Patents by Inventor Joseph Lutsky

Joseph Lutsky has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10512936
    Abstract: An ultrasonic transducer includes a membrane, a bottom electrode, and a plurality of cavities disposed between the membrane and the bottom electrode, each of the plurality of cavities corresponding to an individual transducer cell. Portions of the bottom electrode corresponding to each individual transducer cell are electrically isolated from one another. Each portion of the bottom electrode corresponds to each individual transducer that cell further includes a first bottom electrode portion and a second bottom electrode portion, the first and second bottom electrode portions electrically isolated from one another.
    Type: Grant
    Filed: June 20, 2018
    Date of Patent: December 24, 2019
    Assignee: Butterfly Network, Inc.
    Inventors: Susan A. Alie, Keith G. Fife, Joseph Lutsky, David Grosjean
  • Publication number: 20190336104
    Abstract: An ultrasound device is described. The ultrasound device may include a cavity, a membrane, and a sensing electrode. When an electrical signal is applied to the sensing electrode and a static bias is applied to the membrane, the membrane vibrates within the cavity and produces ultrasonic signals. The cavity, the membrane, and the sensing electrode may be considered a capacitive micromachined ultrasonic transducer (CMUT). The sensing electrode may be shaped as a ring, whereby the central portion of the sensing electrode is removed. Removal of the central portion of the sensing electrode may reduce the parasitic capacitance without substantially affecting the production of ultrasonic signals by the CMUT. This, in turn, can result in an increase in the signal-to-noise ratio (SNR) of the ultrasonic signals. The ultrasound device may further include a bond pad configured for wire bonding, and a trench electrically isolating the bond pad from the membrane.
    Type: Application
    Filed: May 2, 2019
    Publication date: November 7, 2019
    Applicant: Butterfly Network, Inc.
    Inventors: KEITH G. FIFE, Jianwei Liu, Joseph Lutsky, Sarp Satir, Jungwook Yang
  • Publication number: 20190336099
    Abstract: Micromachined ultrasonic transducers having pressure ports are described. The micromachined ultrasonic transducers may comprise flexible membranes configured to vibrate over a cavity. The cavity may be sealed, in some instances by the membrane itself. A pressure port may provide access to the cavity, and thus control of the cavity pressure. In some embodiments, an ultrasound device including an array of micromachined ultrasonic transducers is provided, with pressure ports for at least some of the ultrasonic transducers. The pressure ports may be used to control pressure across the array.
    Type: Application
    Filed: May 2, 2019
    Publication date: November 7, 2019
    Applicant: Butterfly Network, Inc.
    Inventors: Keith G. Fife, Jianwei Liu, Jungwook Yang, Joseph Lutsky
  • Publication number: 20190261954
    Abstract: Aspects of the technology described herein relate to an ultrasound device including a first die that includes an ultrasonic transducer, a first application-specific integrated circuit (ASIC) that is bonded to the first die and includes a pulser, and a second ASIC in communication with the second ASIC that includes integrated digital receive circuitry. In some embodiments, the first ASIC may be bonded to the second ASIC and the second ASIC may include analog processing circuitry and an analog-to-digital converter. In such embodiments, the second ASIC may include a through-silicon via (TSV) facilitating communication between the first ASIC and the second ASIC. In some embodiments, SERDES circuitry facilitates communication between the first ASIC and the second ASIC and the first ASIC includes analog processing circuitry and an analog-to-digital converter. In some embodiments, the technology node of the first ASIC is different from the technology node of the second ASIC.
    Type: Application
    Filed: May 6, 2019
    Publication date: August 29, 2019
    Applicant: Butterfly Network, Inc.
    Inventors: Kailiang Chen, Nevada J. Sanchez, Susan A. Alie, Tyler S. Ralston, Jonathan M. Rothberg, Keith G. Fife, Joseph Lutsky
  • Publication number: 20190261955
    Abstract: Aspects of the technology described herein relate to an ultrasound device including a first die that includes an ultrasonic transducer, a first application-specific integrated circuit (ASIC) that is bonded to the first die and includes a pulser, and a second ASIC in communication with the second ASIC that includes integrated digital receive circuitry. In some embodiments, the first ASIC may be bonded to the second ASIC and the second ASIC may include analog processing circuitry and an analog-to-digital converter. In such embodiments, the second ASIC may include a through-silicon via (TSV) facilitating communication between the first ASIC and the second ASIC. In some embodiments, SERDES circuitry facilitates communication between the first ASIC and the second ASIC and the first ASIC includes analog processing circuitry and an analog-to-digital converter. In some embodiments, the technology node of the first ASIC is different from the technology node of the second ASIC.
    Type: Application
    Filed: May 6, 2019
    Publication date: August 29, 2019
    Applicant: Butterfly Network, Inc.
    Inventors: Kailiang Chen, Nevada J. Sanchez, Susan A. Alie, Tyler S. Ralston, Jonathan M. Rothberg, Keith G. Fife, Joseph Lutsky
  • Publication number: 20190160490
    Abstract: An ultrasonic transducer includes a membrane, a bottom electrode, and a plurality of cavities disposed between the membrane and the bottom electrode, each of the plurality of cavities corresponding to an individual transducer cell. Portions of the bottom electrode corresponding to each individual transducer cell are electrically isolated from one another. Each portion of the bottom electrode corresponds to each individual transducer that cell further includes a first bottom electrode portion and a second bottom electrode portion, the first and second bottom electrode portions electrically isolated from one another.
