Patents by Inventor Joseph J. Sizensky
Joseph J. Sizensky has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 6380317Abstract: The present invention provides a process for generating mixed acetal polymers by reacting a hydroxyl containing polymer or monomer with vinyl ether and alcohol in the presence of an acid catalyst. The process of this invention provides a new class of polymers based on mixed acetals which are prepared in-situ with one reaction. The mixed acetal polymers are inexpensive to synthesize and readily reproducible. The resulting mixed acetal polymer is blended with a photoacid generator and dissolved in a solvent to produce a chemically amplified resist composition. A process for forming a pattern comprises the steps of providing the chemically amplified resist composition, coating a substrate with the resist composition, imagewise exposing the resist coated substrate to actinic radiation, and forming a resist image by developing the resist coated substrate.Type: GrantFiled: October 26, 1999Date of Patent: April 30, 2002Assignee: Arch Specialty Chemicals, Inc.Inventors: Sanjay Malik, Andrew J. Blakeney, Lawrence Ferreira, Joseph J. Sizensky, Brian E. Maxwell
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Patent number: 6309793Abstract: The present invention provides a process for generating mixed acetal polymers by reacting a hydroxyl containing polymer or monomer with vinyl ether and alcohol in the presence of an acid catalyst. The process of this invention provides a new class of polymers based on mixed acetals which are prepared in-situ with one reaction. The mixed acetal polymers are inexpensive to synthesize and readily reproducible. The resulting mixed acetal polymer is blended with a photoacid generator and dissolved in a solvent to produce a chemically amplified resist composition. A process for forming a pattern comprises the steps of providing the chemically amplified resist composition, coating a substrate with the resist composition, imagewise exposing the resist coated substrate to actinic radiation, and forming a resist image by developing the resist coated substrate.Type: GrantFiled: November 1, 2000Date of Patent: October 30, 2001Assignee: Arch Specialty Chemicals, Inc.Inventors: Sanjay Malik, Andrew J. Blakeney, Lawrence Ferreira, Joseph J. Sizensky, Brian E. Maxwell
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Patent number: 6159653Abstract: The present invention provides a process for generating mixed acetal polymers by reacting a hydroxyl containing polymer or monomer with vinyl ether and alcohol in the presence of an acid catalyst. The process of this invention provides a new class of polymers based on mixed acetals which are prepared in-situ with one reaction. The mixed acetal polymers are inexpensive to synthesize and readily reproducible. The resulting mixed acetal polymer is blended with a photoacid generator and dissolved in a solvent to produce a chemically amplified resist composition. A process for forming a pattern comprises the steps of providing the chemically amplified resist composition, coating a substrate with the resist composition, imagewise exposing the resist coated substrate to actinic radiation, and forming a resist image by developing the resist coated substrate.Type: GrantFiled: April 14, 1998Date of Patent: December 12, 2000Assignee: Arch Specialty Chemicals, Inc.Inventors: Sanjay Malik, Andrew J. Blakeney, Lawrence Ferreira, Joseph J. Sizensky, Brian E. Maxwell
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Patent number: 6133412Abstract: The present invention provides a process for generating mixed acetal polymers by reacting a hydroxyl containing polymer or monomer with vinyl ether and alcohol in the presence of an acid catalyst. The process of this invention provides a new class of polymers based on mixed acetals which are prepared in-situ with one reaction. The mixed acetal polymers are inexpensive to synthesize and readily reproducible. The resulting mixed acetal polymer is blended with a photoacid generator and dissolved in a solvent to produce a chemically amplified resist composition. A process for forming a pattern comprises the steps of providing the chemically amplified resist composition, coating a substrate with the resist composition, imagewise exposing the resist coated substrate to actinic radiation, and forming a resist image by developing the resist coated substrate.Type: GrantFiled: October 26, 1999Date of Patent: October 17, 2000Assignee: Arch Chemicals, Inc.Inventors: Sanjay Malik, Andrew J. Blakeney, Lawrence Ferreira, Joseph J. Sizensky, Brian E. Maxwell
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Patent number: 6027853Abstract: The present invention relates to a process for preparing a radiation-sensitive composition, comprising the steps of (1) passing a solution of a crude polymer comprising a mixture of polymer chains having different molecular weights through a porous polymeric media having a predetermined molecular weight cut-off (MWCO) value, thereby separating the crude polymeric mixture into a first fraction comprising polymer chains having molecular weights above the MWCO value and a second fraction comprising polymer chains having molecular weights below the MWCO value; and (2) adding at least one fraction produced in the first step to at least one radiation-sensitive compound and at least one solvent to produce a radiation-sensitive composition.Type: GrantFiled: January 16, 1998Date of Patent: February 22, 2000Assignee: Olin Microelectronic Chemicals, Inc.Inventors: Sanjay Malik, Andrew J. Blakeney, Joseph J. Sizensky
