Abstract: A method of positioning a component in a desired position on a board is provided. The method includes the steps of: (a) picking up the component with a nozzle of a movable placement unit of a pick and place machine; (b) transporting the component towards the board as a function of the desired position; (c) obtaining sensor data about an orientation of the component with respect to the nozzle with a sensor of the placement unit; (d) obtaining in the sensor rotational data about the orientation of the nozzle with respect to the placement unit; (e) combining in the sensor the sensor data and the rotational data into a data set; (f) sending the data set from the sensor to a stationary computer and computing a correction instruction in the stationary computer; and (g) placing the component on the board as a function of the correction instruction from the stationary computer.

Abstract: A method of positioning a component in a desired position on a board is provided. The method includes the steps of: (a) picking up the component with a nozzle of a movable placement unit of a pick and place machine; (b) transporting the component towards the board as a function of the desired position; (c) obtaining sensor data about an orientation of the component with respect to the nozzle with a sensor of the placement unit; (d) obtaining in the sensor rotational data about the orientation of the nozzle with respect to the placement unit; (e) combining in the sensor the sensor data and the rotational data into a data set; (f) sending the data set from the sensor to a stationary computer and computing a correction instruction in the stationary computer; and (g) placing the component on the board as a function of the correction instruction from the stationary computer.

Abstract: A method of positioning a component in a desired position on a board is provided. The method includes the steps of: (a) picking up the component with a nozzle of a movable placement unit of a pick and place machine; (b) transporting the component towards the board as a function of the desired position; (c) obtaining sensor data about an orientation of the component with respect to the nozzle with a sensor of the placement unit; (d) obtaining in the sensor rotational data about the orientation of the nozzle with respect to the placement unit; (e) combining in the sensor the sensor data and the rotational data into a data set; (f) sending the data set from the sensor to a stationary computer and computing a correction instruction in the stationary computer; and (g) placing the component on the board as a function of the correction instruction from the stationary computer.

Abstract: A component placement unit for placing a component on a substrate, which component placement unit comprises at least one nozzle which is rotatable about a central axis, by means of which a component can be picked up and placed on the substrate. The component placement unit further comprises at least one sensor for determining the orientation of the component relative to the nozzle. At least one optical element is disposed between said sensor and said nozzle. A first focus plane of the optical element at least substantially coincides with the central axis of the nozzle, whilst a second focus plane substantially coincides with the sensor, wherein an image produced by means of the sensor is a contour image of the component.

Abstract: A device comprises an imaging device, a placement element connected to the imaging device for placing a component on a substrate, as well as an optical system having an optical axis. The placement element and the imaging device can be jointly moved relative to the optical system to at least a position in which the optical axis is located between the imaging device and the placement element, wherein the position of a component supported by the placement element can be detected by means of the imaging device. The optical system is telecentric at least in an image space located near the imaging device as well as in an object space located near the placement element.

Abstract: A device comprises an imaging device, a placement element connected to the imaging device for placing a component on a substrate, as well as an optical system having an optical axis. The placement element and the imaging device can be jointly moved relative to the optical system to at least a position in which the optical axis is located between the imaging device and the placement element, wherein the position of a component supported by the placement element can be detected by means of the imaging device. The optical system is telecentric at least in an image space located near the imaging device as well as in an object space located near the placement element.

Abstract: An illumination and imaging system is provided with a co-axial illuminator that does not include a beamsplitter. The co-axial illuminator achieves efficiencies substantially in excess of those achieved with a beamsplitter. In one aspect, an optical stop is used to reflect illumination upon a target. The optical stop includes an aperture allowing light reflected from the target to pass to a detector. The aperture of the stop has an asymmetrical feature that facilitates operation on specular targets.

Abstract: An electronics assembly system includes an image acquisition system that is coupled to a controller through an improved interface. The coupling facilitates advanced monitoring and control of the image acquisition system. Multiple image acquisition systems can be coupled to the controller over the same interface.

Abstract: An electronics assembly system includes an image acquisition system that is coupled to a controller through an improved interface. The coupling facilitates advanced monitoring and control of the image acquisition system. Multiple image acquisition systems can be coupled to the controller over the same interface.

Abstract: An illumination and imaging system is provided with a co-axial illuminator that does not include a beamsplitter. The co-axial illuminator achieves efficiencies substantially in excess of those achieved with a beamsplitter. In one aspect, an optical stop is used to reflect illumination upon a target. The optical stop includes an aperture allowing light reflected from the target to pass to a detector. The aperture of the stop has an asymmetrical feature that facilitates operation on specular targets.

Abstract: The height of a surface (25) along an axis (4) is determined by measuring the axial position of an irradiated spot (31) formed on the surface at the intersection of the surface and the axis. Radiation reflected by the surface and collected by a lens (8) forms an image spot (32) on the axis (4). The position of the image spot is determined by measuring the intensity of the radiation at at least three positions along the axis by means of a detection unit (35). The output signals (44, 44') of the detection unit are processed in an electronic means (43) for determining the position of the highest radiation intensity and for supplying a signal (43') whose magnitude represents the axial position of the image spot (32), hence, of the irradiated spot (31 ).

Abstract: The height of a surface (21) is determined by measuring the position of a radiation spot (11) located on the surface (21). The radiation spot (11) is formed by a narrow incident beam (10). Radiation reflected in the radiation spot (11) is projected on two position-sensitive radiation detection systems (41, 42). The detection systems (41, 42) are arranged at a different optical distance from the radiation spot (11). With the aid of a partially transparent mirror (3), or in a different manner, it is ensured that the intensity distribution on the detection systems (41, 42) is uniform. A line (G) through the radiation spot (11) is constructed by determining the same characteristic point (G.sub.I, G.sub.II), for example, the point of gravity in the intensity distributions at different optical distances from the radiation spot (11). The height of the spot (11) and hence of the surface (21) is determined by means of this line.

Abstract: An optical scanning device comprises an optical system for imaging a part of the surface (10) to be scanned on the detection system (22-25; 122-125). The optical system comprises an objective system (43) and two cylindrical lenses (41, 42) and/or two systems of cylindrical mirrors (141a, 141b, 142a, 142b). In the direction in which the cylindrical lenses (41, 42) have their optical power, the objective system (43) functions as an imaging lens so that a light-intensive and spatial image of the surface is formed at the detection system (22-25). Due to the achieved large numerical aperture, the image formed can also be observed three-dimensionally so that information about the profile of the surface can be obtained by means of the scanning device.