Abstract: A system for updating a location of a target with an RFID device in response to detected motion of the target includes a server and tracking modules. The server stores identifying information for RFID devices and locations associated with the devices. The tracking modules are positioned in predetermined locations and communicate with the server. Each tracking module includes a motion processing module and an RFID reader. In response to motion detected by a motion processing module, the RFID reader detects identifying information for an RFID device neighboring an RFID reader and transmits the information to the server.

Abstract: A lock control system includes a detection unit positioned proximate to a lock, an RFID device neighboring at least one RFID antenna, and an RFID reading system detecting identifying information of the RFID device when the detection unit detects an event. The system also includes at least one microcontroller that determines, based on the identifying information, whether to grant the RFID device access to an area secured by the lock and instructs an actuator to unlock the lock when the RFID device is granted access.

Abstract: An image management system and method of controlling an camera using a mobile computing device is described. The system includes a mobile computing device and an image taking system connected to a server. The image taking system includes a camera oriented towards distinguishing mark; and a control unit in communication with the mobile computing device such that the control unit transfers the control functions of the camera to the mobile computing device such that the mobile computing devices operates the camera to capture an image. The method includes establishing, by a mobile communication unit, an image capturing session with an image capturing system, the image capturing system having a control unit; transmitting, by the control unit, to the mobile computing device control functions for controlling operation of a camera; capturing, by the camera, an image in response to operation by the mobile communication unit; and creating, by the image capturing system, a media file.

Abstract: A system and method for managing media is described herein. The system includes a camera oriented towards a visually distinguishing mark, at least one actuation device that generates an instruction for at least one of the camera and an RFID reading system, and a central control unit in communication with the camera and the RFID reading system. In response to an instruction from the at least one actuation device, the RFID reading system detects an RFID device neighboring the visually distinguishing mark and transmits a first identifying information of the detected RFID device to the central control unit. The central control unit receives an image captured by the camera, creates a media file including the captured image and the received first identifying information, and transmits the media file to a server.

Abstract: A media management system and method of selecting at least one of a plurality of cameras is described. The system includes a plurality of image-taking systems, each one including a camera having a plurality of control functions; and a camera control unit for controlling operation of the camera. The control unit includes a communication unit for communicating with the plurality of image-taking systems and a mobile communication device, the communication unit establishing an image capturing session with the mobile communication device in response to an initiation by the mobile communication device; and a processor that uses a location of the mobile communication device to select at least one image-taking system from the plurality of image-taking systems. The control unit transfers at least one of the plurality of control functions to the mobile communication device, and the mobile communication device operates the camera to capture at least one image.

Abstract: Embodiments of the present invention address kT/C noise, sampled high frequency operational amplifier noise, and charge injection errors sampled on switching capacitors and introduced due to internal switching. Correlated double sampling compensates for DC offset and low frequency operational amplifier noise, and the use of fake integration and a capacitor divider eliminate or significantly reduce kT/C noise, sampled high frequency operational amplifier noise, and charge injection errors.

Abstract: Methods and apparatus for improved current-to-voltage integrators reducing charge injection and kT/C errors from capacitor switching and intrinsic operational amplifier noise (i.e., offset, 1/f noise, thermal noise) during the reset cycle of the integrator, simultaneously reducing demands on the reference voltage source, using correlated double sampling to compensate for DC offset and low frequency op-amp noises, and “fake” integration and a capacitor divider to eliminate or significantly reduce kT/C noise and charge injection.

Abstract: Methods and apparatus for the conversion of analog signals into digital signals using second order or higher sigma-delta modulators in pipelined or cyclic architectures.

Abstract: Methods of electroless plating metal on a dielectric material includes dipping the dielectric in a solution containing attractive catalytic metal particles and a metal salt solution. A thicker metallic layer can be deposited on top of the resulting layer by electroplating. Electrical circuits and multichip modules including such circuits can be formed having one or more dielectric layers comprised of latex and one or more layers of conductive leads, one or more dielectric layers comprised of a flexible dielectric material, and one or more layers of electrically conductive material patterned to interconnect such ICs. Frames that hold ICs against a substrate may be employed to planarize their top surfaces against the substrate, as well as standard photolithographic techniques in creating conductive paths on the dielectric material between the ICs.

Abstract: Methods and apparatus for signal transmission utilizing directly modulated frequency shift keying. Embodiments of the present invention provide a fractional (non-integer) N oscillator to directly modulate a baseband signal for transmission using a programmable digital raised cosine generator, providing a tunable Gaussian FSK transmitter.

Abstract: Methods and apparatus for the conversion of analog signals into digital signals using second order or higher sigma-delta modulators in pipelined or cyclic architectures.

Abstract: Methods and apparatus for multichip modules having improved shielding and isolation properties.

