Abstract: A method for fabricating a nozzle plate having three dimensional features is provided. On a conductive surface, a plurality of non-conductive masked areas of selected dimensions are formed at locations corresponding to the locations of the holes of the desired nozzle plate. A layer of a first metal is electroformed onto the conductive surface until the layer of the first metal overgrows the masked areas by a selected amount. A first layer of a second metal is then electroformed over the layer of the first metal until a plurality of holes having diameters corresponding to the diameters of the holes of the desired nozzle plate are formedin the first layer of the second metal. Depressions formed in the first and second metal layers during the plating process are filled with a planarizing filler. A second layer of the second metal is then electroformed onto the first layer of the second metal to form a plurality of holes in registration with the depressions.

Abstract: An electrostatic or thermal printhead and method of fabrication is provided in which dielectric material is disposed in a row of spaced depressions or in a single recess along the upper surface of an edge of a dielectric-coated conductive sheet. Electrodes are disposed along the edge of the sheet over the dielectric material and terminate at associated conductive pads or printhead circuitry on the sheet. In one embodiment, the edge is trimmed and left bare to form an inexpensive electrostatic printhead. In an alternative embodiment, resistive material is disposed over the edge to connect the electrodes to the conductive sheet to form an inexpensive thermal printhead.

Abstract: An electrostatic or thermal printhead and method of fabrication is provided in which dielectric material is disposed in a row of spaced depressions or in a single recess along the upper surface of an edge of a dielectric-coated conductive sheet. Electrodes are disposed along the edge of the sheet over the dielectric material and terminate at associated conductive pads or printhead circuitry on the sheet. In one embodiment, the edge is trimmed and left bare to form an inexpensive electrostatic printhead. In an alternate embodiment, resistive material is disposed over the edge to connect the electrodes to the conductive sheet to form an inexpensive thermal printhead.

Abstract: An orifice plate and method of fabrication are provided in which the plate is constructed of two electroformed layers of metal. Onto a conductive mandrel a first layer of a first metal is electroformed to provide a support layer having a selected hole pattern. The first layer is then plated with a thick layer of a second metal and removed from the conductive mandrel exposing the bottom surface of the first layer. On the exposed bottom surface, a thin second layer of the first metal is electroformed to produce a pattern of holes of a selected smaller cross section in cooperation with the hole pattern of the first layer of the first metal. The thick layer of the second metal is then etched away, producing a thin metal orifice plate having a pattern of small holes of a selected cross section and supported between the holes by an additional, thicker layer of the same metal.

Abstract: A high-resolution thermal printhead and method of fabrication is provided. The printhead is of laminated construction in which densely packed circuitry required to achieve high resolution print is separated from other circuitry not requiring such dense packing. Therefore, the expensive fabrication processes required to produce the fine, high-resolution circuitry are limited to such circuitry, while less expensive fabrication processes are used to manufacture all other portions of the printhead.

Abstract: A thermal print head formed of a laminated sandwich structure, an edge of which serves as the print-head surface. Electrodes are carried on dielectric sheets, the electrodes having ends in contact with a layer of resistive material on the print head surface. When power is applied to selected electrodes, portions of the resistive material are heated, forming printing elements which mark thermal paper confronting the print-head surface. A heater and heat sensor are supported within the laminated structure on a separate dielectric surface from the electrodes, the heater and heat sensor being operative in combination with a temperature regulator to maintain the print head at a predetermined temperature.

Abstract: A thermal print head comprising a laminated structure having a dielectric sheet containing a plurality of electrodes having ends terminating along a common edge, and a conductive ground sheet disposed on the opposite side of the dielectric sheet from the electrodes and also terminating at the common edge. A resistive material is provided along the common edge in contact with the ground plane and electrodes. When power is applied to a selected electrode, a conductive path is established from the electrode through a portion of the resistive material and into the ground plane to complete an electrical circuit for heating the activated portion of resistive material which serves as a printing element for marking of thermal paper confronting the common edge of the print head. In an alternative embodiment, multiple rows of electrode ends can be grouped opposite to respective ground planes and can be energized in a multiplex addressing mode.

Abstract: An electrostatic print head and method of fabrication therefor in which a head is provided having a precision high resolution array of styli of intended cross-section and an interconnect pattern for simple connection to driving circuits. A planar thin film pattern of spaced metal electrode lines is provided by photolithographic and electroforming techniques on one surface of a glass or ceramic substrate, and a spaced array of planar thin film buss lines are similarly formed on the opposite surface. The electrode lines and buss lines are formed by vacuum deposition of a metal onto the substrate surfaces, etching into intended patterns, and electroforming to the required thickness and cross-sections. Electronic components can be provided in film form on the same substrate as the electrode lines.

Abstract: A high resolution thermal print head and method of fabrication is provided in which resistive elements are located at the edge of a dielectric support which functions as a spacer and is sandwiched between opposing substrates which carry vertically running electrodes on their inner faces. The electrodes extend to the edge of the spacer where they make electrical contact with opposing sides of the resistive elements. In one embodiment, the resistive elements are recessed into the edge of the spacer to minimize wear. The edge-on contact provided by the print head with the printing paper provides that all the supporting circuitry is orthogonal to the plane of the paper. In one embodiment, the spacer is provided with channels for coolant which is circulated immediately beneath the resistive elements.

Abstract: A bi-metal screen for the fabrication of precisely di-mentioned thick film elements and a method of screen fabrication. The bi-metal screen comprises a first metal screen which provides a web or mesh with accurately placed openings for holding a spacer sheet which contains the desired thick film pattern. The mesh is electroformed onto the spacer sheet, and a cavity with accurate cross section control corresponding to the dimensions of the desired thick film element is produced in the spacer sheet from the opposite side of the mesh. The spacer is also etched through the openings in the support mesh to permit inking of the thick film cavity from the mesh screen side. Accurate alignment is maintained between the opening of the support mesh and the pattern of the desired thick film elements during fabrication.