Abstract: An improved cooling system and method provides isothermal cooling to large arrays of hard disk drives through the use of a pumped refrigerant loop. The present invention relates to cooling electronic components, using a system and method for controlling the cooling of variable heat loads in heat generating devices. This invention allows for the cooling of variable heat loads in electrical, electronic and optical components by pumped two phase loops without the high pumping rates required by single phase pumped loops sized to handle the same loads. Also, when compared to heat pipes, dry out is avoided by using this method which will protect the components from damage due to excess heat.

Abstract: The present invention offers an improvement over prior art cooling systems by accounting for rapid changes in thermal load. The circulation rate of refrigerant in a cooling cycle is set so that the two phase mixture exiting the cold plate evaporator device stays within a saturation dome of all mixtures between a saturated liquid and a saturated vapor. Furthermore, the two phase mixture exiting the cold plate evaporator device is allowed to move within the saturation dome so that the exit quality of the two phase mixture leaving the cold plate evaporator device changes with the heat load being removed. In this way, rapid changes in heat load are removed from the component or components in contact with the cold plate evaporator device without having to change the circulation rate of refrigerant in the cycle. Only the exit quality of the vapor leaving the cold plate/evaporator changes.

Abstract: A cooling system for transferring heat from a heat load to an environment has a volatile working fluid. The cooling system includes first and second cooling cycles that are thermally connected to the first cooling cycle. The first cooling cycle is not a vapor compression cycle and includes a pump, an air-to-fluid heat exchanger, and a fluid-to-fluid heat exchanger. The second cooling cycle can include a chilled water system, or a vapor compression system, for transferring heat from the fluid-to-fluid heat exchanger to the environment. The pump circulates the vaporizable refrigerant to the evaporator device associated with the air stream within the rack or enclosure. The heated air causes the refrigerant to evaporate within the evaporator device. This evaporated refrigerant travels to a condenser device cooled by another thermally cooler fluid, causing the refrigerant to condense back to a liquid, return to the pump, and begin the cycle again.

Abstract: An improved cooling system provides cooling away from the surface of electrical and electronic components, by providing an available heat transfer surface area many times greater than that of a convoluted fin structure. The component to be cooled is in thermal contact with a cold plate evaporator device, and a graphite material is associated with the cold plate device. Refrigerant is circulated through the graphite material and the cold plate evaporator device, and the liquid refrigerant is at least partially evaporated by the heat generated by the component. Due to the open nature of the graphite material, the permeability of liquids and vapors is high, allowing for low pressure loss while still maintaining sufficient two phase flow to carry heat away from the electronics.

Abstract: An improved cooling system provides cooling away from the surface of electrical and electronic components with very low parasitic power consumption and very high heat transfer rates. The component to be cooled is in thermal contact with a cold plate evaporator device. Refrigerant is circulated by a liquid refrigerant pump to the cold plate evaporator device, and the liquid refrigerant is at least partially evaporated by the heat generated by the component. The vapor is condensed by a conventional condenser coil and the condensed liquid along with any unevaporated liquid is returned to the pump. The system operates nearly isothermally in both evaporation and condensation.

Abstract: An improved cooling system provides cooling away from the surface of electrical and electronic components with very low parasitic power consumption and very high heat transfer rates. The component to be cooled is in thermal contact with a cold plate evaporator device. Refrigerant is circulated by a liquid refrigerant pump to the cold plate evaporator device, and the liquid refrigerant is at least partially evaporated by the heat generated by the component. The vapor is condensed by a conventional condenser coil and the condensed liquid along with any unevaporated liquid is returned to the pump. The system operates nearly isothermally in both evaporation and condensation.

Abstract: An improved cooling system provides cooling away from the surface of electrical and electronic components with very low parasitic power consumption and very high heat transfer rates. The component to be cooled is in thermal contact with a cold plate evaporator device. Refrigerant is circulated by a liquid refrigerant pump to the cold plate evaporator device, and the liquid refrigerant is at least partially evaporated by the heat generated by the component. The vapor is condensed by a conventional condenser coil and the condensed liquid along with any unevaporated liquid is returned to the pump. The system operates nearly isothermally in both evaporation and condensation.

