Patents by Inventor Joseph Iannotti
Joseph Iannotti has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 10605785Abstract: A system includes a structure configured to have a structure bonding layer disposed on a surface of the structure. The structure bonding layer is a metallic alloy. The system includes a sensor configured to have a sensor bonding layer disposed on a surface of the sensor. The sensor bonding layer is a metallic alloy. The sensor bonding layer is configured to be coupled to the structure bonding layer via a metallic joint in order for the sensor to sense data of the structure through the metallic joint, the structure bonding layer, and the sensor bonding layer.Type: GrantFiled: June 7, 2017Date of Patent: March 31, 2020Assignee: GENERAL ELECTRIC COMPANYInventors: Joseph Iannotti, Christopher James Kapusta, David Richard Esler
-
Publication number: 20190110859Abstract: A fiber-based radiopaque tissue marker for radiographic marking of tissue is provided. The marker is a sterile, single-patient-use polymeric fiber with a radiopaque material and a dye. The marker is radiopaque using standard radiographs such as x-rays and mammography. The marker can also be visualized by low-dose CT scans.Type: ApplicationFiled: October 15, 2018Publication date: April 18, 2019Inventors: Justin Jeffrey Baker, Peter Hayes Gingras, Robert Priest, Kathe Derwin, Joseph Iannotti
-
Patent number: 10200089Abstract: A sensor system includes one or more rotor antennas on a shaft that moves within a stator bracket one or more of around an axis of the sensor system or along the axis of the sensor system, the one or more rotor antennas configured to communicate sensed data with one or more stator antennas on the stator bracket. Each rotor antenna has a rotor signal trace disposed on an outer rotor side of a dielectric substrate of the rotor antenna and a rotor return trace disposed on the outer rotor side of the dielectric substrate, wherein the rotor signal trace and the rotor return trace are not concentric with respect to each other. The one or more rotor antennas are configured to extend one or more of radially around an outer surface of the shaft of a sensor or along the outer surface of the shaft of the sensor.Type: GrantFiled: June 7, 2017Date of Patent: February 5, 2019Assignee: General Electric CompanyInventors: Yongjae Lee, Joseph Iannotti
-
Publication number: 20180359004Abstract: A sensor system includes one or more rotor antennas on a shaft that moves within a stator bracket one or more of around an axis of the sensor system or along the axis of the sensor system, the one or more rotor antennas configured to communicate sensed data with one or more stator antennas on the stator bracket. Each rotor antenna has a rotor signal trace disposed on an outer rotor side of a dielectric substrate of the rotor antenna and a rotor return trace disposed on the outer rotor side of the dielectric substrate, wherein the rotor signal trace and the rotor return trace are not concentric with respect to each other. The one or more rotor antennas are configured to extend one or more of radially around an outer surface of the shaft of a sensor or along the outer surface of the shaft of the sensor.Type: ApplicationFiled: June 7, 2017Publication date: December 13, 2018Inventors: Yongjae Lee, Joseph Iannotti
-
Publication number: 20180356368Abstract: A system includes a structure configured to have a structure bonding layer disposed on a surface of the structure. The structure bonding layer is a metallic alloy. The system includes a sensor configured to have a sensor bonding layer disposed on a surface of the sensor. The sensor bonding layer is a metallic alloy. The sensor bonding layer is configured to be coupled to the structure bonding layer via a metallic joint in order for the sensor to sense data of the structure through the metallic joint, the structure bonding layer, and the sensor bonding layer.Type: ApplicationFiled: June 7, 2017Publication date: December 13, 2018Inventors: Joseph Iannotti, Christopher James Kapusta, David Richard Esler
-
Patent number: 9414927Abstract: A joint prosthesis system, specifically a shoulder prosthesis, for shoulder replacement, revision and repair. The implants provide fixation into the best bone available to a surgeon. The implants are used in a superior-inferior and anterior-posterior construct forming a type of cross or X-shape. The implants allow for interchangeability of the articulating component as well as rotational orientation. The systems will allow for augments to accommodate bone loss. The implants may allow for additional security using screws or anchors inserted into the scapula.Type: GrantFiled: December 7, 2012Date of Patent: August 16, 2016Assignees: IMDS LLC, Cleveland Clinic FoundationInventors: Joseph Iannotti, Gerald Williams, Dinesh Koka, Michael Chad Hollis
