Patents by Inventor Joseph Marco Longo

Joseph Marco Longo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Stacked redistribution layer (RDL) die assembly package
    Patent number: 7825520
    Abstract: A stacked redistribution layer (RDL) die assembly package includes a substrate, a first level RDL die assembly mounted to the substrate and a second level RDL die assembly mounted to the first level RDL die assembly. The first level RDL die assembly includes a first die comprising bond pads, a first fan out support extending outwardly from sides of the first die, and first traces electrically connected to the bond pads, the first traces being supported by the first fan out support. Similarly, the second level RDL die assembly includes a second die comprising bond pads, a second fan out support extending outwardly from sides of the second die, and second traces electrically connected to the bond pads of the second die, the second traces being supported by the second fan out support.
    Type: Grant
    Filed: May 5, 2009
    Date of Patent: November 2, 2010
    Assignee: Amkor Technology, Inc.
    Inventors: Joseph Marco Longo, Christopher M. Scanlan
  • Stacked redistribution layer (RDL) die assembly package
    Patent number: 7550857
    Abstract: A stacked redistribution layer (RDL) die assembly package includes a substrate, a first level RDL die assembly mounted to the substrate and a second level RDL die assembly mounted to the first level RDL die assembly. The first level RDL die assembly includes a first die comprising bond pads, a first fan out support extending outwardly from sides of the first die, and first traces electrically connected to the bond pads, the first traces being supported by the first fan out support. Similarly, the second level RDL die assembly includes a second die comprising bond pads, a second fan out support extending outwardly from sides of the second die, and second traces electrically connected to the bond pads of the second die, the second traces being supported by the second fan out support.
    Type: Grant
    Filed: November 16, 2006
    Date of Patent: June 23, 2009
    Assignee: Amkor Technology, Inc.
    Inventors: Joseph Marco Longo, Christopher M. Scanlan