Patents by Inventor Joseph M. Yurko

Joseph M. Yurko has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Device for increased thermal conductivity between a printed wiring assembly and a chassis
    Patent number: 7349221
    Abstract: A floating guide device provides increased thermal conductivity between a printed wiring assembly and a heat sink chassis. The guide device includes an elongated thermally conductive rod and a wedgelock used in conjunction with the rod that can be attached to the rod. The guide device can be used in an electronic assembly comprising a chassis having at least one slot, and at least one printed wiring assembly with a printed wiring board disposed in the slot. At least one integrated circuit package is electrically attached to the printed wiring board. The printed wiring board provides a thermal path to the chassis. The guide device provides one or more additional thermal paths between the printed wiring board and the chassis.
    Type: Grant
    Filed: July 20, 2006
    Date of Patent: March 25, 2008
    Assignee: Honeywell International Inc.
    Inventor: Joseph M. Yurko
  • DEVICE FOR INCREASED THERMAL CONDUCTIVITY BETWEEN A PRINTED WIRING ASSEMBLY AND A CHASSIS
    Publication number: 20080019102
    Abstract: A floating guide device provides increased thermal conductivity between a printed wiring assembly and a heat sink chassis. The guide device includes an elongated thermally conductive rod and a wedgelock used in conjunction with the rod that can be attached to the rod. The guide device can be used in an electronic assembly comprising a chassis having at least one slot, and at least one printed wiring assembly with a printed wiring board disposed in the slot. At least one integrated circuit package is electrically attached to the printed wiring board. The printed wiring board provides a thermal path to the chassis. The guide device provides one or more additional thermal paths between the printed wiring board and the chassis.
    Type: Application
    Filed: July 20, 2006
    Publication date: January 24, 2008
    Applicant: Honeywell International Inc.
    Inventor: Joseph M. Yurko