Abstract: The invention relates to a method for fabricating a metallized assembly for a microcircuit card (110) exhibiting a metallized effect, the assembly forming an internal layer of this card. The method is characterized in that it comprises the following steps: addition of a support layer (116a) formed by a plastic material sensitive to heat exhibiting a first shrinkage ratio, the support layer (116a) having, on the surface, at least the dimensions of a microcircuit card (110), addition of a metallized film (118) held on a first non-adhesive bearing liner (120a), the first bearing liner (120a) exhibiting a shrinkage ratio less than that of the support layer (116a), transfer of the metallized film (118) onto the support layer (116a) by the application of heat and pressure, removal of the first bearing liner (120a). The invention relates also to a method for fabricating a card, and a card obtained by this method.