Abstract: Various embodiments of the present invention are directed to wire-drawing die assemblies. In one embodiment, a wire-drawing die assembly includes an assembly of at least three die segments. Each of the die segments includes an inner die surface comprising a superhard material. The inner die surfaces of the die segments form a die cavity. In another embodiment, a wire-drawing die assembly includes an assembly of die segments, each of which includes an inner die surface. The inner die surfaces of the die segments form a die cavity. Each of the die segments further includes two sidewalls, with the inner die surface extending between the two sidewalls. At least a portion of each of the two sidewalls may be oriented nonparallel relative to a wire-drawing axis of the die cavity.