Abstract: Embodiments relate to transferring dies or other electronic components from a carrier substrate to a target substrate of a device as part of chip assembly for the device. Bonding material is applied to selected dies on a carrier substrate by direct boning, or to corresponding die transfer locations on a target substrate. The carrier substrate is then brought into contact with the target substrate to transfer each of the selected dies to the carrier substrate. Dies can also be directly bonded to the target substrate even in the presence of other die in situ (e.g., from a previous bonding cycle), hence, enables more than one direct bond cycle to be carried out for a target substrate. As such, multi-color (RGB) display elements can be assembled in stages (e.g., separate bonding cycles) in a flexible manner to provide redundancy or to replace inoperative LED dies.

Abstract: A self-regenerating ion-exchange water softener has an inlet connectable to a source of softenable water under pressure, a resin chamber connected thereto, and an outlet connected to the resin chamber. A salt chamber is located above the resin chamber and contains a water-soluble salt for regenerating the resin. A chamber connection allows controlled downward flow of fluid from the salt chamber to the resin chamber. A first normally-open pressure-sensitive valve closes in response to increased water pressure in the resin chamber, and normally permits a downward fluid flow from the salt chamber to the resin chamber. A passageway permits pressurized water to flow upwardly from the resin chamber to a point above the high-water mark of the salt chamber to generate salt solution for contacting and regenerating the resin, and has a discharge control above the high-water mark.

Abstract: Methods and apparatus for use in the manufacture of a display element. Some embodiments include a method for selective pick up of a subset of a plurality of electronic devices adhered to a handle layer. The method comprises modifying a level of adhesion between one or more electronic devices of the plurality of electronic devices adhered to the handle layer, such that the subset of the plurality of electronic devices has a level of adhesion to the handle layer that is less than a force applied by a pick up tool, PUT. This enables selective pick up of the subset of the plurality of electronic devices from the handle layer by the PUT.

Abstract: The present invention relates to a method, system, and computer program product for project adoption documentation generation using machine learning. A method includes receiving a set of project parameters for a set of projects. In an embodiment, a method includes receiving a set of input project parameters for an input project. In an embodiment, a method includes comparing each set of project parameters to the set of input project parameters. In an embodiment, a method includes selecting, responsive to the comparison, a project from the set of projects. In an embodiment, a method includes generating, responsive to the selection, documentation for the input project.

Abstract: Techniques related to laser lift-off masks are disclosed. In some embodiments, masking material is applied to a substrate that is attached to a plurality of semiconductor device sets. More specifically, the masking material is applied to one or more regions of the substrate between the semiconductor device sets. When the semiconductor device sets are embedded in a filling material, the masking material may be situated between the substrate and the filling material. Thus, transmitting light through the substrate toward the semiconductor device sets causes the substrate to become detached from the semiconductor device sets. However, the light is at least partially occluded by the masking material.

Abstract: A lens assembly includes a plurality of micro-LEDs coupled to one or more circuitries affixed to a surface of a lens substrate. At least one micro-LED is positioned within a viewing region of the lens substrate. The viewing region is a region through which light emitted by an electronic display passes prior to reaching an eyebox. The lens assembly may be part of a head-mounted display (HMD). An eye tracking unit of the HMD includes the one or more micro-LEDs to project light onto a portion of a user's eye and a detector to collect reflected and/or scattered light from the illuminated portion of the eye. The eye tracking unit tracks the movement of the user's eye. Based on the tracked movement, the HMD adjusts presentation of displayed content such as focus and/or resolutions of the displayed content.

Abstract: Methods and apparatus for use in the manufacture of a display device including pixels. Each pixel includes a plurality of sub-pixels, each sub-pixel configured to provide light of a given wavelength. The method may include: performing, using a pick up tool (PUT), a first placement cycle comprising picking up first light emitting diode (LED) dies, and placing a first LED die on a substrate of the display device at a location corresponding to a sub-pixel the display device. The method further includes performing one or more subsequent placement cycles comprising picking up a second LED die, and placing the second LED die on the substrate of the display device at a second location corresponding to the sub-pixel of the display device. Multiple first and second LED dies may be picked and placed during each placement cycle to populate each pixel of the display device to provide redundancy of LED dies at each sub-pixel.

Abstract: Embodiments relate to placing of semiconductor devices on a target substrate using a pick and place head (PPH) having a cross-section of a polygon shape and pick-up surfaces. The pick-up surfaces of the PPH are aligned with a carrier substrate mounted with the semiconductor devices, which may be light emitting diodes (LEDs). The PPH is moved toward one or more first semiconductor devices on the carrier substrate to pick up the one or more first semiconductor devices with a first pick-up surface of the PPH. The PPH is rotated to pick up one or more semiconductor devices dies with a second pick-up surface of the PPH. The one or more first semiconductor devices attached to the first pick-up surface and the one or more second semiconductor devices attached to the second pick-up surface are placed on a target substrate.

Abstract: A light emitting diode (LED) includes an elastomeric material that facilitates adhesive attachment with a pick-up head for pick and place operations. The LED includes an epitaxial layer defining a mesa structure and a light emitting surface. The mesa structure includes an active layer to emit light, and the emitted light is reflected at the mesa structure toward a light emitting region of the light emitting surface and transmitted at the light emitting region. An elastomeric material is on a portion of the light emitting surface, such as the light emitting region or a passive region. At the light emitting region, the elastomeric material may be shaped as a lens that collimates light transmitted from the light emitting region, and also facilitates adhesion to the pick-up head. At the passive region, the elastomeric material facilitates adhesion to the pick-up head without interfering with light emitted from the light emitting region.

