Patents by Inventor Joseph Lento

Joseph Lento has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070178714
    Abstract: A method, system and scan lens for use therein are provided for high-speed, laser-based, precise laser trimming at least one electrical element along a trim path. The method includes generating a pulsed laser output with a laser, the output having one or more laser pulses at a repetition rate. A fast rise/fall time, pulse-shaped q-switched laser or an ultra-fast laser may be used. Beam shaping optics may be used to generate a flat-top beam profile. Each laser pulse has a pulse energy, a laser wavelength within a range of laser wavelengths, and a pulse duration. The wavelength is short enough to produce desired short-wavelength benefits of small spot size, tight tolerance, high absorption and reduced or eliminated heat-affected zone (HAZ) along the trim path, but not so short so as to cause microcracking. In this way, resistance drift after the trimming process is reduced.
    Type: Application
    Filed: January 25, 2007
    Publication date: August 2, 2007
    Inventors: Bo Gu, Jonathan Ehrmann, Joseph Lento, Bruce Couch, Yun Chu, Shepard Johnson
  • Publication number: 20070096763
    Abstract: A laser processing system implements a method for aligning a probe element (e.g., a probe pin) with a device interface element (e.g., a contact pad of a circuit substrate). First, the laser processing system generates an optical reference beam at one or more predetermined positions to calibrate a reference field. The laser processing system then detects a position of the probe element in the reference field. The laser processing system also determines a relative position of the device interface element in the reference field. Based on the position of the probe element and the device interface element, the laser processing system then initiates alignment of the probe element and the device interface element. In one application, alignment of the probe element and the device interface element further includes contacting the probe element to the device interface element to make an electrical connection.
    Type: Application
    Filed: October 18, 2006
    Publication date: May 3, 2007
    Applicant: GSI Group Corporation
    Inventors: Jonathan Ehrmann, Patrick Duffy, Markus Weber, Gregg Metzger, Joseph Lento, Pierre-Yves Mabboux, Jens Zink, Yun Chu
  • Publication number: 20060205121
    Abstract: A method and system for high-speed, precise micromachining an array of devices are disclosed wherein improved process throughput and accuracy, such as resistor trimming accuracy, are provided. The number of resistance measurements are limited by using non-measurement cuts, using non-sequential collinear cutting, using spot fan-out parallel cutting, and using a retrograde scanning technique for faster collinear cuts. Non-sequential cutting is also used to manage thermal effects and calibrated cuts are used for improved accuracy. Test voltage is controlled to avoid resistor damage.
    Type: Application
    Filed: May 2, 2006
    Publication date: September 14, 2006
    Applicant: GSI Lumonics Corporation
    Inventors: Bruce Couch, Jonathan Ehrmann, Joseph Lento, Shepard Johnson
  • Publication number: 20060160332
    Abstract: A method, system and scan lens system are provided for high-speed, laser-based, precise laser trimming at least one electrical element. The method includes generating a pulsed laser output having one or more laser pulses at a repetition rate. Each laser pulse has a pulse energy, a laser wavelength within a range of laser wavelengths, and a pulse duration. The method further includes selectively irradiating the at least one electrical element with the one or more laser pulses focused into at least one spot having a non-uniform intensity profile along a direction and a spot diameter as small as about 6 microns to about 15 microns so as to cause the one or more laser pulses to selectively remove material from the at least one element and laser trim the at least one element while avoiding substantial microcracking within the at least one element.
    Type: Application
    Filed: October 6, 2005
    Publication date: July 20, 2006
    Inventors: Bo Gu, Joseph Lento, Jonathan Ehrmann, Bruce Couch, Yun Chu, Shepard Johnson
  • Publication number: 20050233537
    Abstract: A method and system for high-speed, precise micromachining an array of devices are disclosed wherein improved process throughput and accuracy, such as resistor trimming accuracy, are provided. The number of resistance measurements are limited by using non-measurement cuts, using non-sequential collinear cutting, using spot fan-out parallel cutting, and using a retrograde scanning technique for faster collinear cuts. Non-sequential cutting is also used to manage thermal effects and calibrated cuts are used for improved accuracy. Test voltage is controlled to avoid resistor damage.
    Type: Application
    Filed: May 18, 2005
    Publication date: October 20, 2005
    Applicant: GSI Lumonics Corporation
    Inventors: Bruce Couch, Jonathan Ehrmann, Yun Chu, Joseph Lento, Shepard Johnson