Patents by Inventor Joseph H. Mickle

Joseph H. Mickle has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Soldering assembly
    Patent number: 6335514
    Abstract: A solder assembly 10 which is selectively and operably connectable to a controller 12 and which has several “guns” 74, 76 which each allow for the selective creation of a several circuits, thereby allowing for the creation of substantial even solder connections.
    Type: Grant
    Filed: December 20, 2000
    Date of Patent: January 1, 2002
    Assignee: Assembly Technologies Int., Inc.
    Inventors: Matthew J. McAmmond, Joseph H. Mickle
  • Soldering assembly
    Patent number: 6288365
    Abstract: A solder assembly 10 which is selectively and operably connectable to a controller 12 and which has several “guns” 74, 76 which each allow for the selective creation of a several circuits, thereby allowing for the creation of substantial even solder connections.
    Type: Grant
    Filed: May 18, 1999
    Date of Patent: September 11, 2001
    Inventors: Matthew J. McAmmond, Joseph H. Mickle
  • Soldering assembly
    Publication number: 20010000900
    Abstract: A solder assembly 10 which is selectively and operably connectable to a controller 12 and which has several “guns” 74, 76 which each allow for the selective creation of a several circuits, thereby allowing for the creation of substantial even solder connections.
    Type: Application
    Filed: December 20, 2000
    Publication date: May 10, 2001
    Inventors: Matthew J. McAmmond, Joseph H. Mickle
  • Handheld electric heater for removing or replacing surface-mounted integrated circuits from a circuit board
    Patent number: 5603857
    Abstract: An apparatus for removing and/or replacing a surface-mounted integrated circuit that includes electrical heating elements disposed in a planar rectangular array and a handle positioning the element array in heat-conductive contact with the legs on the side edges of a surface-mounted integrated circuit. When electrical energy is applied to the heating elements, the elements and the integrated circuit legs are heated so as to liquify the solder joints between the legs and the circuit board pads. An air pad is positioned within the heating element array for grasping and holding the integrated circuit to facilitate lifting of the circuit from the circuit board, or for holding a replacement integrated circuit on the circuit board, when all of the solder joints have been liquified.
    Type: Grant
    Filed: February 24, 1995
    Date of Patent: February 18, 1997
    Assignee: Assembly Technologies International, Inc.
    Inventor: Joseph H. Mickle