Patents by Inventor Joseph Macabante Juane

Joseph Macabante Juane has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multi-socket board for open/short tester
    Patent number: 6891384
    Abstract: An interface structure includes first and second portions. The first portion has physical dimensions that are compatible with the docking area of an associated device tester, and includes a first socket configured to receive a first BGA package. The second portion, which is adjacent to and contiguous with the first portion, extends laterally beyond the docking area of the device tester to provide additional testing area that may include one or more additional sockets. In one embodiment, the second portion includes a second socket configured to receive a second BGA package, wherein the second size and configuration of second BGA package are different from the size and configuration of the first BGA package.
    Type: Grant
    Filed: June 25, 2002
    Date of Patent: May 10, 2005
    Assignee: Xilinx, Inc.
    Inventors: Mohsen Hossein Mardi, Joseph Macabante Juane
  • MULTI-SOCKET BOARD FOR OPEN/SHORT TESTER
    Publication number: 20040017216
    Abstract: An interface structure includes first and second portions. The first portion has physical dimensions that are compatible with the docking area of an associated device tester, and includes a first socket configured to receive a first BGA package. The second portion, which is adjacent to and contiguous with the first portion, extends laterally beyond the docking area of the device tester to provide additional testing area that may include one or more additional sockets. In one embodiment, the second portion includes a second socket configured to receive a second BGA package, wherein the second size and configuration of second BGA package are different from the size and configuration of the first BGA package.
    Type: Application
    Filed: June 25, 2002
    Publication date: January 29, 2004
    Applicant: Xilinx, Inc.
    Inventors: Mohsen Hossein Mardi, Joseph Macabante Juane