Patents by Inventor Joseph Laughter

Joseph Laughter has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multilayered board comprising folded flexible circuits and method of manufacture
    Patent number: 6668447
    Abstract: An easier and cheaper way to obtain multilayer circuit board is by using a flexible circuit board and folding it in an organized pattern. Flexible circuit has the unique property of being a three-dimensional circuit that can be shaped in multiplanar configurations, rigidized in specific areas, and molded to backer boards for specific applications. The folded circuit is fabricated from a series of foldable circuit board strips and rigid circuit board strips which are interconnected, folded, and bonded into a composite structure. The foldable strips may have prefolds arranged so that a group of upper foldable strips and lower foldable strips are folded in opposite directions. A plurality of intermediate portions are stacked on each other by the folding the foldable strips in opposite directions. The folded circuit, can be bonded after a first fold, or folded further to achieve a greater reduction in area and subsequently be bonded as a composite multilayer structure.
    Type: Grant
    Filed: September 12, 2002
    Date of Patent: December 30, 2003
    Assignees: St. Jude Children's Research Hospital, The University of Tennessee Research Corporation
    Inventors: Sanjiv Singh Samant, Jinesh Jitendra Jain, Joseph Laughter
  • Multilayered board comprising folded flexible circuits and method of manufacture
    Publication number: 20030095389
    Abstract: An easier and cheaper way to obtain multilayer circuit board is by using a flexible circuit board and folding it in an organized pattern. Flexible circuit has the unique property of being a three-dimensional circuit that can be shaped in multiplanar configurations, rigidized in specific areas, and molded to backer boards for specific applications. The folded circuit is fabricated from a series of foldable circuit board strips and rigid circuit board strips which are interconnected, folded, and bonded into a composite structure. The foldable strips may have prefolds arranged so that a group of upper foldable strips and lower foldable strips are folded in opposite directions. A plurality of intermediate portions are stacked on each other by the folding the foldable strips in opposite directions. The folded circuit, can be bonded after a first fold, or folded further to achieve a greater reduction in area and subsequently be bonded as a composite multilayer structure.
    Type: Application
    Filed: September 12, 2002
    Publication date: May 22, 2003
    Inventors: Sanjiv Singh Samant, Jinesh Jitendra Jain, Joseph Laughter
  • Multilayered board comprising folded flexible circuits
    Patent number: 6483713
    Abstract: An easier and cheaper way to obtain multilayer circuit board is by using a flexible circuit board and folding it in an organized pattern. Flexible circuit has the unique property of being a three-dimensional circuit that can be shaped in multiplanar configurations, rigidized in specific areas, and molded to backer boards for specific applications. The folded circuit is fabricated from a series of foldable circuit board strips and rigid circuit board strips which are interconnected, folded, and bonded into a composite structure. The foldable strips may have prefolds arranged so that a group of upper foldable strips and lower foldable strips are folded in opposite directions. A plurality of intermediate portions are stacked on each other by the folding the foldable strips in opposite directions. The folded circuit, can be bonded after a first fold, or folded further to achieve a greater reduction in area and subsequently be bonded as a composite multilayer structure.
    Type: Grant
    Filed: November 20, 2001
    Date of Patent: November 19, 2002
    Assignees: St. Jude Children's Research Hospital, The University of Tennessee Research Corp.
    Inventors: Sanjiv Singh Samant, Jinesh Jitendra Jain, Joseph Laughter
  • Multilayered board comprising folded flexible circuits and methods of manufacture
    Publication number: 20020075660
    Abstract: An easier and cheaper way to obtain multilayer circuit board is by using a flexible circuit board and folding it in an organized pattern. Flexible circuit has the unique property of being a three-dimensional circuit that can be shaped in multiplanar configurations, rigidized in specific areas, and molded to backer boards for specific applications. The folded circuit is fabricated from a series of foldable circuit board strips and rigid circuit board strips which are interconnected, folded, and bonded into a composite structure. The foldable strips may have prefolds arranged so that a group of upper foldable strips and lower foldable strips are folded in opposite directions. A plurality of intermediate portions are stacked on each other by the folding the foldable strips in opposite directions. The folded circuit, can be bonded after a first fold, or folded further to achieve a greater reduction in area and subsequently be bonded as a composite multilayer structure.
    Type: Application
    Filed: November 20, 2001
    Publication date: June 20, 2002
    Applicant: St. Jude Children's Research Hospital
    Inventors: Sanjiv Singh Samant, Jinesh Jitendra Jain, Joseph Laughter