Abstract: A circuit board retaining assembly for coupling a component to a chassis without concern for the loss of mounting hardware, such as for coupling computer hardware to a computer chassis, and for doing so particularly when the component is in operation. The retaining assembly includes a mounting bracket for mounting the assembly to the chassis, a lever extending from the mounting bracket, and a lever biasing member for pivotally biasing the lever away from the chassis when the component is installed in or removed from the chassis. The mounting bracket includes at least one lever opening for receiving the lever. The lever includes a first end for releasably coupling the component to the chassis. The lever-biasing member is disposed between the mounting bracket and the lever to bias the lever away from the chassis when it is disengaged from the chassis.

Abstract: A circuit board retaining assembly for coupling a component to a chassis without concern for the loss of mounting hardware, such as for coupling computer hardware to a computer chassis, and for doing so particularly when the component is in operation. The retaining assembly includes a mounting bracket for mounting the assembly to the chassis, a lever extending from the mounting bracket, and a lever biasing member for pivotally biasing the lever away from the chassis when the component is installed in or removed from the chassis. The mounting bracket includes at least one lever opening for receiving the lever. The lever includes a first end for releasably coupling the component to the chassis. The lever-biasing member is disposed between the mounting bracket and the lever to bias the lever away from the chassis when it is disengaged from the chassis. Also provided is a method for installing or removing a component in a chassis using the retaining assembly of the present invention.

Abstract: A method and apparatus relating to a support bracket (18) enabling hot-swapping of component trays (16) in component racks (10) is disclosed. A bracket (18) is provided for removably mounting a tray (16) in a component rack (10). The bracket (18) has two guide channels (20) extending substantially from a front end of the bracket (18) through to a back end. The guide channel (20) is adapted for sliding engagement with the component carrying tray (16). In addition, there is at least one stop guide (30) that projects from each of the front and back ends of the bracket (18). This stop guide (30) aids in positioning the bracket (18) during installation. On a backside of the bracket (18), there is a detent (32) that projects outward. The detent (32) serves as an aid in positioning and releasably holding the bracket (18) in place during installation.

Abstract: A test fixture which holds multiple circuit boards in an edge-to-edge configuration for testing includes a sliding interconnect mechanism which is located between the circuit boards under test. The interconnect mechanism includes an interconnect board on which are mounted pairs of inter-wired frame connectors which mate with the connectors on each of the printed circuit boards to be tested and electrically interconnect the boards. The interconnect mechanism includes guide pins on which the interconnect mechanism slides to accurately align the frame and board connectors and an actuating mechanism to move the interconnect mechanism into position to securely mate the aligned connectors. The actuating mechanism can also be reversed to unmate the connectors and release the boards under test after the tests are completed.

Abstract: For a circuit board populated with numerous components having different heights, the need for numerous individual heatsinks to accommodate the circuit board's multilevel surface is eliminated. Instead, heat is transferred to a single integral heatsink via a thermal-conductive material (i.e., a thermal phase change material and/or a resilient gap filling material). A fastener secures the thermal-conductive material between the bottom portion of the heatsink and the multilevel surface, and compresses the thermal-conductive material therein, creating a thermal path sufficient to transfer heat from the multilevel surface to the heatsink so that the circuit board operates within specified design parameters.