Patents by Inventor Joseph Michael D'Sa

Joseph Michael D'Sa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8639341
    Abstract: Hermetically sealed assemblies, for example, that include IC chips, are configured for incorporation within a connector terminal of an implantable medical electrical lead, preferably within a contact member of the terminal. An assembly may include two feedthrough subassemblies, welded to either end of the contact member, to form an hermetic capsule, in which an IC chip is enclosed, and a tubular member, which allows a lumen to extend therethrough, along a length of the terminal. A multi-electrode lead may include multiplexer circuitry, preferably a switch matrix element and a communications, control and power supply element that are electrically coupled to the contact member and to another contact member of the terminal. Each pair of switch matrix switches allows for any two of the electrodes to be selected, in order to deliver a stimulation vector, via stimulation pulses from a device/pulse generator, to which the connector terminal is connected.
    Type: Grant
    Filed: August 9, 2013
    Date of Patent: January 28, 2014
    Assignee: Medtronic, Inc.
    Inventors: John Louis Sommer, Joseph Michael D'Sa, Joyce K Yamamoto, Brad C Tischendorf, James D Reinke, Andrew J Thom, Thomas P Miltich, William John Taylor, Kenneth C Gardeski, Larry Earl Tyler, Jeffrey O York, Gordon O Munns
  • Publication number: 20130325086
    Abstract: Hermetically sealed assemblies, for example, that include IC chips, are configured for incorporation within a connector terminal of an implantable medical electrical lead, preferably within a contact member of the terminal. An assembly may include two feedthrough subassemblies, welded to either end of the contact member, to form an hermetic capsule, in which an IC chip is enclosed, and a tubular member, which allows a lumen to extend therethrough, along a length of the terminal. A multi-electrode lead may include multiplexer circuitry, preferably a switch matrix element and a communications, control and power supply element that are electrically coupled to the contact member and to another contact member of the terminal. Each pair of switch matrix switches allows for any two of the electrodes to be selected, in order to deliver a stimulation vector, via stimulation pulses from a device/pulse generator, to which the connector terminal is connected.
    Type: Application
    Filed: August 9, 2013
    Publication date: December 5, 2013
    Applicant: Medtronic, Inc.
    Inventors: John Louis Sommer, Joseph Michael D'Sa, Joyce K. Yamamoto, Brad C. Tischendorf, James D. Reinke, Andrew J. Thom, Thomas P. Miltich, William John Taylor, Kenneth C. Gardeski, Larry Earl Tyler, Jeffrey O. York, Gordon O. Munns
  • Patent number: 8509899
    Abstract: Hermetically sealed assemblies, for example, that include IC chips, are configured for incorporation within a connector terminal of an implantable medical electrical lead, preferably within a contact member of the terminal. An assembly may include two feedthrough subassemblies, welded to either end of the contact member, to form an hermetic capsule, in which an IC chip is enclosed, and a tubular member, which allows a lumen to extend therethrough, along a length of the terminal. A multi-electrode lead may include multiplexer circuitry, preferably a switch matrix element and a communications, control and power supply element that are electrically coupled to the contact member and to another contact member of the terminal. Each pair of switch matrix switches allows for any two of the electrodes to be selected, in order to deliver a stimulation vector, via stimulation pulses from a device/pulse generator, to which the connector terminal is connected.
    Type: Grant
    Filed: January 18, 2011
    Date of Patent: August 13, 2013
    Assignee: Medtronic, Inc.
    Inventors: John Louis Sommer, Joseph Michael D'Sa, Joyce K. Yamamoto, Brad C. Tischendorf, James D. Reinke, Andrew J. Thom, Thomas P. Miltich, William John Taylor, Kenneth C. Gardeski, Larry Earl Tyler, Jeffrey O. York, Gordon O. Munns
  • Publication number: 20120165902
    Abstract: Hermetically sealed assemblies, for example, that include IC chips, are configured for incorporation within a connector terminal of an implantable medical electrical lead, preferably within a contact member of the terminal. An assembly may include two feedthrough subassemblies, welded to either end of the contact member, to form an hermetic capsule, in which an IC chip is enclosed, and a tubular member, which allows a lumen to extend therethrough, along a length of the terminal. A multi-electrode lead may include multiplexer circuitry, preferably a switch matrix element and a communications, control and power supply element that are electrically coupled to the contact member and to another contact member of the terminal. Each pair of switch matrix switches allows for any two of the electrodes to be selected, in order to deliver a stimulation vector, via stimulation pulses from a device/pulse generator, to which the connector terminal is connected.
    Type: Application
    Filed: January 18, 2011
    Publication date: June 28, 2012
    Inventors: John Louis Sommer, Joseph Michael D'Sa, Joyce K. Yamamoto, Brad C. Tischendorf, James D. Reinke, Andrew J. Thom, Thomas P. Miltich, William John Taylor, Kenneth C. Gardeski, Larry Earl Tyler, Jeffrey O. York, Gordon O. Munns