Abstract: A binder jet printing apparatus (10), along with methods of its use, is provided. The binder jet printing apparatus (10) may include: a job box (18) having a actuatable build plate (46) therein; a supply box (54) having a bottom platform (56) that is actuatable within the supply box (54); a print system including at least one print head (32) connected to a binder source (38) and configured to apply a pattern of binder onto an exposed powder layer (42) over the build plate (46) of the job box (18); a recoat system (16) including a recoater configured to move from the supply box (54) to the job box (18) to transfer powder from the supply box (54) to the job box (18) so as to form a new powder layer (48) over the build plate (46) of the job box (18); and a cure system (14) configured to direct electromagnetic radiation onto the job box (18).

Abstract: A method for forming an object includes moving a recoat assembly (200) in a coating direction over a build material, wherein the recoat assembly (200) comprises a first roller (202) and a second roller (204) that is spaced apart from the first roller; rotating the first roller (202) of the recoat assembly in a counter-rotation direction, such that a bottom of the first roller moves in the coating direction; contacting the build material with the first roller of the recoat assembly, thereby fluidizing at least a portion of the build material; irradiating, with a front energy source (260) coupled to a front end of the recoat assembly, an initial layer of build material positioned in a build area; subsequent to irradiating the initial layer of build material, spreading the build material on the build area with the first roller, thereby depositing a second layer of the build material over the initial layer of build material; and subsequent to spreading the second layer of the build material, irradiating, with a r

Abstract: A binder jet printing apparatus (10), along with methods of its use, is provided. The binder jet printing apparatus (10) may include: a job box (18) having a actuatable build plate (46) therein; a supply box (54) having a bottom platform (56) that is actuatable within the supply box (54); a print system including at least one print head (32) connected to a binder source (38) and configured to apply a pattern of binder onto an exposed powder layer (42) over the build plate (46) of the job box (18); a recoat system (16) including a recoater configured to move from the supply box (54) to the job box (18) to transfer powder from the supply box (54) to the job box (18) so as to form a new powder layer (48) over the build plate (46) of the job box (18); and a cure system (14) configured to direct electromagnetic radiation onto the job box (18).

Abstract: A power converter is provided. The power converter includes a first phase including a first upper diode and a first lower diode, a second phase including a second upper diode and a second lower diode, a third phase including a third upper diode and a third lower diode, a plurality of MOSFETs, each of the first upper diode, the first lower diode, the second upper diode, the second lower diode, the third upper diode, and the third lower diode electrically connected in parallel with a respective one of the plurality of MOSFETs, and a control system configured to selectively activate each MOSFET when current flows through a diode electrically coupled in parallel with that MOSFET.

Abstract: A power electronics system is provided. The system includes at least one outer wall defining an outer zone including a plurality of first electronic components having a first normal operating maximum temperature and capable of generating electromagnetic fields. The system further includes at least one inner wall defining an inner zone disposed within the outer zone and including a plurality of second electronic components having a second normal operating maximum temperature, the first normal operating maximum temperature higher than the second normal operating maximum temperature, the inner zone substantially electromagnetically sealed against electromagnetic interference generated by the plurality of first electronic components.

Abstract: A power converter is provided. The power converter includes a first phase including a first upper diode and a first lower diode, a second phase including a second upper diode and a second lower diode, a third phase including a third upper diode and a third lower diode, a plurality of MOSFETs, each of the first upper diode, the first lower diode, the second upper diode, the second lower diode, the third upper diode, and the third lower diode electrically connected in parallel with a respective one of the plurality of MOSFETs, and a control system configured to selectively activate each MOSFET when current flows through a diode electrically coupled in parallel with that MOSFET.

Abstract: A power electronics system is provided. The system includes at least one outer wall defining an outer zone including a plurality of first electronic components having a first normal operating maximum temperature and capable of generating electromagnetic fields. The system further includes at least one inner wall defining an inner zone disposed within the outer zone and including a plurality of second electronic components having a second normal operating maximum temperature, the first normal operating maximum temperature higher than the second normal operating maximum temperature, the inner zone substantially electromagnetically sealed against electromagnetic interference generated by the plurality of first electronic components.

Abstract: A film capacitor is presented. The film capacitor includes a thermally conductive support. The thermally conductive support includes a core including a first end and a second end. The thermally conductive support further includes a protrusion extending from at least one of the first end and the second end of the core, where at least one of the core and the protrusion includes a phase change material. Further, the film capacitor also includes a plurality of films disposed on at least a portion of the thermally conductive support, where the plurality of films includes a plurality of electrode films and a dielectric film. Further, the thermally conductive support for the film capacitor and a method of forming the film capacitor are also presented.

Abstract: A film capacitor is presented. The film capacitor includes a thermally conductive support. The thermally conductive support includes a core including a first end and a second end. The thermally conductive support further includes a protrusion extending from at least one of the first end and the second end of the core, where at least one of the core and the protrusion includes a phase change material. Further, the film capacitor also includes a plurality of films disposed on at least a portion of the thermally conductive support, where the plurality of films includes a plurality of electrode films and a dielectric film. Further, the thermally conductive support for the film capacitor and a method of forming the film capacitor are also presented.