-
Publication number: 20150094819Abstract: A joint prosthesis system, specifically a shoulder prosthesis, for shoulder replacement, revision and repair. The implants provide fixation into the best bone available to a surgeon. The implants are used in a superior-inferior and anterior-posterior construct forming a type of cross or X-shape. The implants allow for interchangeability of the articulating component as well as rotational orientation. The systems will allow for augments to accommodate bone loss. The implants may allow for additional security using screws or anchors inserted into the scapula.Type: ApplicationFiled: December 5, 2014Publication date: April 2, 2015Inventors: Joseph Iannotti, Gerald Williams, Dinesh Koka, Michael Chad Hollis
-
Patent number: 8920508Abstract: A joint prosthesis system, specifically a shoulder prosthesis, for shoulder replacement, revision and repair. The implants provide fixation into the best bone available to a surgeon. The implants are used in a superior-inferior and anterior-posterior construct forming a type of cross or X-shape. The implants allow for interchangeability of the articulating component as well as rotational orientation. The systems will allow for augments to accommodate bone loss. The implants may allow for additional security using screws or anchors inserted into the scapula.Type: GrantFiled: February 6, 2012Date of Patent: December 30, 2014Assignees: Cleveland Clinic Foundation, IMDS CorporationInventors: Joseph Iannotti, Gerald Williams, Dinesh Koka, Michael Chad Hollis
-
Patent number: 8686725Abstract: An apparatus includes a first magnetic resonance (MR) coil element configured to output a first set of MR data at a first output frequency and a first mixer coupled to the first MR coil element. The first mixer is configured to receive the first set of MR data from the first MR coil element and frequency translate the first set of MR data to a first offset frequency different from the first output frequency by a first offset value. The apparatus also includes a digitizer coupled to the first mixer and configured to convert the frequency-translated first set of MR data into a set of digital data and a transmission line coupled to the first mixer and to the digitizer, the transmission line configured to transmit the frequency-translated first set of MR data from the MR coil element to the digitizer without a balun coupled to the transmission line.Type: GrantFiled: June 29, 2009Date of Patent: April 1, 2014Assignee: General Electric CompanyInventors: Joseph Iannotti, Thomas K. F. Foo, Steven Go, Kevin Dufel
-
Patent number: 8611706Abstract: The present disclosure includes apparatus, system, and method embodiments that provide micro electro mechanical system optical switching and methods of manufacturing switches. For example, one optical switch embodiment includes at least one micro electro mechanical system type pivot mirror structure disposed along a path of an optical signal, the structure having a mirror and an actuator, and the mirror having a pivot axis along a first edge and having a second edge rotatable with respect to the pivot axis, the mirror being capable of and arranged to be actuated to pivot between a position parallel to a plane of an optical signal and a position substantially normal to the plane of the optical signal.Type: GrantFiled: November 10, 2008Date of Patent: December 17, 2013Assignee: Lockheed Martin CorporationInventors: Kevin J. Thorson, Rick C. Stevens, Charles J. Kryzak, Brian S. Leininger, William P. Kornrumpf, Glenn A. Forman, Joseph A. Iannotti, Olga B. Spahn, William D. Cowan, Daryl J. Dagel
-
Publication number: 20130150974Abstract: A joint prosthesis system, specifically a shoulder prosthesis, for shoulder replacement, revision and repair. The implants provide fixation into the best bone available to a surgeon. The implants are used in a superior-inferior and anterior-posterior construct forming a type of cross or X-shape. The implants allow for interchangeability of the articulating component as well as rotational orientation. The systems will allow for augments to accommodate bone loss. The implants may allow for additional security using screws or anchors inserted into the scapula.Type: ApplicationFiled: February 6, 2012Publication date: June 13, 2013Applicants: MedicineLodge, Inc. dba IMDS Co-Innovation, Cleveland Clinic FoundationInventors: Joseph Iannotti, Gerald Williams, Dinesh Koka, Michael Chad Hollis
-