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Patent number: 5494785Abstract: A phenolic novolak composition prepared by a process comprising the steps of:(1) reacting a first phenolic monomer comprising a major portion of at least one trifunctional phenolic monomer with a first aldehyde source in the absence of a catalyst at a reaction temperature from about 100.degree. C. to about 200.degree. C. and at a reaction pressure of about 2 to about 15 atmospheres to form a phenolic oligomer having a weight average molecular weight from about 500 to about 2,000, having ortho-ortho bonding of about 55% to about 75% of the methylene bonds between the phenolic moieties; and having a time to clear of less than 125 seconds per micron; wherein the mole ratio of said first aldehyde source to said first phenolic monomer is from about 0.3:1.0 to about 0.55:1.0; and(2) then reacting said oligomer with an optional second phenolic source and a second aldehyde source at a temperature from about 80.degree. C. to about 150.degree. C.Type: GrantFiled: January 17, 1995Date of Patent: February 27, 1996Assignee: OCG Microelectronic Materials, Inc.Inventors: Joseph J. Sizensky, Thomas R. Sarubbi, Medhat A. Toukhy
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Patent number: 5473045Abstract: A phenolic novolak composition prepared by a process comprising the steps of:(1) reacting a first phenolic monomer comprising a major portion of at least one trifunctional phenolic monomer with a first aldehyde source in the absence of a catalyst at a reaction temperature from about 100.degree. C. to about 200.degree. C. and at a reaction pressure of about 2 to about 15 atmospheres to form a phenolic oligomer having a weight average molecular weight from about 500 to about 2,000, having ortho--ortho bonding of about 55% to about 75% of the methylene bonds between the phenolic moieties; and having a time to clear of less than 125 seconds per micron; wherein the mole ratio of said first aldehyde source to said first phenolic monomer is from about 0.3:1.0 to about 0.55:1.0; and(2) then reacting said oligomer with an optional second phenolic source and a second aldehyde source at a temperature from about 80.degree. C. to about 150.degree. C.Type: GrantFiled: January 17, 1995Date of Patent: December 5, 1995Assignee: OCG Microelectronic Materials, Inc.Inventors: Joseph J. Sizensky, Thomas R. Sarubbi, Medhat A. Toukhy
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Patent number: 5413894Abstract: A phenolic novolak composition prepared by a process comprising the steps of:(1) reacting a first phenolic monomer comprising a major portion of at least one trifunctional phenolic monomer with a first aldehyde source in the absence of a catalyst at a reaction temperature from about 100.degree. C. to about 200.degree. C. and at a reaction pressure of about 2 to about 15 atmospheres to form a phenolic oligomer having a weight average molecular weight from about 500 to about 2,000, having ortho-ortho bonding of about 55% to about 75% of the methylene bonds between the phenolic moieties; and having a time to clear of less than 125 seconds per micron; wherein the mole ratio of said first aldehyde source to said first phenolic monomer is from about 0.3:1.0 to about 0.55:1.0; and(2) then reacting said oligomer with an optional second phenolic source and a second aldehyde source at a temperature from about 80.degree. C. to about 150.degree. C.Type: GrantFiled: May 7, 1993Date of Patent: May 9, 1995Assignee: OCG Microelectronic Materials, Inc.Inventors: Joseph J. Sizensky, Thomas R. Sarubbi, Medhat A. Toukhy
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Patent number: 5350827Abstract: A novolak resin composition comprising at least one unit of the reaction product of a para-, para-bonded bisphenol having formula (A): ##STR1## wherein R.sub.1 =hydrogen, lower alkyl group having 1-4 carbon atoms, halogen, or lower alkoxy group having 1-4 carbon atoms;wherein R.sub.2 =hydrogen or lower alkyl group having 1-4 carbon atoms; andwherein X is selected from the group consisting of: CH.sub.2, CH(CH.sub.3), C(CH.sub.3).sub.2, O, and S;with a bismethylol monomer selected from a difunctional ortho-, ortho-phenolic bismethylol of Formula (B), a difunctional ortho-, para-phenolic bismethylol of Formula (C): ##STR2## wherein R.sub.3 is selected from CH.sub.3, CH.sub.2 CH.sub.3, Cl, and Br; andwherein R.sub.4 is selected from H and CH.sub.3.Type: GrantFiled: February 9, 1994Date of Patent: September 27, 1994Assignee: OCG Microelectronic Materials, Inc.Inventors: Thomas R. Sarubbi, Joseph J. Sizensky
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Patent number: 5338652Abstract: A novolak resin composition comprising at least one unit of the reaction product of a para-, para-bonded bisphenol having formula (A): ##STR1## wherein R.sub.1 =hydrogen, lower alkyl group having 1-4 carbon atoms, halogen, or lower alkoxy group having 1-4 carbon atoms; whereinR.sub.2 =hydrogen or lower alkyl group having 1-4 carbon atoms; and whereinX is selected from the group consisting of: CH.sub.2, CH(CH.sub.3), C(CH.sub.3).sub.2, O, and S;with a bismethylol monomer selected from a difunctional ortho-, ortho-phenolic bismethylol of Formula (B), a difunctional ortho-, para-phenolic bismethylol of Formula (C): ##STR2## wherein R.sub.3 is selected from CH.sub.3, CH.sub.2 CH.sub.3, Cl, and Br; and whereinR.sub.4 is selected from H and CH.sub.3.Type: GrantFiled: February 9, 1994Date of Patent: August 16, 1994Assignee: OCG Microelectronic Marterials, Inc.Inventors: Thomas R. Sarubbi, Joseph J. Sizensky
