Abstract: A system is provided for trimming excess vinyl film from a hoop assembly. The hoop assembly may be used to manufacture semiconductor workpieces. The system uses a pressure applying member applied to the excess film with a bearing surface sufficient to receive such pressure on the opposite side of the excess film. The system may be rotated such that the film is trimmed around the entire hoop assembly at the position of the pressure applying member. The bearing surface may be part of the support for the system or incorporated into the hoops.

Abstract: A system for handling semiconductor and electronic elements secured to an adhesive surface is provided. According to one aspect of the invention, a vacuum is applied through holes in a loading base. Under the influence of the vacuum, the adhesive film is pulled down toward the loading base and stretched around a pick rod so that the adhesive film is peeled away from the element. Thus, adhesive contact between the film and the element is reduced and a vacuum pick or collet is able to lift the element from the adhesive film with minimal force applied to the surface of the element.

Abstract: An apparatus and process for retaining laser bars during a facet coating operation and releasing the bars after the conclusion of the facet coating operation. A multitude of spacers are positioned with laser bars therebetween. Each spacer includes an upper and lower fixture blade. The spacers are compressed together, thus sandwiching the laser bars, during the facet coating operation. After release of the compressive force, adhered laser bars are removed by moving one of the fixture blades relative to the other fixture blade. Movement can be along the longitudinal axis of the blades, perpendicular to the longitudinal axis, or rotation about a pivot axis. Further, movement can include elevation of one blade, or an end of one blade, relative to the other blade.