Abstract: An integrated circuit package carrier is disclosed which is useful to carry to variety of different sized integrated circuit packages and which is useful for a greater number of flexures. The carrier device comprises a carrier body with an opening extending through the carrier body. A pair of beams are carried by the carrier body and are disposed within the opening, with each of the beams comprising a beam body portion and a connection spring at each end of the beam body portion for connecting the beam body portion to the carrier body and for biasing the beam body portions towards each other. A beam accepting aperture is disposed longitudinally outwardly of each of the beams, and a shaped retainer extends upwardly from each of the beams and inwardly towards the other of the beams.