Abstract: A vacuum or hermetic packaged micromachined or MEMS device and methods for manufacturing the device so that the device has at least one substantially vertical feedthrough are provided. In a first embodiment, the method includes: providing a MEMS device fabricated on a first side of a substrate and located within a vacuum or hermetic cavity; forming at least one hole completely through the substrate between first and second sides of the substrate after the step of providing; and forming a path of electrically conductive material connecting the MEMS device and the second side of the substrate through the at least one hole to form the at least one substantially vertical feedthrough.

Abstract: A multi-substrate, microsystem package and a method for assembling same including a high-density flexible connector array are disclosed for use in compact and multi-substrate packages containing circuits, sensors, and actuators in a re-workable and modular approach. The package is designed as a cube with highly flexible connectors providing electrical and fluidic connections between the substrates. The cables are integrated in the inside walls of the cube and make pressure contacts to the pads on stacked substrates. The cables are designed to be flexible and capable of being manipulated so that individual dice can be inserted to populate the cube. Several material candidates for the cables, including polymers such as Parylene, and metal such as gold, are provided.

Abstract: A vacuum or hermetic packaged micromachined or MEMS device and methods for manufacturing the device so that the device has at least one substantially vertical feedthrough are provided. In a first embodiment, the method includes: providing a MEMS device fabricated on a first side of a substrate and located within a vacuum or hermetic cavity; forming at least one hole completely through the substrate between first and second sides of the substrate after the step of providing; and forming a path of electrically conductive material connecting the MEMS device and the second side of the substrate through the at least one hole to form the at least one substantially vertical feedthrough.

Abstract: A fuel injector has a silicon micromachined nozzle plate which coacts with a fuel flow valve to control fuel flow out of the fuel injector.

Abstract: A valve assembly for controlling fluid flow includes a valve plate and a nozzle plate which are not attached to each other but can be moved into and out of contact with each other. The valve plate has an opening for passing an actuator and fluid. A nozzle plate has an opening for passing fluid and the opening is aligned with a mesa on the valve plate which can seal the nozzle orifice. The actuator separates the nozzle plate from the valve plate to permit fluid flow and a spring means brings the nozzle plate into a closed position against the valve plate to stop fluid flow.

Abstract: A silicon valve for controlling the flow of a fluid includes two generally planar silicon members. One has an orifice for passing the fluid and the other has a relatively moveable surface to selectively open and close the orifice thereby controlling the flow of fluid through the orifice.

Abstract: A spark plug for providing an ignition spark has a center electrode. At least a portion of the center electrode contains an alloy material from an alloy family of M-CrAlY wherein M is nickel, cobalt, iron or a combination of these elements and Cr is chromium, Al is aluminum, Y is an element from the group yttrium, zirconium, hafnium or titanium.

Abstract: A silicon valve for controlling the flow of a fluid includes two generally planar silicon members. One has an orifice for passing the fluid and the other has a relatively moveable surface to selectively open and close the orifice thereby controlling the flow of fluid through the orifice.

Abstract: A silicon valve for controlling the flow of a fluid includes two generally planar silicon members. One has an orifice for passing the fluid and the other has a relatively moveable surface to selectively open and close the orifice thereby controlling the flow of fluid through the orifice. A method is disclosed which method addresses the fabrication of the aforementioned silicon valve, wherein an oxide is grown on the surface of a wafer and the wafer then is etched to define a valve seat pattern. Both a top and a bottom plate are fabricated from wafer material and the profiled wafers are bonded together in a manner which will allow fluid passage therethrough.

Abstract: A flame monitor for a burner comprises an oscillator which generates a signal at a characteristic frequency, a flame modulator connected to the oscillator and the burner for modulating the flame which produces an electromagnetic signal at the same frequency and a signal detector for detecting the electromagnetic signal. A bandpass filter is connected to the detector for passing only the signal at the characteristic frequency. Circuitry is provided for detecting the intensity of the electromagnetic signal which is proportional to the flame temperature and which can be used to control the fuel or air supplied to the burner and thus optimize the flame. A single detector can be used to detect the flame from various burners where each burner is supplied with its own characteristic frequency and the detector is multiplexed to share its operation over the various burners.

Abstract: A method for manufacturing variable capacitance pressure transducers and an intermediate article of manufacture produced in the practice of this method. In the method, a wafer of doped silicion or other semiconductor material has portions of the semiconductor material removed from spaced areas to form a plurality of recesses in the surface of the semiconductor material. The material is doped to enhance its electrical conductivity. A dielectric material has one of its surfaces coated with spaced areas of electrically conductive material. The semiconductor material is attached to the coated surface of the dielectric material such that the surface recesses in the semiconductor material are in alignment with the conductive areas on the dielectric material. This produces a plurality of electrical capacitors suitable for use as pressure transducers.

Abstract: A capacitive pressure transducer assembly having a semiconductor transducer device, a substrate, and a cover for use in conducting a fluid pressure to be sensed to the exterior surfaces of the transducer device. The transducer device may have a glass, silicon or other nonconductive material as a base on which a metal capacitor plate is formed. The other capacitor plate may be formed of doped silicon or other semiconductor material. Also, the substrate on which the transducer device is mounted may have additional and related circuitry implemented in thick film technology (ceramic substrate) or integrated circuit technology (semiconductor substrate).

Abstract: A method for manufacturing variable capacitance pressure transducers and an intermediate article of manufacture produced in the practice of this method. In the method, a wafer or doped silicon or other semiconductor material has portions of the semiconductor material removed from spaced areas to form a plurality of recesses in the surface of the semiconductor material. The material is doped to enhance its electrical conductivity. A dielectric material has one of its surfaces coated with spaces areas of electrically conductive material. The semiconductor material is attached to the coated surface of the dielectric material such that the surface recesses in the semiconductor material are in alignment with the conductive areas on the dielectric material. This produces a plurality of electrical capacitors suitable for use as pressure transducers.