Patent number: 8231683Abstract: A prosthesis assembly for use with a scapula is disclosed. The prosthesis assembly includes a glenoid bearing support and a bearing. The glenoid bearing support includes a glenoid vault-occupying portion configured to occupy at least a portion of a glenoid vault of the scapula, the glenoid-vault occupying portion having a first coupling component. The glenoid bearing support further includes a glenoid rim replacement portion attached to the glenoid vault-occupying portion. The bearing defines a bearing surface and has a second coupling component configured to cooperate with the first coupling component to couple the bearing to the glenoid vault-occupying portion. The glenoid vault-occupying portion defines a bearing-side end portion and an opposite-side end portion. The glenoid rim replacement portion projects outwardly from the bearing-side end portion of the glenoid vault-occupying portion. The glenoid bearing support defines a bone graft receptacle.Type: GrantFiled: December 8, 2009Date of Patent: July 31, 2012Assignee: DePuy Products, Inc.Inventors: Kyle Lappin, Matt Stone, Lieven De Wilde, Joseph Iannotti, Carl Basamania
-
Publication number: 20110137424Abstract: A prosthesis assembly for use with a scapula is disclosed. The prosthesis assembly includes a glenoid bearing support and a bearing. The glenoid bearing support includes a glenoid vault-occupying portion configured to occupy at least a portion of a glenoid vault of the scapula, the glenoid-vault occupying portion having a first coupling component. The glenoid bearing support further includes a glenoid rim replacement portion attached to the glenoid vault-occupying portion. The bearing defines a bearing surface and has a second coupling component configured to cooperate with the first coupling component to couple the bearing to the glenoid vault-occupying portion. The glenoid vault-occupying portion defines a bearing-side end portion and an opposite-side end portion. The glenoid rim replacement portion projects outwardly from the bearing-side end portion of the glenoid vault-occupying portion. The glenoid bearing support defines a bone graft receptacle.Type: ApplicationFiled: December 8, 2009Publication date: June 9, 2011Applicant: DePuy Products, Inc.Inventors: Kyle Lappin, Matt Stone, Lieven De Wilde, Joseph Iannotti, Carl Basamania
-
Patent number: 7952187Abstract: A system and method for forming a wafer level package (WLP) (i.e., wafer level chip size package) is disclosed. The WLP includes a silicon integrated circuit (IC) substrate having a plurality of die pads formed on a top surface thereof and a plurality of polymer laminates positioned thereon. Each of the polymer laminates is comprised of a separate pre-formed laminate sheet and has a plurality of vias formed therein that correspond to a respective die pad. A plurality of metal interconnects are formed on each of the plurality of polymer laminates so as to cover a portion of a top surface of a polymer laminate and extend down through the via and into contact with a metal interconnect on a neighboring polymer laminate positioned below. An input/output (I/O) system interconnect is positioned on a top surface of the wafer level package and is attached to the plurality of metal interconnects.Type: GrantFiled: March 31, 2008Date of Patent: May 31, 2011Assignee: General Electric CompanyInventors: Christopher James Kapusta, Donald Cunningham, Richard Joseph Saia, Kevin Durocher, Joseph Iannotti, William Hawkins
-
Publication number: 20100329527Abstract: An apparatus includes a first magnetic resonance (MR) coil element configured to output a first set of MR data at a first output frequency and a first mixer coupled to the first MR coil element. The first mixer is configured to receive the first set of MR data from the first MR coil element and frequency translate the first set of MR data to a first offset frequency different from the first output frequency by a first offset value. The apparatus also includes a digitizer coupled to the first mixer and configured to convert the frequency-translated first set of MR data into a set of digital data and a transmission line coupled to the first mixer and to the digitizer, the transmission line configured to transmit the frequency-translated first set of MR data from the MR coil element to the digitizer without a balun coupled to the transmission line.Type: ApplicationFiled: June 29, 2009Publication date: December 30, 2010Inventors: Joseph Iannotti, Thomas K.F. Foo, Steven Go, Kevin Dufel
-