    Type: Application
    Filed: January 10, 2019
    Publication date: May 30, 2019
    Applicant: Butterfly Network, Inc.
    Inventors: Susan A. Alie, Keith G. Fife, Joseph Lutsky, David Grosjean
  • Publication number: 20190142387
    Abstract: Aspects of the technology described herein relate to an ultrasound device including a first die that includes an ultrasonic transducer, a first application-specific integrated circuit (ASIC) that is bonded to the first die and includes a pulser, and a second ASIC in communication with the second ASIC that includes integrated digital receive circuitry. In some embodiments, the first ASIC may be bonded to the second ASIC and the second ASIC may include analog processing circuitry and an analog-to-digital converter. In such embodiments, the second ASIC may include a through-silicon via (TSV) facilitating communication between the first ASIC and the second ASIC. In some embodiments, SERDES circuitry facilitates communication between the first ASIC and the second ASIC and the first ASIC includes analog processing circuitry and an analog-to-digital converter. In some embodiments, the technology node of the first ASIC is different from the technology node of the second ASIC.
    Type: Application
    Filed: November 15, 2018
    Publication date: May 16, 2019
    Applicant: Butterfly Network, Inc.
    Inventors: Kailiang Chen, Nevada J. Sanchez, Susan A. Alie, Tyler S. Ralston, Jonathan M. Rothberg, Keith G. Fife, Joseph Lutsky
  • Publication number: 20180376253
    Abstract: Aspects of the technology described herein relate to ultrasound circuits that employ a differential ultrasonic transducer element, such as a differential micromachined ultrasonic transducer (MUT) element. The differential ultrasonic transducer element may be coupled to an integrated circuit that is configured to operate the differential ultrasonic transducer element in one or more modes of operation, such as a differential receive mode, a differential transmit mode, a single-ended receive mode, and a single-ended transmit mode.
    Type: Application
    Filed: June 22, 2018
    Publication date: December 27, 2018
    Applicant: Butterfly Network, Inc.
    Inventors: Joseph Lutsky, Nevada J. Sanchez, Kailiang Chen, Keith G. Fife, Tyler S. Ralston
  • Publication number: 20180369862
    Abstract: An ultrasonic transducer includes a membrane, a bottom electrode, and a plurality of cavities disposed between the membrane and the bottom electrode, each of the plurality of cavities corresponding to an individual transducer cell. Portions of the bottom electrode corresponding to each individual transducer cell are electrically isolated from one another. Each portion of the bottom electrode corresponds to each individual transducer that cell further includes a first bottom electrode portion and a second bottom electrode portion, the first and second bottom electrode portions electrically isolated from one another.
    Type: Application
    Filed: June 20, 2018
    Publication date: December 27, 2018
    Applicant: Butterfly Network, Inc.
    Inventors: Susan A. Alie, Keith G. Fife, Joseph Lutsky, David Grosjean
  • Publication number: 20180243792
    Abstract: Processes for fabricating capacitive micromachined ultrasonic transducers (CMUTs) are described, as are CMUTs of various doping configurations. An insulating layer separating conductive layers of a CMUT may be formed by forming the layer on a lightly doped epitaxial semiconductor layer. Dopants may be diffused from a semiconductor substrate into the epitaxial semiconductor layer, without diffusing into the insulating layer. CMUTs with different configurations of N-type and P-type doping are also described.
    Type: Application
    Filed: February 26, 2018
    Publication date: August 30, 2018
    Applicant: Butterfly Network, Inc.
    Inventors: Jonathan M. Rothberg, Keith G. Fife, Susan A. Alie, Joseph Lutsky, David Grosjean
  • Patent number: 9136864
    Abstract: A digital-to-analog converter (DAC) system includes a DAC and a current trimming module. The DAC includes a plurality of segments and a plurality of drivers. Each of the plurality of segments receives driver signals from a respective one of the plurality of drivers, receives segment currents from a respective one of a plurality of segment current sources, and generates an output current based on the driver signals and the segment currents. The current trimming module stores a plurality of trim coefficients and adjusts respective threshold voltages associated with the plurality of segment current sources based on the plurality of trim coefficients.
    Type: Grant
    Filed: February 11, 2015
    Date of Patent: September 15, 2015
    Assignee: MAXIM INTEGRATED PRODUCTS, INC.
    Inventors: Jerzy Antoni Teterwak, Joseph Lutsky
  • Publication number: 20150244390
    Abstract: A digital-to-analog converter (DAC) system includes a DAC and a current trimming module. The DAC includes a plurality of segments and a plurality of drivers. Each of the plurality of segments receives driver signals from a respective one of the plurality of drivers, receives segment currents from a respective one of a plurality of segment current sources, and generates an output current based on the driver signals and the segment currents. The current trimming module stores a plurality of trim coefficients and adjusts respective threshold voltages associated with the plurality of segment current sources based on the plurality of trim coefficients.
    Type: Application
    Filed: February 11, 2015
    Publication date: August 27, 2015
    Inventors: Jerzy Antoni TETERWAK, Joseph Lutsky