Abstract: Systems and methods are provided for enabling access to digital content based on geographic locations visited by mobile device users. One method includes receiving a promotion associated with premium digital content, access information, and one or more locations in which the premium digital content is accessible.

Abstract: Embodiments relate to using flux or underfill as a trapping layer for temporarily attaching light emitting diodes (LEDs) to a substrate and heating to simultaneously bond multiple LEDs onto the substrate. The flux or underfill may be selectively coated at the ends of electrodes of the LEDs prior to placing the LEDs on the substrate. Due to adhesive properties of the flux or underfill, multiple LEDs can be placed on and attached to the substrate prior to performing the bonding process. Once LEDs are placed on the substrate, the flux or underfill facilitates formation of metallic contacts between electrodes of the LED and contacts of the substrate during the bonding process. By using the flux or underfill, the formation of metallic contacts can be performed even without applying pressure.

Abstract: A method, system and computer program product for obtaining vector representations of code snippets capturing semantic similarity. A first and second training set of code snippets are collected, where the first training set of code snippets implements the same function representing semantic similarity and the second training set of code snippets implements a different function representing semantic dissimilarity. A vector representation of a first and second code snippet from either the first or second training set of code snippets is generated using a machine learning model. A loss value is generated utilizing a loss function that is proportional or inverse to the distance between the first and second vectors in response to receiving the first and second code snippets from the first or second training set of code snippets, respectively. The machine learning model is trained to capture the semantic similarity in the code snippets by minimizing the loss value.

Abstract: A system and method for recommending whether to upgrade dependencies of a software project includes mining historical software data artifacts associated with a plurality of software projects to extract a plurality of metrics and dependency version lineages from the historical software data artifacts, clustering the software projects based on the metrics and the dependency version lineages, extracting target metrics and a target version lineage of a target software project selecting a software project cluster from the plurality of clusters that best matches the target software project, analyzing the metrics for each of the software projects included in the at least one software project cluster to determine that a measurable change to the metrics occurred as a result of upgrading dependencies of the software projects, and recommending which software dependencies of the target software project should be upgraded based on the measurable change to the metrics of the software projects.

Abstract: Techniques related to eye tracking using reverse-biased light-emitting diode (LED) devices are disclosed. In some embodiments, a viewing apparatus comprises a reverse-biased LED device that is positioned within a field-of-view of an eye. The reverse-biased LED device receives light reflected from the eye and generates signal based on the received light. The generated signal is used to determine a position of the eye.

Abstract: One or more chips are transferred from one substrate to another by using one or more polymer layers to secure the one or more chips to an intermediate carrier substrate. While secured to the intermediate carrier substrate, the one or more chips may be transported or put through further processing or fabrication steps. To release the one or more chips, the adhesion strength of the one or more polymer layers is gradually reduced to minimize potential damage to the one or more chips.

Abstract: Systems and methods are provided for enabling access to digital content based on geographic locations visited by mobile device users. One method includes receiving a promotion associated with premium digital content, access information, and one or more locations in which the premium digital content is accessible.

Abstract: A light emitting diode (LED) includes an elastomeric material that facilitates adhesive attachment with a pick-up head for pick and place manufacturing operations. The LED includes an epitaxial layer defining a mesa structure and a light emitting surface. The mesa structure includes an active layer to emit light, and the emitted light is reflected at the mesa structure toward a light emitting region of the light emitting surface and transmitted at the light emitting region. An elastomeric material is on a portion of the light emitting surface, such as the light emitting region or a passive region. At the light emitting region, the elastomeric material may be shaped as a lens that collimates light transmitted from the light emitting region, and also facilitates adhesion to the pick-up head. At the passive region, the elastomeric material facilitates adhesion to the pick-up head without interfering with light emitted from the light emitting region.

Abstract: LEDs are manufactured on a substrate layer and picked and placed using a pick-up tool (PUT) onto a target substrate. The PUT typically attaches to an LED via an elastomer layer deposited on a surface of the LED. A given batch of manufactured LEDs may contain operational LEDs as well as non-operational LEDs. In order to separate the operational and non-operational LEDs, the LEDs are placed on a unidirectional conductive film. A voltage difference applied across the electrodes of each LED via the unidirectional conductive film powers the LEDs and causes the operational LEDs to emit light. An electrical parameter of each LED is measured and used to determine whether each LED is operational or non-operational. An elastomer deposition apparatus selectively deposits elastomer material on the operational LEDs, allowing for the operational LEDs to be picked up using the PUT, while not depositing elastomer material on the non-operational LEDs.

Abstract: One or more chips are transferred from one substrate to another by using one or more polymer layers to secure the one or more chips to an intermediate carrier substrate. While secured to the intermediate carrier substrate, the one or more chips may be transported or put through further processing or fabrication steps. To release the one or more chips, the adhesion strength of the one or more polymer layers is gradually reduced to minimize potential damage to the one or more chips.

Abstract: Techniques related to optics formation using pick-up tools are disclosed. Optical elements are formed by pressing a pick-up tool (PUT) against elastomeric material deposited on a light-outputting side of light-emitting diode (LED) devices. Pressing the PUT against the elastomeric material causes a molded shape of the PUT to be transferred to the elastomeric material. This forms the optical elements in the elastomeric material.