Patents by Inventor Joseph K. V. Comeau
Joseph K. V. Comeau has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10571490Abstract: A probe tip structure that decreases the accumulation rate of Sn particles to the probe tip and enables considerably more efficient and complete laser cleaning is disclosed. In an embodiment, the probe structure includes an array of probe tips, each probe tip having an inner core; an interfacial layer bonded to the inner core; and an outer layer bonded to the interfacial layer, wherein the outer layer is resistant to adherence of the solder of the ball grid array package.Type: GrantFiled: October 26, 2017Date of Patent: February 25, 2020Assignee: International Business Machines CorporationInventors: David M. Audette, Dennis M. Bronson, Jr., Joseph K. V. Comeau, Dustin M. Fregeau, David L. Gardell, Frederick H. Roy, III, James R. Salimeno, III, Timothy D. Sullivan
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Publication number: 20180059141Abstract: A probe tip structure that decreases the accumulation rate of Sn particles to the probe tip and enables considerably more efficient and complete laser cleaning is disclosed. In an embodiment, the probe structure includes an array of probe tips, each probe tip having an inner core; an interfacial layer bonded to the inner core; and an outer layer bonded to the interfacial layer, wherein the outer layer is resistant to adherence of the solder of the ball grid array package.Type: ApplicationFiled: October 26, 2017Publication date: March 1, 2018Inventors: David M. Audette, Dennis M. Bronson, Jr., Joseph K. V. Comeau, Dustin M. Fregeau, David L. Gardell, Frederick H. Roy, III, James R. Salimeno, III, Timothy D. Sullivan
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Patent number: 9835653Abstract: A probe tip structure that decreases the accumulation rate of Sn particles to the probe tip and enables considerably more efficient and complete laser cleaning is disclosed. In an embodiment, the probe structure includes an array of probe tips, each probe tip having an inner core; an interfacial layer bonded to the inner core; and an outer layer bonded to the interfacial layer, wherein the outer layer is resistant to adherence of the solder of the ball grid array package.Type: GrantFiled: May 13, 2014Date of Patent: December 5, 2017Assignee: International Business Machines CorporationInventors: David M. Audette, Dennis M. Bronson, Jr., Joseph K. V. Comeau, Dustin M. Fregeau, David L. Gardell, Frederick H. Roy, III, James R. Salimeno, III, Timothy D. Sullivan
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Publication number: 20150331014Abstract: A probe tip structure that decreases the accumulation rate of Sn particles to the probe tip and enables considerably more efficient and complete laser cleaning is disclosed. In an embodiment, the probe structure includes an array of probe tips, each probe tip having an inner core; an interfacial layer bonded to the inner core; and an outer layer bonded to the interfacial layer, wherein the outer layer is resistant to adherence of the solder of the ball grid array package.Type: ApplicationFiled: May 13, 2014Publication date: November 19, 2015Applicant: International Business Machines CorporationInventors: David M. Audette, Dennis M. Bronson, JR., Joseph K. V. Comeau, Dustin M. Fregeau, David L. Gardell, Frederick H. Roy, III, James R. Salimeno, III, Timothy D. Sullivan
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Patent number: 8636917Abstract: A solution for forming a polishing slurry, the polishing slurry and related methods are disclosed. The solution for forming a polishing slurry may include 1H-benzotriazole (BTA) dissolved in an ionic surfactant such as a sodium alkyl sulfate solution, and perhaps a polyacrylic acid (PAA) solution. The solution can be filtered and used in a polishing slurry. This approach to solubilizing BTA results in a high BTA concentration in a polishing slurry without addition of foreign components to the slurry or increased safety hazard. In addition, the solution is easier to ship because it is very stable (e.g., can be frozen and thawed) and has less volume compared to conventional approaches. Further, the polishing slurry performance is vastly improved due to the removal of particles that can cause scratching.Type: GrantFiled: September 7, 2010Date of Patent: January 28, 2014Assignee: International Business Machines CorporationInventors: Joseph K. V. Comeau, Marina M. Katsnelson, Matthew T. Tiersch, Eric J. White
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Patent number: 8328892Abstract: A solution for forming a polishing slurry, the polishing slurry and related methods are disclosed. The solution for forming a polishing slurry may include 1 H-benzotriazole (BTA) dissolved in an ionic surfactant such as a sodium alkyl sulfate solution, and perhaps a polyacrylic acid (PAA) solution. The solution can be filtered and used in a polishing slurry. This approach to solubilizing BTA results in a high BTA concentration in a polishing slurry without addition of foreign components to the slurry or increased safety hazard. In addition, the solution is easier to ship because it is very stable (e.g., can be frozen and thawed) and has less volume compared to conventional approaches. Further, the polishing slurry performance is vastly improved due to the removal of particles that can cause scratching.Type: GrantFiled: October 31, 2007Date of Patent: December 11, 2012Assignee: International Business Machines CorporationInventors: Joseph K. V. Comeau, Marina M. Katsnelson, Matthew T. Tiersch, Eric J. White
