Abstract: A method of attaching a MEMS die to a surface includes centering and rotationally aligning a solder perform on a solder surface of a body, centering and rotationally aligning a MEMS die on the solder preform, and heating the solder perform in a reflow process until the solder is molten and surface tension of the molten solder moves the MEMS die to a position where the surface tensions balance, and the MEMS die is centered on, and rotationally aligned with, the solder surface of the body.

Abstract: A method of attaching a MEMS die to a base includes selecting an attachment material (x), determining a maximum acceptable change in pressure due to mounting stress (dPtarget) transmitted to a MEMS die, determining a worst-case pressure difference transfer function of the attachment material (x) over a thickness (h) variation of the attachment material (x) using the equation: dPmaxx=h*Bx+Cx, wherein B=pressure variation/thickness (h), and C=pressure variation, substituting dPtarget for dPmaxx in the pressure difference transfer function and solving the equation for h, wherein h=(dPtarget?Cx)/Bx, and attaching the MEMS die to a base using the selected attachment material (x) having at least the calculated thickness (h).

Abstract: An improved aerosol dispensing apparatus includes an aerosol container, a discharge piece, an actuator, a flow control canister valve assembly attached to the aerosol container, a battery, and an electronically controlled flow control valve electronically connected to the battery and in fluid communication with the flow control canister valve assembly. The aerosol container and the attached flow control canister valve assembly are further attached to the actuator and the actuator is mounted for slidable movement within the discharge piece. The flow control canister valve assembly is movable between an open position wherein a volume of an aerosol formulation is directed from the aerosol container through the flow control canister valve assembly to the electronically controlled flow control valve, and a closed position wherein the aerosol formulation is not permitted to flow through the flow control canister valve assembly to the electronically controlled flow control valve.

Abstract: A method of attaching a MEMS die to a mounting surface includes coating an inside surface of a pressure port of a fluid inlet member with a layer of solder mask, the fluid inlet member having a first axial end, a second axial end, and a port opening of the pressure port formed in the second axial end of the fluid inlet member. A solder preform is disposed on the mounting surface of the fluid inlet member and a MEMS die is disposed on the solder preform. The solder preform is heated in a re-flow operation to attach the MEMS die to the mounting surface, wherein the solder mask within the pressure port prevents molten solder from entering the pressure port during the re-flow operation.

Abstract: A multi-layer, stress-isolation platform configured for attaching a MEMS die to a base includes a first platform, a first layer of attachment material between the base and the first platform and attaching the first platform to the base, a MEMS die, and a second layer of attachment material between the first platform and the MEMS die and attaching the MEMS die to the first platform.

Abstract: A method of attaching a MEMS die to a surface includes centering and rotationally aligning a solder perform on a solder surface of a body, centering and rotationally aligning a MEMS die on the solder preform, and heating the solder perform in a reflow process until the solder is molten and surface tension of the molten solder moves the MEMS die to a position where the surface tensions balance, and the MEMS die is centered on, and rotationally aligned with, the solder surface of the body.

Abstract: A method of attaching a MEMS die to a surface includes centering and rotationally aligning a solder perform on a solder surface of a body, centering and rotationally aligning a MEMS die on the solder preform, and heating the solder perform in a reflow process until the solder is molten and surface tension of the molten solder moves the MEMS die to a position where the surface tensions balance, and the MEMS die is centered on, and rotationally aligned with, the solder surface of the body.

Abstract: A method of attaching a MEMS die to a surface includes centering and rotationally aligning a solder perform on a solder surface of a body, centering and rotationally aligning a MEMS die on the solder preform, and heating the solder perform in a reflow process until the solder is molten and surface tension of the molten solder moves the MEMS die to a position where the surface tensions balance, and the MEMS die is centered on, and rotationally aligned with, the solder surface of the body.

Abstract: A method of attaching a MEMS die to a base includes selecting an attachment material (x), determining a maximum acceptable change in pressure due to mounting stress (dPtarget) transmitted to a MEMS die, determining a worst-case pressure difference transfer function of the attachment material (x) over a thickness (h) variation of the attachment material (x) using the equation: dPmaxx=h*Bx+Cx, wherein B=pressure variation/thickness (h), and C=pressure variation, substituting dPtarget for dPmaxx in the pressure difference transfer function and solving the equation for h, wherein h=(dPtarget?Cx)/Bx, and attaching the MEMS die to a base using the selected attachment material (x) having at least the calculated thickness (h).

Abstract: A method of attaching a MEMS die to a mounting surface includes coating an inside surface of a pressure port of a fluid inlet member with a layer of solder mask, the fluid inlet member having a first axial end, a second axial end, and a port opening of the pressure port formed in the second axial end of the fluid inlet member. A solder preform is disposed on the mounting surface of the fluid inlet member and a MEMS die is disposed on the solder preform. The solder preform is heated in a re-flow operation to attach the MEMS die to the mounting surface, wherein the solder mask within the pressure port prevents molten solder from entering the pressure port during the re-flow operation.

Abstract: A multi-layer, stress-isolation platform configured for attaching a MEMS die to a base includes a first platform, a first layer of attachment material between the base and the first platform and attaching the first platform to the base, a MEMS die, and a second layer of attachment material between the first platform and the MEMS die and attaching the MEMS die to the first platform.

Abstract: An improved aerosol dispensing apparatus includes an aerosol container, a discharge piece, an actuator, a flow control canister valve assembly attached to the aerosol container, a battery, and an electronically controlled flow control valve electronically connected to the battery and in fluid communication with the flow control canister valve assembly. The aerosol container and the attached flow control canister valve assembly are further attached to the actuator and the actuator is mounted for slidable movement within the discharge piece. The flow control canister valve assembly is movable between an open position wherein a volume of an aerosol formulation is directed from the aerosol container through the flow control canister valve assembly to the electronically controlled flow control valve, and a closed position wherein the aerosol formulation is not permitted to flow through the flow control canister valve assembly to the electronically controlled flow control valve.

Abstract: A method of attaching a MEMS die to a surface includes centering and rotationally aligning a solder perform on a solder surface of a body, centering and rotationally aligning a MEMS die on the solder preform, and heating the solder perform in a reflow process until the solder is molten and surface tension of the molten solder moves the MEMS die to a position where the surface tensions balance, and the MEMS die is centered on, and rotationally aligned with, the solder surface of the body.