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Patent number: 5306594Abstract: A novolak resin composition comprising at least one unit of the reaction product of a para-, para-bonded bisphenol having formula (A): ##STR1## wherein R.sub.1 =hydrogen, lower alkyl group having 1-4 carbon atoms, halogen, or lower alkoxy group having 1-4 carbon atoms;wherein R.sub.2 =hydrogen or lower alkyl group having 1-4 carbon atoms; andwherein X is selected from the group consisting of: CH.sub.2, CH(CH.sub.3), C(CH.sub.3).sub.2, O, and S;with a bismethylol monomer selected from a difunctional ortho-, ortho-phenolic bismethylol of Formula (B), a difunctional ortho-, para-phenolic bismethylol of Formula (C): ##STR2## wherein R.sub.3 is selected from CH.sub.3, CH.sub.2 CH.sub.3, Cl, and Br; andwherein R.sub.4 is selected from H and CH.sub.3.Type: GrantFiled: November 4, 1991Date of Patent: April 26, 1994Assignee: OCG Microelectronic Materials, Inc.Inventors: Thomas R. Sarubbi, Joseph J. Sizensky
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Patent number: 5053479Abstract: A phenolic novolak resin comprising the product of a condensation reaction of an aldehyde comprising a haloacetaldehyde source or a mixture of a haloacetaldehyde source and a formaldehyde source with a phenolic monomer comprising at least one compound of the formula: ##STR1## wherein R.sub.1, R.sub.2 and R.sub.3 are individually selected from hydrogen or a one to four carbon alkyl group and wherein the ratio of total carbon atoms in the sum of R.sub.1, R.sub.2 and R.sub.3 to the total number of phenolic nuclei in said resin is from about 0.5:1 to about 1.5:1 in the presence of a solvent; said resin made by employing a molar ratio of total aldehyde to total phenolic monomers from about 0.33:1 to about 0.70:1. These phenolic resins are suitable for use in light-sensitive compositions (e.g. positive-working photoresists).Type: GrantFiled: June 18, 1990Date of Patent: October 1, 1991Assignee: OCG Microelectronic Materials, Inc.Inventors: Andrew J. Blakeney, Thomas Sarubbi, Joseph J. Sizensky
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Patent number: 5001040Abstract: A phenolic novolak resin comprising the product of a condensation reaction of an aldehyde comprising a haloacetaldehyde source or a mixture of a haloacetaldehyde source and a formaldehyde source with a phenolic monomer comprising at least one compound of the formula: ##STR1## wherein R.sub.1, R.sub.2 and R.sub.3 are individually selected from hydrogen or a one to four carbon alkyl group and wherein the ratio of total carbon atoms in the sum of R.sub.1, R.sub.2 and R.sub.3 to the total number of phenolic nuclei in said resin is from about 0.5:1 to about 1.5:1 in the presence of a solvent; said resin made by employing a molar ratio of total aldehyde to total phenolic monomers from about 0.33:1 to about 0.70:1. These phenolic resins are suitable for use in light-sensitive compositions (e.g. positive-working photoresists).Type: GrantFiled: June 18, 1990Date of Patent: March 19, 1991Assignee: Olin Hunt Specialty Products Inc.Inventors: Andrew J. Blakeney, Thomas Sarubbi, Joseph J. Sizensky
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Patent number: 4959292Abstract: A phenolic novolak resin comprising the product of a condensation reaction of an aldehyde comprising a haloacetaldehyde source or a mixture of a haloacetaldehyde source and a formaldehyde source with a phenolic monomer comprising at least one compound of the formula: ##STR1## wherein R.sub.1, R.sub.2 and R.sub.3 are individually selected from hydrogen or a one to four carbon alkyl group and wherein the ratio of total carbon atoms in the sum of R.sub.1, R.sub.2 and R.sub.3 to the total number of phenolic nuclei in said resin is from about 0.5:1 to about 1.5:1 in the presence of a solvent; said resin made by employing a molar ratio of total aldehyde to total phenolic monomers from about 0.33:1 to about 0.70:1. These phenolic resins are suitable for use in light-sensitive compositions (e.g. positive-working photoresists).Type: GrantFiled: July 11, 1988Date of Patent: September 25, 1990Assignee: Olin Hunt Specialty Products Inc.Inventors: Andrew J. Blakeney, Thomas Sarubbi, Joseph J. Sizensky
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Patent number: 4617251Abstract: Disclosed is a stripping composition for effectively removing an organic polymeric material from a substrate. The stripping composition is essentially free of phenol compounds and halogenated hydrocarbon compounds and contains a select amine compound and an organic polar solvent. It has been found that the stripping composition is highly effective, even when the organic polymeric material to be removed from a substrate is a positive resist which has been subjected to high temperature post-baking operations.Type: GrantFiled: April 11, 1985Date of Patent: October 14, 1986Assignee: Olin Hunt Specialty Products, Inc.Inventor: Joseph J. Sizensky