Abstract: A cooling device for a power module having an electronic module disposed on a base plate via a substrate is disclosed. The cooling device includes a heat sink plate having at least one cooling segment. The cooling segment includes an inlet plenum for entry of a cooling medium, a plurality of inlet manifold channels, a plurality of outlet manifold channels, and an outlet plenum. The plurality of inlet manifold channels are coupled orthogonally to the inlet plenum for receiving the cooling medium from the inlet plenum. The plurality of outlet manifold channels are disposed parallel to the inlet manifold channels. The outlet plenum is coupled orthogonally to the plurality of outlet manifold channels for exhaust of the cooling medium. A plurality of millichannels are disposed in the base plate orthogonally to the inlet and the outlet manifold channels. The plurality of milli channels direct the cooling medium from the plurality of inlet manifold channels to the plurality of outlet manifold channels.

Abstract: A busbar for power conversion applications that includes two planar conductors that have terminal locations; a first planar insulator located between the planar conductors; two impedances elements that are electrically connected to each of the planar conductors, wherein the impedance elements each extend in a plane that is non-coplanar from the planar conductors, further wherein the impedance elements are configured so as to define a gap between them; and a second planar insulator is located in the gap. A power conversion assembly that connects an energy source and a power switch to the busbar.

Abstract: A power-converting apparatus, such as a power module, may include a base plate (16), a first direct current (DC) bus and a second DC bus (22, 24). A power semiconductor component (18, 20) may be electrically coupled to one of the buses, and may be disposed on a substrate (12, 14) physically coupled to the base plate. The power semiconductor component may be made from a high-temperature, wide bandgap material, and the substrate may be exposed to a heat flux based on an operational temperature of the power semiconductor component. At least a first capacitor (50) may be coupled across the first and second DC buses, and at least second and third capacitors (52) may be respectively coupled across respective ones of the first and second buses and an alternating current (AC) return path.

Abstract: A power-converting apparatus, such as a power module, may include a base plate (16), a first direct current (DC) bus and a second DC bus (22, 24). A power semiconductor component (18, 20) may be electrically coupled to one of the buses, and may be disposed on a substrate (12, 14) physically coupled to the base plate. The power semiconductor component may be made from a high-temperature, wide bandgap material, and the substrate may be exposed to a heat flux based on an operational temperature of the power semiconductor component. At least a first capacitor (50) may be coupled across the first and second DC buses, and at least second and third capacitors (52) may be respectively coupled across respective ones of the first and second buses and an alternating current (AC) return path.

Abstract: A cooling device for a power module having an electronic module disposed on a base plate via a substrate is disclosed. The cooling device includes a heat sink plate having at least one cooling segment. The cooling segment includes an inlet plenum for entry of a cooling medium, a plurality of inlet manifold channels, a plurality of outlet manifold channels, and an outlet plenum. The plurality of inlet manifold channels are coupled orthogonally to the inlet plenum for receiving the cooling medium from the inlet plenum. The plurality of outlet manifold channels are disposed parallel to the inlet manifold channels. The outlet plenum is coupled orthogonally to the plurality of outlet manifold channels for exhaust of the cooling medium. A plurality of millichannels are disposed in the base plate orthogonally to the inlet and the outlet manifold channels. The plurality of milli channels direct the cooling medium from the plurality of inlet manifold channels to the plurality of outlet manifold channels.

Abstract: A busbar for power conversion applications that includes two planar conductors that have terminal locations; a first planar insulator located between the planar conductors; two impedances elements that are electrically connected to each of the planar conductors, wherein the impedance elements each extend in a plane that is non-coplanar from the planar conductors, further wherein the impedance elements are configured so as to define a gap between them; and a second planar insulator is located in the gap. A power conversion assembly that connects an energy source and a power switch to the busbar is disclosed. The present invention has been described in terms of specific embodiment(s), and it is recognized that equivalents, alternatives, and modifications, aside from those expressly stated, are possible and within the scope of the appending claims.

Abstract: A power module includes one or more semiconductor power devices bonded to an insulated metal substrate (IMS). A plurality of cooling fluid channels is integrated into the IMS.

Abstract: A power module includes one or more semiconductor power devices bonded to an insulated metal substrate (IMS). A plurality of cooling fluid channels is integrated into the IMS.

Abstract: A cooling device comprises an upper surface configured to contact the baseplate, an inlet manifold configured to receive a coolant, an outlet manifold configured to exhaust the coolant, and at least one set of millichannels in the upper surface. The at least one set of the millichannels defines at least one heat sink region with at least one groove about one or more millichannels in the respective heat sink region with the groove configured to receive a seal. The at least one heat sink region establishes direct contact of the coolant with the baseplate, and the millichannels are configured to receive the coolant from the inlet manifold and to deliver the coolant to the outlet manifold. An apparatus and a stack are also presented.

Abstract: A reactive power compensation system includes a distributed energy resource situated at a local location configured to also receive power from a remote location by a distribution feeder line. The distributed energy resource includes an inverter including power semiconductor switching devices and an inverter controller configured for controlling the power semiconductor switching devices so as to provide reactive power support to the distribution feeder line.

Abstract: A method for storing data including: providing a first substrate having a plurality of micro-holograms therein, the micro-holograms being indicative of the data; providing a second hologram-supporting substrate; illuminating the plurality of micro-holograms in the first substrate through the second substrate, thereby producing a holographic pattern in the second substrate indicative of reflections of the plurality of micro-holograms in the first substrate; providing a third hologram-supporting substrate; and, illuminating the holographic pattern in the second substrate through the third substrate, thereby substantially replicating the plurality of micro-holograms in the first substrate in the third substrate.