Abstract: A direct conversion RF transceiver (2) and ASIC having an on-chip voltage controlled oscillator operating frequency that is half of the transmitter (4) and/or receiver (6) operating frequency, the VCO (20) being comprised of a plurality of synchronized LC oscillators (92A-D) introducing precise phase shifts that eliminate frequency ambiguity. The transceiver incorporates several low power circuits, including on-chip a power converter switchably coupling a capacitor (42) to a power supply (45) and to an electrical load (40), multiple switchable low dropout regulators (60A, B) each coupled to alternate power supplies (62,64) and having electrical components (67A, B) for setting the bandwidth of the respective low dropout regulator. The transceiver also includes a FSK digital modulator utilizing a circuit-implemented polynomial piecewise approximation (71) of a raised cosine signal.

Abstract: Method of forming a ferromagnetic layer on at least one surface of a dielectric material that may be serve as an inductive core on a printed circuit board or a multichip module. Conductive leads can form two separate coils around the core to form a transformer, and a planar conducing sheet can be placed on or between one or more of the dielectric layers as magnetic shielding. The core can be formed at least in part by electroless plating, and electroplating can be used to add a thicker layer of less conductive ferromagnetic material. Ferromagnetic layers are formed by dipping the dielectric surface in a solution containing catalytic metal particles having a slight dipole, and placing the surface in a metal salt to cause a layer containing metal to be electrolessly plated upon the dielectric. Surface roughening techniques can be used before the dipping to help attract the catalytic particles.

Abstract: Methods of electroless plating metal on a dielectric material includes dipping the dielectric in a solution containing attractive catalytic metal particles and a metal salt solution. A thicker metallic layer can be deposited on top of the resulting layer by electroplating. Electrical circuits and multichip modules including such circuits can be formed having one or more dielectric layers comprised of latex and one or more layers of conductive leads, one or more dielectric layers comprised of a flexible dielectric material, and one or more layers of electrically conductive material patterned to interconnect such ICs. Frames that hold ICs against a substrate may be employed to planarize their top surfaces against the substrate, as well as standard photolithographic techniques in creating conductive paths on the dielectric material between the ICs.

Abstract: An electrical circuit having one or more dielectric layers formed of latex; and one or more layers of electrically conductive material, such as copper, patterned to form multiple electrical interconnects, with each such layer placed on top of one of said dielectric layers. The dielectric and conductive layers can be used to connect multiple chips in a multichip module. The latex layers can be formed to have a top surface that contains peaks and valleys, and the conductive layers can be formed of a first metal that substantially fills such valleys, so as to increase the adherence of the metal to the latex surface. The layers of conductive metal can contain particles of a second metal between said peaks and valleys of the latex layer that were used as a catalytic seed particles to promote the deposition of the metal layer onto the top surface of the latex.

Abstract: A printed circuit board has two layers of printed circuit board dielectric material; a core made of ferromagnetic material between the two layers; and conductive leads on the opposite side of each dielectric layer from the core connected by via holes through both dielectric layers to form a conducting coil around the core. The conductive leads can form two separate coils around the core to form a transformer. A planar conducing sheet can be placed on or between one or more of the printed circuit board's dielectric layers to shield other circuitry on the printed circuit board from magnetic fields generated around the core. The core can be formed at least in part by electroless plating. Electroplating can be used to add a thicker layer of less conductive ferromagnetic material.

Abstract: A printed circuit board has two layers of printed circuit board dielectric material; a core made of ferromagnetic material between the two layers; and conductive leads on the opposite side of each dielectric layer from the core connected by via holes through both dielectric layers to form a conducting coil around the core. The conductive leads can form two separate coils around the core to form a transformer. A planar conducing sheet can be placed on or between one or more of the printed circuit board's dielectric layers to shield other circuitry on the printed circuit board from magnetic fields generated around the core. The core can be formed at least in part by electroless plating. Electroplating can be used to add a thicker layer of less conductive ferromagnetic material.

Abstract: A method for plating metal on a dielectric material includes dipping the dielectric in a solution containing catalytic metal particles. These particles have a dipole which helps them attach to the dielectric's surface. The dielectric's surface can be roughened to make it more attractive to such particles. The dielectric material is then placed in a metal salt solution that causes metal to be plated upon the dielectric by electroless plating. A thicker metallic layer can be deposited on top of the resulting layer by electroplating. This or other methods can be used to make an electrical circuit having one or more dielectric layers comprised of latex and one or more layers of conductive leads. A multichip module can be made which includes a plurality of integrated circuits mounted on a substrate; one or more dielectric layers comprised of a flexible dielectric material; and one or more layers of electrically conductive material patterned to interconnect such ICs.

Abstract: A self contained data medium is provided with an apparatus for generating a decrypting key for decrypting stored data. Frames of encrypted data are stored on the data medium such as a video or audio disk. Each frame of data includes a header which has a frame identification number. A reader reads each frame of data including the header with the frame identification number. The reader transmits the frame number to a transponder attached to the data medium. The transponder includes a decryption engine which calculates a decryption key from the frame number and a secret deciphering key stored in the transponder. The transponder transmits the decryption key to the reader which uses the decryption key to decrypt the frame of data. The system discourages both home copying and commercial piracy of the underlying program material.