodiments, a semiconductor device may include a void (e.g., an air gap) between the inductor and the adjacent die to reduce the parasitic capacitance between the inductor and the adjacent die. The void may be formed in the die that includes the inductor and/or the adjacent die. In some respects, the void may be etched in interface layers (e.g., comprising bump pads and dielectric material) between the semiconductor dies, and may extend along the length of the inductor.

Abstract: In accordance with the disclosure, one or both semiconductor dies in a face-to-face arrangement may include a probe pad layer formed on a face of the die to allow the die to be individually tested prior to assembly of the dies. Thus, faulty dies may be discarded individually so they are not included in a composite semiconductor device, thereby increasing device yields. The probe pad layer also allows dies to be matched so that a composite semiconductor device achieves desired performance, which may further increase device yields. In some embodiments, the probe pads of the probe pad layer formed on the face of the die may be used to individually test the die, and may remain inactive, or inert, during operation of the composite semiconductor device.

Abstract: A TSV of a first semiconductor die may extend from a semiconductor substrate of the first semiconductor die through at least one metallization layer of the die to connect to a metallization layer to supply power to the second semiconductor die. By extending the TSV, resistance may be reduced, allowing for enhanced power delivery to the second semiconductor die. Resistance may be further reduced by allowing for the TSV to connect to a thicker metallization layer than would otherwise be possible. Also, in some embodiments, the TSV may connect to a metallization layer that is suitable for supplying power to both semiconductor dies. The first semiconductor die may be a top die or a bottom die in a face-to-face arrangement. Disclosed concepts may be extended to any number of dies included in a die stack that includes the face-to-face arrangement.

Abstract: The present invention generally relates to absorbent sanitary articles for absorption of body fluids and in particular to a sanitary article of this type including a buffer composition adapted to adjust the natural pH of the absorbed body fluid to a pH that is compatible with the pH of skin.

Abstract: Disclosed are a method, device and system of a watershed stormwater management through a biobased biodegradable nutrient and sediment retaining water filtration tube with erosion control. In one aspect, a method of watershed stormwater management system includes forming the biobased filtration tube from a nontoxic renewable domestic agricultural material. The method ensures a diameter of the biobased filtration tube to approximately 10% greater than a field deployment to prevent shrinkage caused by ambient conditions, retains a sedimentary pollutant, and places the biobased filtration tube along the perimeter of a site. A filter material of the biobased filtration tube helps preventing high concentrations of sedimentary pollutant from getting into the streams. The biobased filtration tube captures and treats stormwater that runs off as sheet flow. The biobased filtration tube is utilized in the vegetated form. Vegetation grew into a slope at the site anchors the biobased filtration tube in an environment.

Abstract: The present invention generally relates to absorbent sanitary articles for absorption of body fluids and in particular to a sanitary article of this type including a buffer composition adapted to adjust the natural pH of the absorbed body fluid to a pH that is compatible with the pH of skin.

Abstract: The present invention generally relates to absorbent sanitary articles for absorption of body fluids and in particular to a sanitary article of this type including a buffer composition adapted to adjust the natural pH of the absorbed body fluid to a pH that is compatible with the pH of skin.

Abstract: A sub-atmospheric, negative pressure is applied to a growth factor starting material, such as whole blood, to release growth factors and plasma in a non-destructive medium. The released growth factors having a weight of about 70-76 kDaltons are applied in either a filtered or unfiltered state to a wound to promote healing of the wound. The released growth factors are applied topically to the area of a surface wound to effect healing. The released growth factors are also injected into soft tissue, such as a torn tendon, to promote tissue growth and healing. The growth factors are released in one method from a patient's own blood. In another method the growth factors are released from a whole blood source and freeze dried by conventional lyophilization. Then at a later date, the freeze dried product is reconstituted by normal saline for treatment of a patient's wound or for use in a surgical procedure.

Abstract: A biodegradable runoff filter is an apparatus that is used to filter silt, chemicals, and other contaminants out of water runoff produced at or near a work site. The apparatus includes a biodegradable filter sock, a botanical biomass filling, and a fastener. The biodegradable filter sock is a water-permeable container that is used to contain an amount of the botanical biomass filling. The biodegradable filter sock includes a lateral portion, an open end and a closed end. The lateral portion and the closed end surround the botanical biomass filling and contain it to a specific area. The open end of the biodegradable filter sock allows the botanical biomass filling to be packed into the biodegradable filter sock. The fastener fits over the open end and cinches the open end shut to prevent the botanical biomass filling from falling out of the biodegradable filter sock.