Abstract: A high power RF resistor for use, for example, as an isolation resistor in an RF hybrid splitter/combiner is formed on a thermally conductive substrate. A first insulating beryllia (BeO) layer extends over the substrate and has a top surface and a bottom surface. A first metallization layer extends over the top surface of the first insulating layer and includes a longitudinally-extending gap. A second insulating BeO layer is positioned above the first insulating layer and includes a top surface, a bottom surface and first and second side surfaces. A second metallization layer surrounds the bottom surface and the first and second side surfaces of the second insulating layer and has a longitudinally-extending gap, the gap in the second metallization layer positioned to be in alignment with the gap in the first metallization layer. This structure forms a Faraday shield between the resistive layer and ground to thereby reduce the I.sup.