Patents by Inventor Joseph Hofstra
Joseph Hofstra has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8750010Abstract: A memory module, system and method of forming the same includes a memory module including a plurality of memory devices having a first portion of memory devices cooperatively forming a first rank of memory devices and a second portion of memory devices cooperatively forming a second rank of memory devices. The first and second portions of memory devices are grouped into a plurality of memory device stacks, wherein each of the plurality of memory device stacks includes at least one of the plurality of memory devices coupled to a first portion of a plurality of DQ signals and at least another one of the plurality of memory devices coupled to a different second portion of the plurality of DQ signals.Type: GrantFiled: June 25, 2012Date of Patent: June 10, 2014Assignee: Micron Technology, Inc.Inventor: Joseph Hofstra
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Publication number: 20120262977Abstract: A memory module, system and method of forming the same includes a memory module including a plurality of memory devices having a first portion of memory devices cooperatively forming a first rank of memory devices and a second portion of memory devices cooperatively forming a second rank of memory devices. The first and second portions of memory devices are grouped into a plurality of memory device stacks, wherein each of the plurality of memory device stacks includes at least one of the plurality of memory devices coupled to a first portion of a plurality of DQ signals and at least another one of the plurality of memory devices coupled to a different second portion of the plurality of DQ signals.Type: ApplicationFiled: June 25, 2012Publication date: October 18, 2012Applicant: MICRON TECHNOLOGY, INC.Inventor: Joseph Hofstra
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Patent number: 8208277Abstract: A memory module, system and method of forming the same includes a memory module including a plurality of memory devices having a first portion of memory devices cooperatively forming a first rank of memory devices and a second portion of memory devices cooperatively forming a second rank of memory devices. The first and second portions of memory devices are grouped into a plurality of memory device stacks, wherein each of the plurality of memory device stacks includes at least one of the plurality of memory devices coupled to a first portion of a plurality of DQ signals and at least another one of the plurality of memory devices coupled to a different second portion of the plurality of DQ signals.Type: GrantFiled: August 27, 2010Date of Patent: June 26, 2012Assignee: Micron Technology, Inc.Inventor: Joseph Hofstra
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Publication number: 20100321973Abstract: A memory module, system and method of making the same includes a memory module including a plurality of memory devices having a first portion of memory devices cooperatively forming a first rank of memory devices and a second portion of memory devices cooperatively forming a second rank of memory devices. The first and second portions of memory devices are grouped into a plurality of memory device stacks, wherein each of the plurality of memory device stacks includes at least one of the plurality of memory devices coupled to a first portion of a plurality of DQ signals and at least another one of the plurality of memory devices coupled to a different second portion of the plurality of DQ signals.Type: ApplicationFiled: August 27, 2010Publication date: December 23, 2010Applicant: MICRON TECHNOLOGY, INC.Inventor: Joseph Hofstra
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Patent number: 7796414Abstract: A memory module, system and method of making the same includes a memory module including a plurality of memory devices having a first portion of memory devices cooperatively forming a first rank of memory devices and a second portion of memory devices cooperatively forming a second rank of memory devices. The first and second portions of memory devices are grouped into a plurality of memory device stacks, wherein each of the plurality of memory device stacks includes at least one of the plurality of memory devices coupled to a first portion of a plurality of DQ signals and at least another one of the plurality of memory devices coupled to a different second portion of the plurality of DQ signals.Type: GrantFiled: December 30, 2008Date of Patent: September 14, 2010Assignee: Micron Technology, Inc.Inventor: Joseph Hofstra
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Publication number: 20090103344Abstract: A memory module, system and method of making the same includes a memory module including a plurality of memory devices having a first portion of memory devices cooperatively forming a first rank of memory devices and a second portion of memory devices cooperatively forming a second rank of memory devices. The first and second portions of memory devices are grouped into a plurality of memory device stacks, wherein each of the plurality of memory device stacks includes at least one of the plurality of memory devices coupled to a first portion of the plurality of DQ signals and at least another one of the plurality of memory devices coupled to a different second portion of the plurality of DQ signals.Type: ApplicationFiled: December 30, 2008Publication date: April 23, 2009Applicant: Micron Technology, Inc.Inventor: Joseph Hofstra
