Abstract: An automated, interchangeable vehicle grill includes a plurality of reversible motors, each mounted near an existing grill opening on the front end of a vehicle. Each motor rotates a drive shaft having a grill block mounted thereon. The grill block includes two adjacent sides, each having a unique, discrete grill configuration. For example, a first side is configured to resemble a standard, factory-installed grill, while a second side is configured to resemble a billet or other non-standard, aftermarket grill. Accordingly, a user can automatically switch between two different grill configurations by simply operating a switch within the passenger compartment.

Abstract: A cable puller has a pair of shoulder bars connected to each other at one end thereof, each of the shoulder bars having a hook at the other end for releasably accommodating a plurality of wires or cables thereon; and a support bar with two ends respectively and symmetrically connected to respective intermediate points of the shoulder bats. The shoulder and support bars are arranged to provide a shoulder width wider than a depth of an enclosed space to pull the cable therethrough and narrower than a pre-determined pathway in the enclosed space the cables are designed to be pulled therealong.

Abstract: A cable puller has a pair of shoulder bars connected to each other at one end thereof, each of the shoulder bars having a hook at the other end for releasably accommodating a plurality of wires or cables thereon; and a support bar with two ends respectively and symmetrically connected to respective intermediate points of the shoulder bats. The shoulder and support bars are arranged to provide a shoulder width wider than a depth of an enclosed space to pull the cable therethrough and narrower than a pre-determined pathway in the enclosed space the cables are designed to be pulled therealong.

Abstract: An optimal routing methodology for routing high I/O density packages which minimizes the number of PCB layers required. One feature of this routing methodology comprises treating respective I/O that are routed at the top layer of the package as surface mount technology (SMT) pads without dropping vias within the BGA grid, as is commonplace in the industry. This facilitates the use of fewer escapes and allows for more efficient use of the available space. Signal lines on the top layer of the package which must be routed to other layers of the PCB are connected to vias outside of the area of local high signal density on the printed circuit board. The placement of vias outside the area of local high density, i.e., in a depopulated area, reduces the number of layers necessary in the PCB to properly route the signals. This placement also facilitates the use of filtering capacitors to meet EMI requirements. In addition, all voltage pins are placed on the innermost or outermost grids and have clearanced vias.