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Publication number: 20100327219Abstract: A solution for forming a polishing slurry, the polishing slurry and related methods are disclosed. The solution for forming a polishing slurry may include 1H-benzotriazole (BTA) dissolved in an ionic surfactant such as a sodium alkyl sulfate solution, and perhaps a polyacrylic acid (PAA) solution. The solution can be filtered and used in a polishing slurry. This approach to solubilizing BTA results in a high BTA concentration in a polishing slurry without addition of foreign components to the slurry or increased safety hazard. In addition, the solution is easier to ship because it is very stable (e.g., can be frozen and thawed) and has less volume compared to conventional approaches. Further, the polishing slurry performance is vastly improved due to the removal of particles that can cause scratching.Type: ApplicationFiled: September 7, 2010Publication date: December 30, 2010Inventors: Joseph K. V. Comeau, Marina M. Katsnelson, Matthew T. Tiersch, Eric J. White
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Patent number: 7824568Abstract: A solution for forming a polishing slurry, the polishing slurry and related methods are disclosed. The solution for forming a polishing slurry may include 1H-benzotriazole (BTA) dissolved in an ionic surfactant such as a sodium alkyl sulfate solution, and perhaps a polyacrylic acid (PAA) solution. The solution can be filtered and used in a polishing slurry. This approach to solubilizing BTA results in a high BTA concentration in a polishing slurry without addition of foreign components to the slurry or increased safety hazard. In addition, the solution is easier to ship because it is very stable (e.g., can be frozen and thawed) and has less volume compared to conventional approaches. Further, the polishing slurry performance is vastly improved due to the removal of particles that can cause scratching.Type: GrantFiled: August 17, 2006Date of Patent: November 2, 2010Assignee: International Business Machines CorporationInventors: Joseph K. V. Comeau, Marina M. Katsnelson, Matthew T. Tiersch, Eric J. White
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Publication number: 20090064763Abstract: A test environment and an associated method of testing and analyzing a semiconductor package material containing a molding compound, for stability in a sustained oxygen environment. Test samples are exposed to a pressurized gas containing oxygen, under elevated temperature below the glass transition temperature of the molding compound. Control samples are exposed to a pressurized inert gas under similar or more severe conditions of gas pressure, temperature, and humidity. At least one characteristic common to the test samples and the control samples is measured. A determination is made as to whether there exists at least one significant difference between the at least one measured characteristic of the test samples and the control samples.Type: ApplicationFiled: July 18, 2008Publication date: March 12, 2009Inventors: Joseph K. V. Comeau, Adele M. Mahoney, Jason P. Ritter, Gerald J. Scilla, Charles H. Wilson
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Patent number: 7442552Abstract: A test environment and an associated method of testing and analyzing a semiconductor package material containing a molding compound, for stability in a sustained oxygen environment. Test samples are exposed to a pressurized gas containing oxygen, under elevated temperature below the glass transition temperature of the molding compound. Control samples are exposed to a pressurized inert gas under similar or more severe conditions of gas pressure, temperature, and humidity. At least one characteristic common to the test samples and the control samples is measured. A determination is made as to whether there exists at least one significant difference between the at least one measured characteristic of the test samples and the control samples.Type: GrantFiled: September 26, 2007Date of Patent: October 28, 2008Assignee: International Business Machines CorporationInventors: Joseph K. V. Comeau, Adele M. Mahoney, Jason P. Ritter, Gerald J. Scilla, Charles H. Wilson
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Publication number: 20080042099Abstract: A solution for forming a polishing slurry, the polishing slurry and related methods are disclosed. The solution for forming a polishing slurry may include 1 H-benzotriazole (BTA) dissolved in an ionic surfactant such as a sodium alkyl sulfate solution, and perhaps a polyacrylic acid (PAA) solution. The solution can be filtered and used in a polishing slurry. This approach to solubilizing BTA results in a high BTA concentration in a polishing slurry without addition of foreign components to the slurry or increased safety hazard. In addition, the solution is easier to ship because it is very stable (e.g., can be frozen and thawed) and has less volume compared to conventional approaches. Further, the polishing slurry performance is vastly improved due to the removal of particles that can cause scratching.Type: ApplicationFiled: August 17, 2006Publication date: February 21, 2008Inventors: Joseph K. V. Comeau, Marina M. Katsnelson, Matthew T. Tiersch, Eric J. White
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Patent number: 7300796Abstract: A test environment and an associated method of testing and analyzing a semiconductor package material containing a molding compound, for stability in a sustained oxygen environment. Test samples are exposed to a pressurized gas containing oxygen, under elevated temperature below the glass transition temperature of the molding compound. Control samples are exposed to a pressurized inert gas under similar or more severe conditions of gas pressure, temperature, and humidity. At least one characteristic common to the test samples and the control samples is measured. A determination is made as to whether there exists at least one significant difference between the at least one measured characteristic of the test samples and the control samples.Type: GrantFiled: September 9, 2003Date of Patent: November 27, 2007Assignee: International Business Machines CorporationInventors: Joseph K. V. Comeau, Adele M. Mahoney, Jason P. Ritter, Gerald J. Scilla, Charles H. Wilson