Patents by Inventor Joseph Michael Londa

Joseph Michael Londa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multi-electronic device package
    Patent number: 6101100
    Abstract: An improved multi-electronic device package for accommodating multiple electronic devices such as integrated circuits, memory chips, or the like, is disclosed. The package includes a thermally and electrically conductive plane positioned between a first substrate and a second substrate. A first electronic device is secured to a first surface of the plane within an opening in the first substrate, and a second electronic device is secured to an opposed second surface of the plane within an opening in the second substrate. The electronic device package includes solder balls attached to the second substrate for electrically coupling and physically attaching the electronic device package to a third circuitized substrate, and solder balls attached to the first substrate for electrically coupling and physically attaching the electronic device package to a second electronic device package in a stacked configuration.
    Type: Grant
    Filed: June 11, 1999
    Date of Patent: August 8, 2000
    Assignee: International Business Machines Corporation
    Inventor: Joseph Michael Londa
  • Multi-electronic device package comprising at least two substrates and at least four layers of electrically conductive circuitry
    Patent number: 5963430
    Abstract: An improved multi-electronic device package for accommodating multiple electronic devices such as integrated circuits, memory chips, or the like, is disclosed. The package includes a thermally and electrically conductive plane positioned between a first substrate and a second substrate. A first electronic device is secured to a first surface of the plane within an opening in the first substrate, and a second electronic device is secured to an opposed second surface of the plane within an opening in the second substrate. The electronic device package includes solder balls attached to the second substrate for electrically coupling and physically attaching the electronic device package to a third circuitized substrate, and solder balls attached to the first substrate for electrically coupling and physically attaching the electronic device package to a second electronic device package in a stacked configuration.
    Type: Grant
    Filed: February 3, 1998
    Date of Patent: October 5, 1999
    Assignee: International Business Machines Corporation
    Inventor: Joseph Michael Londa
  • Multi-electronic device package
    Patent number: 5748452
    Abstract: An improved multi-electronic device package for accommodating multiple electronic devices such as integrated circuits, memory chips, or the like, is disclosed. The package includes a first substrate and a second substrate. A first electronic device is encapsulated within an opening of the first substrate, and a second electronic device is encapsulated within an opening in the second substrate. The electronic device package includes solder balls attached to the second substrate for electrically coupling and physically attaching the electronic device package to a third circuitized substrate, and solder balls attached to the first substrate for electrically coupling and physically attaching the electronic device package to a second electronic device package in a stacked configuration.
    Type: Grant
    Filed: July 23, 1996
    Date of Patent: May 5, 1998
    Assignee: International Business Machines Corporation
    Inventor: Joseph Michael Londa