Abstract: A process for producing sodium gold sulfite in solution is described. The sodium gold sulfite solution is useful in gold electroplating baths, and can be used in applications which require pure, soft gold deposits.

Abstract: This invention provides a process of making a palladium replenisher comprising a complex of palladium tetraammine sulfate. The process includes distilling a palladium nitrate solution at a temperature maintained at or below about 115° C. Palladium sulfate and ammonium hydroxide are then added to make the palladium tetraamine sulfate replenisher from solution. The replenisher of the invention is used to replenish depleted palladium during palladium electroplating to maintain the palladium concentration in the bath within from about 5 to about 10 weight percent of recommended plating bath levels.

Abstract: The specification describes novel rhodium sulfate complex solutions which have a minimum of metal to metal complexing and are mostly complexed through the sulfate groups. Use of these solutions as electrolytes for plating rhodium results in electroplated layers with improved brightness and reduced stress.

Abstract: An apparatus for measuring the throwing power of electroplating solutions which provides a nearly linear current density distribution across the panel. The apparatus includes a cylindrical body adapted for rotation about a longitudinal axis thereof, a cylindrical cathode arranged coaxially about a central portion of the cylindrical body, an anode coaxially positioned at a lower end portion of the cylindrical body, a conical shield coaxially arranged around an upper end portion of the cathode; and an annular disk-baffle coaxially arranged around a lower end portion of the cathode. The conical shield and the disk-baffle provide a substantially linear current distribution over the cathode.

Abstract: A process for producing sodium gold sulfite in solution is described. The sodium gold sulfite solution is useful in gold electroplating baths, and can be used in applications which require pure, soft gold deposits. A process is also described whereby the sodium gold sulfite solution can be solidified by a freeze-drying process.

Abstract: A lead frame comprising an ultra-thin composite of noble metal layers on a nickel surface is disclosed. The composite ranges from 2.5 to 11 microinches in thickness and includes in succession from nickel, a 0.5 to 3.5 microinches of palladium or gold strike, a 0.5 to 5 microinches thick palladium-nickel alloy layer having 10 to 90 weight percent nickel by weight of the alloy, a 0.5 to 5 microinches thick palladium layer, and a 0 to 1 microinch thick gold layer. The gold layer is being used whenever it is desirable to achieve high speed of solder wetting, relative to the speed of solder wetting of palladium. Viable ultra-thin coatings are most effectively obtained by deposition of the layers in a reel-to-reel metal deposition process.