Abstract: A printhead includes a multi-crystalline silicon substrate including a surface with portions of the multi-crystalline silicon substrate defining a liquid channel. A nozzle plate structure is disposed on the surface of the multi-crystalline silicon substrate with portions of the nozzle plate structure defining a nozzle. The nozzle is in fluid communication with the liquid channel. A drop forming mechanism is associated with the nozzle plate structure and is controllably operable to form either a liquid drop from a continuous liquid stream flowing through the nozzle or eject a liquid drop on demand from liquid present in the nozzle.

Abstract: A method for producing optically planar surfaces for micro-electromechanical system devices (MEMS), comprising the steps of: depositing a first layer over a substrate; forming a channel in the first layer wherein the channel has a depth defined by a thickness of the first layer and a width greater than 10 microns; depositing a second layer over the first layer wherein the second layer has a thickness greater than the depth of the channel and is composed of a different material than the first layer; removing the second layer from outside the channel leaving an overlap at the edge of the channel; and polishing the second layer that fills the channel to obtain an optically planar surface for the MEMS device.

Abstract: A method for forming lenslets of a solid-state imager, includes providing a first etch-stop layer on a spacer layer formed on a substrate or layer(s) on a substrate; providing a patterned first photosensitive resin layer to form a first mask pattern; performing an etch transfer of the first mask pattern to the first photosensitive resin layer to form a first etch-stop mask pattern, and removing the first photosensitive resin layer; providing a transparent lenslet-forming layer on the spacer layer.

Abstract: A method for forming lenslets which collect light and focus the light onto photosensitive elements of an electronic imager. The method includes providing a transparent lenslet-forming layer on a substrate or on layers on the substrate, forming a thin etch-stop layer on the transparent lenslet-forming layer and patterning a thin photosensitive resin mask on the etch-stop layer so that the mask pattern corresponds to lenslets to be formed. The method further includes transferring by etching the pattern of the photosensitive resin mask to the thin etch-stop layer to form a thin etch-stop mask, anisotropically plasma etching the transparent lenslet-forming layer according to the patterned thin etch-stop mask, removing the thin etch-stop mask, and thermally reflowing the etched transparent lenslet-forming layer to form the lenslets.

Abstract: A method for forming lenslets which collect light and focuses it onto photosensitive elements of an electronic imager includes providing a transparent lenslet-forming layer on a substrate or on layers on the substrate and forming a thin etch-stop layer on the transparent lenslet-forming layer and patterning the etch-stop layer so that the mask pattern corresponds to lenslets to be formed, The method further includes anisotropically plasma etching the transparent lenslet-forming layer according to the thin etch-stop mask pattern, removing the thin etch-stop mask, and thermally reflowing the patterned transparent layer to form the transparent lenslets.