Abstract: An improved cooling system provides cooling away from the surface of electrical and electronic components with very low parasitic power consumption and very high heat transfer rates. The component to be cooled is in thermal contact with a cold plate evaporator device. Refrigerant is circulated by a liquid refrigerant pump to the cold plate evaporator device, and the liquid refrigerant is at least partially evaporated by the heat generated by the component. The vapor is condensed by a conventional condenser coil and the condensed liquid along with any unevaporated liquid is returned to the pump. The system operates nearly isothermally in both evaporation and condensation.

Abstract: An improved cold plate cooling system provides cooling away from the surface of electrical and electronic components with very low parasitic power consumption and very high heat transfer rates. The component to be cooled is in thermal contact with a cold plate. A fin material is inserted in the cold plate and refrigerant is circulated through the fin, allowing the cold plate and fin to transfer heat from the electrical or electronic components, as the liquid refrigerant is at least partially evaporated by the heat generated by the components.

Abstract: A fuel fill pipe assembly for promoting less turbulent flow in a fuel pipe is disclosed. The assembly includes a pipe extending between a first end and a second end and at least one vane positioned on the pipe for urging the formation of at least a partial vortex within fuel that traverses through the pipe.

Abstract: An improved cold plate cooling system provides cooling away from the surface of electrical and electronic components with very low parasitic power consumption and very high heat transfer rates. The component to be cooled is in thermal contact with a cold plate. A fin material is inserted in the cold plate and refrigerant is circulated through the fin, allowing the cold plate and fin to transfer heat from the electrical or electronic components, as the liquid refrigerant is at least partially evaporated by the heat generated by the components.

Abstract: An improved cooling system provides cooling away from the surface of electrical and electronic components with very low parasitic power consumption and very high heat transfer rates. The component to be cooled is in thermal contact with a cold plate evaporator device. Refrigerant is circulated by a liquid refrigerant pump to the cold plate evaporator device, and the liquid refrigerant is at least partially evaporated by the heat generated by the component. The vapor is condensed by a conventional condenser coil and the condensed liquid along with any unevaporated liquid is returned to the pump. The system operates nearly isothermally in both evaporation and condensation.

Abstract: Numerous embodiments and related methods for generator-absorber heat exchange (GAX) are disclosed, particularly for absorption heat pump systems. Such embodiments and related methods use the working solution of the absorption system for the heat transfer medium.

Abstract: A single-stage desiccant regeneration system for use in an air conditioning system, the regeneration system comprising a falling film heat exchanger for transferring heat from concentrated desiccant to dilute desiccant, a boiler for regenerating dilute desiccant, piping for flowing dilute desiccant from the air conditioning system upward through the heat exchanger, and a flow path for directing concentrated desiccant from the boiler through the heat exchanger and to the air conditioning system.

Abstract: A liquid desiccant regeneration system for use with a dehumidifying apparatus, the system comprising a water reducer for removing water from diluted desiccant, and a sump for holding concentrated desiccant, first and second bodies movable in the sump, a first of the bodies being operable to energize the water reducer when the desiccant in the sump reaches a selected high water content level, and a second of the bodies being operable to stop operation of the water reducer when the desiccant in the sump reaches a selected low water content level, whereby to maintain the water content of the desiccant in the sump between selected high and low levels.

Abstract: Apparatus for controlling a heating or cooling system of the type that includes an evaporator and a thermostatic expansion valve having a thermostatic bulb. The control apparatus comprises a thermoelectric heat pump device responsive to an electrical control signal for controlling transfer of thermal energy to and from the thermostatic bulb, at least one temperature sensing device associated with the heating or cooling system, and an electronic control circuit. The control circuit is responsive to the sensed temperature to provide the electrical control signal to the thermoelectric device for maintaining a desired operating condition of the evaporator. The thermoelectric device acts as a gate or heat pump for controlling flow of thermal energy to and from the thermostatic bulb with a relatively small amount of electrical energy input.