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Patent number: 7471538Abstract: A memory module, system and method of making the same includes a memory module including a plurality of memory devices having a first portion of memory devices cooperatively forming a first rank of memory devices and a second portion of memory devices cooperatively forming a second rank of memory devices. The first and second portions of memory devices are grouped into a plurality of memory device stacks, wherein each of the plurality of memory device stacks includes at least one of the plurality of memory devices coupled to a first portion of the plurality of DQ signals and at least another one of the plurality of memory devices coupled to a different second portion of the plurality of DQ signals.Type: GrantFiled: March 30, 2006Date of Patent: December 30, 2008Assignee: Micron Technology, Inc.Inventor: Joseph Hofstra
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Publication number: 20070230230Abstract: A memory module, system and method of making the same includes a memory module including a plurality of memory devices having a first portion of memory devices cooperatively forming a first rank of memory devices and a second portion of memory devices cooperatively forming a second rank of memory devices. The first and second portions of memory devices are grouped into a plurality of memory device stacks, wherein each of the plurality of memory device stacks includes at least one of the plurality of memory devices coupled to a first portion of the plurality of DQ signals and at least another one of the plurality of memory devices coupled to a different second portion of the plurality of DQ signals.Type: ApplicationFiled: March 30, 2006Publication date: October 4, 2007Inventor: Joseph Hofstra
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Patent number: 6714058Abstract: A clock driver circuit includes a phase-lock loop that generates a processed clock signal from an input clock signal. The processed clock signal is applied to a series of delay elements each of which has an output coupled to the input of a respective driver circuit. The outputs of the driver circuits are coupled to respective clocked circuits through respective conductors. The length of each conductor may vary from the lengths of other conductors. The longer conductors are coupled to upstream delay elements and the shorter conductors are coupled to downsteam delay elements so that the clock signals are applied to respective clocked circuits at substantially the same time. The delay elements thus compensate for variations in the propagation time of the clock signals as they are coupled to the clocked circuits.Type: GrantFiled: February 27, 2003Date of Patent: March 30, 2004Assignee: Micron Technology, Inc.Inventor: Joseph Hofstra
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Publication number: 20030137335Abstract: A clock driver circuit includes a phase-lock loop that generates a processed clock signal from an input clock signal. The processed clock signal is applied to a series of delay elements each of which has an output coupled to the input of a respective driver circuit. The outputs of the driver circuits are coupled to respective clocked circuits through respective conductors. The length of each conductor may vary from the lengths of other conductors. The longer conductors are coupled to upstream delay elements and the shorter conductors are coupled to downsteam delay elements so that the clock signals are applied to respective clocked circuits at substantially the same time. The delay elements thus compensate for variations in the propagation time of the clock signals as they are coupled to the clocked circuits.Type: ApplicationFiled: February 27, 2003Publication date: July 24, 2003Inventor: Joseph Hofstra
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Patent number: 6535038Abstract: A clock driver circuit includes a phase-lock loop that generates a processed clock signal from an input clock signal. The processed clock signal is applied to a series of delay elements each of which has an output coupled to the input of a respective driver circuit. The outputs of the driver circuits are coupled to respective clocked circuits through respective conductors. The length of each conductor may vary from the lengths of other conductors. The longer conductors are coupled to upstream delay elements and the shorter conductors are coupled to downsteam delay elements so that the clock signals are applied to respective clocked circuits at substantially the same time. The delay elements thus compensate for variations in the propagation time of the clock signals as they are coupled to the clocked circuits.Type: GrantFiled: March 9, 2001Date of Patent: March 18, 2003Assignee: Micron Technology, Inc.Inventor: Joseph Hofstra
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Publication number: 20020125927Abstract: A clock driver circuit includes a phase-lock loop that generates a processed clock signal from an input clock signal. The processed clock signal is applied to a series of delay elements each of which has an output coupled to the input of a respective driver circuit. The outputs of the driver circuits are coupled to respective clocked circuits through respective conductors. The length of each conductor may vary from the lengths of other conductors. The longer conductors are coupled to upstream delay elements and the shorter conductors are coupled to downsteam delay elements so that the clock signals are applied to respective clocked circuits at substantially the same time. The delay elements thus compensate for variations in the propagation time of the clock signals as they are coupled to the clocked circuits.Type: ApplicationFiled: March 9, 2001Publication date: September 12, 2002Inventor: Joseph Hofstra