Publication number: 20090243081Abstract: A system and method for forming a wafer level package (WLP) (i.e., wafer level chip size package) is disclosed. The WLP includes a silicon integrated circuit (IC) substrate having a plurality of die pads formed on a top surface thereof and a plurality of polymer laminates positioned thereon. Each of the polymer laminates is comprised of a separate pre-formed laminate sheet and has a plurality of vias formed therein that correspond to a respective die pad. A plurality of metal interconnects are formed on each of the plurality of polymer laminates so as to cover a portion of a top surface of a polymer laminate and extend down through the via and into contact with a metal interconnect on a neighboring polymer laminate positioned below. An input/output (I/O) system interconnect is positioned on a top surface of the wafer level package and is attached to the plurality of metal interconnects.Type: ApplicationFiled: March 31, 2008Publication date: October 1, 2009Inventors: Christopher James Kapusta, Donald Cunningham, Richard Joseph Saia, Kevin Durocher, Joseph Iannotti, William Hawkins
-
Patent number: 7431736Abstract: A kit and associated method is for implanting a prosthetic device in a resected bone such as a humerus. The kit includes a trial assembly including a trial body portion having a trial bore defined therein, and a trial head portion having (i) a trail head member which includes a trial offset indicia, and (ii) an eccentrically located trial stem extending from the trial head member, the trial head stem being configured to be received within the trial bore. The kit also includes a final prosthesis assembly including a final body portion having a final bore defined therein, and a final head portion having (i) a final head member which includes a final offset indicia, and (ii) an eccentrically located final head stem extending from the final head portion, the final head stem being configured to be received within the final bore.Type: GrantFiled: May 12, 2004Date of Patent: October 7, 2008Assignee: DePuy Products, Inc.Inventors: Brian Maroney, Michael Coon, Jeffrey Ondrla, Todd Durniak, Joseph Iannotti, Gerald Williams
-
Publication number: 20080065226Abstract: A kit (100) for use in performing joint arthroplasty on a head of a long bone (4) is provided. The kit (100) includes a first trial (102) including a first trial articulating surface (106) and an opposed first trial mounting surface (108) having a first trial location feature (110). The kit (100) also includes a second trial (104) including a second trial articulating surface (112) and an opposed second trial mounting surface (114) having a second trial location feature (116). The first trial articulating surface (106) and the second trial articulating surface (112) have different geometries and the first trial location feature (110) and the second trial location feature (116) have substantially identical geometries whereby different trials may be used with a common location feature.Type: ApplicationFiled: September 13, 2007Publication date: March 13, 2008Applicant: DePuy Products, Inc.Inventors: Jack Long, Joseph Iannotti, Gerald Williams
-
Publication number: 20070223003Abstract: An optical sensor interrogation system comprises: a multi-frequency optical source configured to generate an optical interrogation signal, at least one optical sensor configured to filter light at a wavelength corresponding to a value of a sensed parameter and generate an optical sensor data signal, a photodetector configured to detect a reference signal and the optical sensor data signal and generate an electrical difference frequency signal corresponding to a wavelength difference between the reference signal and the optical sensor data signal, and an electrical frequency measurement module configured to measure the electrical difference frequency.Type: ApplicationFiled: March 23, 2006Publication date: September 27, 2007Inventors: Glen Koste, Richard Frey, Joseph Iannotti
-
Publication number: 20060228121Abstract: A remote control system for a modulatable device is provided. The remote control system comprises a receiver system coupled to the modulatable device and configured to obtain an output characteristic of the modulatable device, the receiver system being located remotely with respect to the modulatable device. The system further comprises a command signal setting system coupled to the receiver system and configured to use the output characteristic to generate a drive command signal and a bias system coupled to the command signal setting system and configured to receive the drive command signal and set a bias point of the modulatable device based on the drive command signal. The bias system is located locally with respect to the modulatable device. The command signal setting system and the bias system are coupled via a first optical conduit.Type: ApplicationFiled: March 29, 2005Publication date: October 12, 2006Inventors: Todd Tolliver, Joseph Iannotti, Glen Koste, Selaka Bulumulla, Richard Frey