Patents by Inventor Joseph Hsing-Hwa Ho

Joseph Hsing-Hwa Ho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Systems and methods for supporting a component
    Patent number: 11094605
    Abstract: Interconnectors, interconnector assemblies, and methods for supporting components are provided. An interconnector as disclosed connects a supported component to another component or assembly securely and accurately, even where the supported component and the other component have different expansion or contraction characteristics. The interconnector includes a plurality of support elements disposed in an array. Each support element includes a support surface at a free end of the support element. The areas of the support surfaces decrease with distance from a center of the array. In a completed assembly, the free ends of the support elements in the array are joined to the supported component.
    Type: Grant
    Filed: April 9, 2020
    Date of Patent: August 17, 2021
    Assignee: Ball Aerospace & Technologies Corp.
    Inventor: Joseph Hsing-Hwa Ho
  • SYSTEMS AND METHODS FOR SUPPORTING A COMPONENT
    Publication number: 20200280154
    Abstract: Interconnectors, interconnector assemblies, and methods for supporting components are provided. An interconnector as disclosed connects a supported component to another component or assembly securely and accurately, even where the supported component and the other component have different expansion or contraction characteristics. The interconnector includes a plurality of support elements disposed in an array. Each support element includes a support surface at a free end of the support element. The areas of the support surfaces decrease with distance from a center of the array. In a completed assembly, the free ends of the support elements in the array are joined to the supported component.
    Type: Application
    Filed: April 9, 2020
    Publication date: September 3, 2020
    Applicant: Ball Aerospace & Technologies Corp.
    Inventor: Joseph Hsing-Hwa Ho
  • Pin flexure array
    Patent number: 10658262
    Abstract: Interconnection systems and methods are provided. An interconnector as disclosed allows for a first component having a first coefficient of thermal expansion to be joined to a second component having a second coefficient of thermal expansion securely, and while maintaining a precise alignment between the components. The interconnector generally includes a plurality of pins that each have a free end that is adhered to the first component for imaging, sensing, tracking, processing, and other applications.
    Type: Grant
    Filed: November 30, 2018
    Date of Patent: May 19, 2020
    Assignee: Ball Aerospace & Technologies Corp.
    Inventor: Joseph Hsing-Hwa Ho
  • PIN FLEXURE ARRAY
    Publication number: 20190267730
    Abstract: Interconnection systems and methods are provided. An interconnector as disclosed allows for a first component having a first coefficient of thermal expansion to be joined to a second component having a second coefficient of thermal expansion securely, and while maintaining a precise alignment between the components. The interconnector generally includes a plurality of pins that each have a free end that is adhered to the first component for imaging, sensing, tracking, processing, and other applications.
    Type: Application
    Filed: November 30, 2018
    Publication date: August 29, 2019
    Applicant: Ball Aerospace & Technologies Corp.
    Inventor: Joseph Hsing-Hwa Ho