Abstract: A telecommunications shelf module is provided having electronic circuit packs and conductors extending from the circuit packs to an interface station for connection to conductors exterior of the pack, the module detachably mountable in a frame. The module preferably has a cooling arrangement included in its structure.

Abstract: Electronic circuit pack and mounting frame combination in which a mating connector joined to conductors coming in for connection to the circuit pack, is held within a connector holder for protection and connection purposes. Straight line action of the connector holder is ensured to ensure proper alignment of the mating connector with the circuit pack connector. It is preferable for the connector holder to be permanently attached to the frame to support the weight of the holder and minimize strain upon the incoming conductors.

Abstract: An improved electro-optic module able to sustain high voltage transients is disclosed. The module is able to eliminate unwanted signals by providing a discharge path for high voltage transients, away from the electronic and opto-devices. The module is comprised of an optical connector having a connecting end adapted to receive and secure an optical fiber cable, a circuit board attached to the optical connector and which is electrically isolated therefrom and means for isolating the circuit board from the connecting end of the optical connector.